- Review
Organosilicon Compounds in Hot-Melt Adhesive Technologies
- Jakub Czakaj,
- Bogna Sztorch,
- Eliza Romanczuk-Ruszuk,
- Dariusz Brząkalski and
- Robert E. Przekop
Hot-melt adhesives (HMAs) are thermoplastic materials that can bond various substrates by solidifying rapidly upon cooling from the molten state, and their modification with organosilicon compounds can result in crosslinking behavior, characteristic...