- Article
Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
- Jonghyeok Kim,
- Sungil Kim,
- Byungjoo Kim,
- Jiyeon Choi and
- Sanghoon Ahn
Selective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume. According to previous studies, when a...