Innovative Approaches in Metal Forming and Joining Technologies

Special Issue Editor


E-Mail Website
Guest Editor
Institute of Science and Innovation in Mechanical and Industrial Engineering (INEGI), 4200-465 Porto, Portugal
Interests: manufacturing; metal forming; joining by plastic deformation
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Metal forming and joining technologies are at the forefront of modern manufacturing, enabling the production of high-performance components for industries such as automotive, aerospace, and energy. With the increasing demand for lightweight, durable, and sustainable structures, innovative approaches are essential to overcoming the challenges associated with processing advanced metals and manufacturing multi-material components.

This Special Issue aims to showcase cutting-edge research on metal forming and joining processes, addressing key challenges such as material formability and joinability, process efficiency, defect mitigation, and performance optimization. We welcome original contributions on experimental and numerical advancements, novel forming and joining techniques, hybrid processes, and the integration of digital and AI-driven approaches. By bringing together insights from academia and industry, this Special Issue seeks to advance our understanding and the application of next-generation manufacturing technologies.

We encourage the submission of innovative approaches in the following research areas:

  • Material characterization;
  • Constitutive modeling;
  • Metal forming;
  • Joining;
  • Hybrid joining;
  • Joint analysis and performance evaluation;
  • Process optimization;
  • Numerical modeling;
  • Tool design;
  • Artificial intelligence for forming and joining;
  • Sustainability and recyclability in forming and joining.

Dr. Mohammad Mehdi Kasaei
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Journal of Manufacturing and Materials Processing is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • material characterization
  • metal forming
  • joining
  • hybrid joining
  • joint design
  • optimization
  • machine learning
  • sustainability

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.

Further information on MDPI's Special Issue policies can be found here.

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Research

12 pages, 7004 KiB  
Article
Bonding Characteristics in Air of a Decomposable Composite Sheet Containing Sn-3.0Ag-0.5Cu Particles for Formation of a Robust Metallic Solder Joint in Die Attachment
by Hye-Min Lee and Jong-Hyun Lee
J. Manuf. Mater. Process. 2025, 9(5), 161; https://doi.org/10.3390/jmmp9050161 - 15 May 2025
Viewed by 103
Abstract
To address solder paste drawbacks, such as die contamination and flux residue, a polymer-based sheet containing Sn-3.0 (wt%) Ag-0.5Cu solder particles as fillers was fabricated, and its bonding characteristics were analyzed. The reductant in the manufactured sheet evaporated while removing the oxide layers [...] Read more.
To address solder paste drawbacks, such as die contamination and flux residue, a polymer-based sheet containing Sn-3.0 (wt%) Ag-0.5Cu solder particles as fillers was fabricated, and its bonding characteristics were analyzed. The reductant in the manufactured sheet evaporated while removing the oxide layers on the solder and copper finish surfaces during heating. Subsequently, the resin component (polymethyl methacrylate) began to decompose thermally and gradually dissipated. Ultimately, the resulting joint formed a solder interconnection with a small amount of residual resin. This joint is expected to exhibit superior thermal conductivity compared with composite joints with a polymer matrix structure. Die-attach tests were conducted in air using the fabricated sheet between Cu finishes. Results showed that joints formed at 300 °C for 30 s and 350 °C for 10 s provided excellent shear strength values of 48.0 and 44.3 MPa, respectively, along with appropriately developed intermetallic compound (IMC) layers at the bonding interface. In contrast, bonding at 350 °C for 60 s resulted in excessive growth of IMC layers at the interface. When comparing size effects of solder particles, type 6 particles exhibited superior shear strength along with a relatively thinner total IMC layer thickness compared to when type 7 particles were used. Full article
(This article belongs to the Special Issue Innovative Approaches in Metal Forming and Joining Technologies)
Show Figures

Figure 1

Back to TopTop