Special Issue "Selected Papers from IEEE ICICE 2018"

A special issue of Applied System Innovation (ISSN 2571-5577).

Deadline for manuscript submissions: 31 January 2019

Special Issue Editors

Guest Editor
Prof. Dr. Shoou-Jinn Chang

Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan
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Phone: +886 6 2757575 ext 62391
Fax: +886 6 2761854
Interests: optical and electronic devices; semi-conductive materials; nanotechnology
Guest Editor
Prof. Teen­Hang Meen

Department of Electronic Engineering, National Formosa University, Yunlin 632, Taiwan
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Interests: STEM education; ICT in Education; E-Learning
Guest Editor
Dr. Stephen D. Prior

Aeronautics, Astronautics and Computational Engineering, University of Southampton, Southampton SO17 1BJ, UK
Website | E-Mail
Interests: microsystem design; nanotechnology; applied science

Special Issue Information

Dear Colleagues,

The 2018 IEEE International Conference on Information, Communication and Engineering (IEEE ICICE 2018, http://2018.icice.net) will be held in Xiamen, Fujian, P.R. China, on 28–30 September, 2018. It will provide a unified communication platform for a wide range of topics. This Special Issue on “Selected Papers from IEEE ICICE 2018” is expected to select excellent papers presented at IEEE ICICE 2018 regarding the “Applied System Innovation” topic. Mechanical engineering and design innovations are both academic and practical engineering fields, which involve systematic technological materialization through scientific principles and engineering designs. Technological innovation by mechanical engineering includes IT-based intelligent mechanical systems, mechanics and design innovations, and applied materials in nanosciences and nanotechnology. The main goal of this Special Issue is to discover new scientific knowledge relevant to IT-based intelligent mechanical systems, mechanics and design innovations, and applied materials in nanosciences and nanotechnology. We invite investigators interested in applied system innovation to contribute their original research articles to this Special Issue. Potential topics include, but are not limited to:

  • Intelligent mechanical manufacturing system
  • Mathematical problems on mechanical system design
  • Smart electromechanical system analysis and design
  • Applied materials in nanosciences and nanotechnology
  • Computer-aided methods for mechanical design procedure and manufacture
  • Computer and human–machine interaction
  • Internet Technology on mechanical system innovation
  • Machine diagnostics and reliability
  • Human–machine interaction/virtual reality and entertainment

Schedule:
Manuscript Due: January 31, 2019
First Round of Reviews: March 31, 2019
Second Round of Reviews: April 30, 2019
Acceptance of Final papers and Publication: May 31, 2019

Prof. Dr. Shoou-Jinn Chang
Prof. Dr. Teen­-Hang Meen
Dr. Stephen D. Prior
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied System Innovation is an international peer-reviewed open access quarterly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) is waived for well-prepared manuscripts submitted to this issue. Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Smart electromechanical system analysis and design
  • Intelligent mechanical system
  • Applied materials in nanosciences and nanotechnology

Published Papers (1 paper)

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Research

Open AccessArticle A TAM-Based Study of the Attitude towards Use Intention of Multimedia among School Teachers
Appl. Syst. Innov. 2018, 1(3), 36; https://doi.org/10.3390/asi1030036
Received: 8 July 2018 / Revised: 28 August 2018 / Accepted: 7 September 2018 / Published: 12 September 2018
PDF Full-text (579 KB) | HTML Full-text | XML Full-text
Abstract
Multimedia teaching materials are widely applied in various disciplines. More resources are provided by authorities to encourage elementary school teachers to use them. The resources provide an opportunity for teachers to share teaching resources for students. In this study, the technology acceptance model
[...] Read more.
Multimedia teaching materials are widely applied in various disciplines. More resources are provided by authorities to encourage elementary school teachers to use them. The resources provide an opportunity for teachers to share teaching resources for students. In this study, the technology acceptance model (TAM) was used as the basic model to explore the effects of the information technology (IT) environment on the perceived usefulness, perceived ease of use, and attitude towards using multimedia, and the relevance and influence of these attitudes on behavioral intention. There are 2317 teachers in Chiayi county, and 460 participants were selected by stratified random sampling. The results showed that the ease of use of the multimedia material would enhance the intention to use. The attitude toward use also influences the intention to use. Full article
(This article belongs to the Special Issue Selected Papers from IEEE ICICE 2018)
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