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Special Issue "Intelligent System Innovation"
A special issue of Applied Sciences (ISSN 2076-3417).
Deadline for manuscript submissions: 31 December 2019.
Mechanical engineering and design innovations are both academic and practical engineering fields that involve systematic technological materialization through scientific principles and engineering design. Technological innovation by mechanical engineering includes IT-based intelligent mechanical systems, mechanics and design innovations, and applied materials in nanosciences and nanotechnology. These new technologies, which implant intelligence in machine systems, are an interdisciplinary area combining conventional mechanical technology and new information technology.
The main goal of this Special Issue “Intelligent System Innovation” is to discover new scientific knowledge relevant to IT-based intelligent mechanical systems, mechanics and design innovations, and applied materials in nanosciences and nanotechnology. We invite investigators to contribute their original research or review articles to this Special Issue.
In addition, our organized conference “The 2nd IEEE International Conference on Knowledge Innovation and Invention 2019” (IEEE ICKII 2019) will be held in Seoul, South Korea on 12–15 July 2019. The authors of the papers which will be presented at IEEE ICKII 2019 are invited to submit their extended versions to this Special Issue after the conference. Submitted papers should be extended to the size of regular research or review articles, with at least a 50% extension of new results.
Potential topics include, but are not limited to:
- Intelligent mechanical manufacturing systems;
- Mathematical problems in mechanical system design;
- Smart electromechanical system analysis and design;
- Applied materials in nanosciences and nanotechnology;
- Computer-aided methods for mechanical design procedure and manufacture;
- Computer and human–machine interaction;
- Internet technology in mechanical system innovation;
- Machine diagnostics and reliability;
- Human–machine interaction/virtual reality and entertainment
Prof. TeenHang Meen
Prof. Dr. Wenbing Zhao
Prof. Dr. Cheng-Fu Yang
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1500 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Smart electromechanical system analysis and design
- Intelligent mechanical System
- Applied Materials on Nanosciences and Nanotechnology