Special Issue "Selected Papers from IEEE ICKII 2018"
A special issue of Materials (ISSN 1996-1944).
Deadline for manuscript submissions: closed (31 December 2018) | Viewed by 13870
Special Issue Editors
Interests: IOT devices; photovoltaic devices; STEM education
Special Issues, Collections and Topics in MDPI journals
Interests: fault-tolerant computing; computer and network security; peer-to-peer and grid computing; performance evaluation of distributed systems
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The 1st IEEE International Conference on Knowledge Innovation and Invention 2018 (IEEE ICKII 2018) will be held on Jeju Island, South Korea, 23–27 July, 2018, and it will provide a unified communication platform for researchers on the topics of information technology, innovation design, communication science and engineering, industrial design, creative design, applied mathematics, computer science, electrical and electronic engineering, mechanical and automation engineering, green technology and architecture engineering, material science and other related fields. This Special Issue on “Selected papers from IEEE ICKII 2018” is expected to select excellent papers presented at IEEE ICKII 2018 on the topic of materials. Scientists all over the world actively want to discover new advanced materials in electrical and mechanical engineering. In recent years, the applications of advanced materials have been highly developing fields, in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. Therefore, the fields of electrical and mechanical materials have been the subjects of review. The scopes of IEEE ICKII 2018 are not only encompasses material sizes at the nanoscale, but also in various dimensions where the onset of size dependent phenomena usually enables novel applications. This Special Issue covers the following scopes: Fundamental and advanced materials of electrical and mechanical engineering, their synthesis and engineering, their application on optical sensors, magnetic, acoustic, and thermal transduction, their integration with many elements, designing of electrical or mechanical devices, evaluation various performance and exploring their broad applications in industry, environmental control, material analysis, etc.
We invite investigators to contribute original research articles, as well as review articles, to this Special Issue. Potential topics include, but are not limited to:
- Developments of advanced materials for new electrical and optical properties
- Nanomaterials for preparation and applications
- Combinatorial methods of advanced materials for mechanical design and optimization
- Advanced materials for preparation and applications
- Subjects related to electronic thin films and coating technology
- Synthesis engineering of advanced materials
- Advanced materials in mechatronics applications
Schedule:
Manuscript Due: October 31, 2018
First Round of Reviews: December 31, 2018
Second Round of Reviews: January 31, 2019
Acceptance of Final papers and Publication: March 31, 2019
Prof. Dr. Teen-Hang Meen
Prof. Dr. Wenbing Zhao
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.