Special Issue "Selected Papers from TIKI ICICE 2018"
A special issue of Materials (ISSN 1996-1944).
Deadline for manuscript submissions: closed (31 March 2019)
The 2018 International Conference on Innovation, Communication, and Engineering (TIKI ICICE 2018, http://2018.icice.asia/) will be held in Hangzhou, Zhejiang Province, P. R. China on November 9–14, 2018; it will provide a unified communication platform for material topics. Scientists from all over the world actively want to discover new advanced materials in electrical and mechanical engineering. In recent years, applications of advanced materials have been in highly developing fields, notably, in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. Therefore, the fields of electrical and mechanical materials have always been popular research areas. The scopes of TIKI ICICE 2018 not only encompass material sizes at the nanoscale, but also in various dimensions, where the onset of size-dependent phenomena usually enables novel applications.
This Special Issue selects excellent papers from TIKI ICICE 2018 and covers the following scopes, including fundamental and advanced materials of electrical and mechanical engineering; their synthesis and engineering; their application in optical sensors, magnetic, acoustic, and thermal transduction; their integration with many elements; the design of electrical or mechanical devices; the evaluation of various performances; and the exploration of their broad applications in industry, environmental control, material analysis, etc. We invite investigators to contribute original research articles, as well as review articles, to this Special Issue.
Potential topics include, but are not limited to, the following:
- Developments of advanced materials for new electrical and optical properties
- Nanomaterials for preparation and applications
- Combinatorial methods of advanced materials for mechanical design and optimization
- Advanced materials for preparation and applications
- Subjects related to electronic thin films and coating technology
- The synthesis engineering of advanced materials
- Advanced materials in mechatronics applications
Manuscript Due: 31 March 2019
First Round of Reviews: 30 April 2019
Second Round of Reviews: 31 May 2019
Acceptance of Final papers and Publication: 30 June 2019
Prof. Dr. Shoou-Jinn Chang
Prof. Dr. Sheng-Joue Young
Dr. Stephen D. Prior
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Advanced materials
- Microelectronic devices
- Optical sensors