The increasing demand in automotive markets is leading the semiconductor industries to develop high-performance and highly reliable power devices. Silicon carbide MOSFET chips are replacing silicon-based solutions through their improved electric and...
As one of the semiconductor back-end processes, die attach process is the process that attaches an individual non-defective die (or chip) produced from the semiconductor front-end production to the lead frame on a strip. With most other processes of...
Die attach is a typical process that induces thermal stress in the fabrication of microelectromechanical system (MEMS) devices. One solution to this problem is attaching a portion of the die to the package. In such partial die bonding, the lack of co...
Low-temperature die-attaching pastes for wearable electronics are the key components to realize any type of device where components are additively manufactured by pick and place techniques. In this paper, the authors describe a simple method to reali...
We present a novel measurement die for characterizing the flow behavior of gas-containing polymer melts. The die is mounted directly on the injection-molding cylinder in place of the mold cavity and thus enables near-process measurement of viscosity...
This paper presents a new joining method by a forming process for attaching sheets to tube ends. The process consists of two different forming stages carried out sequentially in a single stroke. Firstly, the free tube end is flared by compression wit...
The two-sheet hollow structure of the 1420 Al-Li alloy was prepared by the method of superplastic forming and diffusion bonding. The interface combination status of the diffusion bonding region and the microstructure of the superplastic forming regio...
Endometriosis appears to share certain cancer-related processes, such as cell attachment, invasion, proliferation and neovascularization, some of which can also be found in other healthy tissues. In order to better understand the altered milieu of th...
The semiconductor manufacturing sector has contributed to the advancement of technical development in the sphere of industrial applications, but one crucial factor that cannot be overlooked is the evaluation of a machine’s state. Despite the pr...
We have proposed a low-temperature bonding technology utilizing the sintering of Cu particles with transient liquid-phase of Sn-based solder, called transient liquid-phase sintering (TLPS), as a die-attach solution for high-temperature power modules....
Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached material...
Ag sinter-bonding is the mainstream die-attach technology for SiC power modules; however, organic residues from pastes and binder-containing sheets can degrade the thermal conductivity and reliability of the bond line. In this study, a binder-free po...
Endometriosis is a condition defined as presence of endometrium outside of the uterine cavity. These endometrial cells are able to attach and invade the peritoneum or ovary, thus forming respectively the deep infiltrating endometriosis (DIE) and the...
Electronic packaging can transform the chip to a device for assembly. Soldering and bonding are important procedures in the process of electronic packaging. The continuous development of packaging architecture has driven the emergence of improved sol...
This work presents the design and characterization of a resonant CMOS-MEMS pressure sensor manufactured in a standard 180 nm CMOS industry-compatible technology. The device consists of aluminum square plates attached together by means of tungsten via...
Micromachined resonant accelerometers (MRAs), especially those devices fabricated by silicon on glass technology, suffer from temperature drift error caused by inherent thermal stress. This paper proposes two structure designs to attenuate the effect...
Based on molecular dynamics (MD), in this study, a model was established to simulate the initial coating morphology of silver paste by using a random algorithm, and the effects of different sizes of particles on sintering porosity were also analyzed....
There is currently a large demand for aluminum components to measure the mechanical and thermal loads to which they are subjected. With structural health monitoring, components in planes, vehicles, or bridges can monitor critical loads and potentiall...
Aluminum alloy die casting has achieved rapid development in recent years and has been widely used in all walks of life. However, due to its high pressure and high-speed technological characteristics, avoiding hole defects has become a problem of gre...
Sintered silver (Ag) die-attach has attracted much attention in power systems with high power density and high operating temperature. In this paper, we proposed a novel surface modification method for Ag nanoparticles with organic amines as a coating...
Pastes were prepared using dendritic Cu particles as fillers, and a compression die attachment process was implemented to establish a pure Cu joint using low-cost materials and high-speed sinter bonding. We aimed to grow an oxidation layer on the par...
Fusarium spp. can cause root rot in alfalfa, leading to the death of the whole plant, which seriously affects the yield and quality of alfalfa. This study used a Fusarium acuminatum strain labeled with green fluorescent protein (GFP) to observe the i...
Polymer materials attract more and more interests for a biocompatible package of novel implantable medical devices. Medical implants need to be packaged in a biocompatible way to minimize FBR (Foreign Body Reaction) of the implant. One of the most ad...
The application of wide-bandgap semiconductors in next-generation power modules requires cost-effective Cu particles and a reduced bonding time in the die attachment process to enable efficient industrial-scale manufacturing. Therefore, this study ai...
The evolution of the transient liquid-phase sintered (TLPS) Cu–Sn skeleton microstructure during thermal aging was evaluated to clarify the thermal reliability for die-attach applications. The Cu–Sn skeleton microstructure, which consists...
Sintering of nanosilver paste has been extensively studied as a lead-free die-attach solution for bonding semiconductor power chips, such as the power insulated gated bipolar transistor (IGBT). However, for the traditional method of bonding IGBT chip...
High-moisture extrusion of plant proteins to create meat-like structures is a process that has met with increasing attention in the recent past. In the process, the proteins are thermomechanically stressed in the screw section of the extruder, and th...
An emerging topic is electrical discharge (ED) coating with its application on complex shapes and cavities to repair components or act as functional coatings. Because it is a variant process of an electric discharge machine (EDM) with the ability to...
The high-temperature operating requirements and the issues in the packaging process of wide-bandgap power semiconductors have positioned pressureless sinter-bonding using Ag nanoparticle paste as the most promising die-attach technology. However, und...