- Article
Formation of Nanolaminated Structure with Enhanced Thermal Stability in Copper
- Jianxin Hou,
- Xiuyan Li and
- Ke Lu
Nanolaminated structure with an average boundary spacing of 67 nm has been fabricated in copper by high-rate shear deformation at ambient temperature. The nanolaminated structure with an increased fraction of low angle grain boundaries exhibits a hig...