With the increasing number of inputs and outputs, and the decreasing interconnection spacing, electrical interconnection failures caused by electromigration (EM) have attracted more and more attention. The electromigration reliability and failure mec...
Due to the continuous miniaturization and high current-carrying demands in the field of integrated circuits, as well as the desire to save space and improve computational capabilities, there is a constant drive to reduce the size of integrated circui...
The ongoing trend towards miniaturization and increased packaging density has exacerbated the reliability problem of Au-Al heterogeneous metal bonding structures in high-temperature environments, where extreme temperatures and high current pose a ser...
Electromigration (EM) presents a major reliability challenge in advanced electronic packaging as device scaling and rising power demands lead to higher current densities in solder joints. While eutectic Sn-58Bi solder is widely adopted as a low-tempe...
This paper presents a hybrid modelling approach that combines physics-based electromigration modelling (PEM) and statistical methods to evaluate the electromigration (EM) limits of nano-interconnects in mesh networks. The approach, which is also comp...
The advance of semiconductor technology not only enables integrated circuits with higher density and better performance but also increases their vulnerability to various aging mechanisms which occur from front-end to back-end. Analysis on the impact...
Reliability is a fundamental requirement in microprocessors that guarantees correct execution over their lifetimes. The reliability-related design rules depend on the process technology and device operating conditions. To meet reliability requirement...
New mission-critical applications, such as autonomous vehicles and life-support systems, set a high bar for the reliability of modern microprocessors that operate in highly challenging conditions. However, while cutting-edge integrated circuit (IC) t...
With the technological scaling of metal–oxide–semiconductor field-effect transistors (MOSFETs) and the scarcity of circuit design margins, the characteristics of device reliability have garnered widespread attention. Traditional single-mo...
Electromigration (EM), current-driven atomic diffusion in interconnect metals, critically threatens integrated circuit (IC) reliability via void-induced open circuits and hillock-induced short circuits. This review examines EM’s physical mechan...
To meet the demands for miniaturization and multi-functional and high-performance electronics applications, the semiconductor industry has shifted its packaging approach to multi-chip vertical stacking. Among the advanced packaging technologies for h...
This study systematically investigates the influence of Bi content on the electromigration (EM) lifetime of low-temperature Cu/Sn-xBi-1Ag (600 μm)/Cu interconnects, where x = 57, 47 and 40 wt.%. The intrinsically higher product of diffusivity and...
As semiconductor technologies continue to scale aggressively, electromigration (EM) has become critical in modern VLSI design. Since traditional EM assessment methods fail to accurately capture the complex behavior of multi-segment interconnects, rec...
Due to the miniaturization of electronic devices, electromigration became one of the serious reliability issues in lead-free solder joints. The orientation of the β-Sn grain plays an important role in electromigration failures. Several studies h...
The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bond...
In this study, we designed and manufactured an ideal electromigration testing device for soldering joints to solve the reliability problems caused by temperature and current density changes in the electromigration processes of micro solder joints. We...
Electromigration (EM) is a critical reliability concern in electronic solder joints due to increasing current densities in modern electronic packaging. EM-induced failures often manifest as void formation and microstructural degradation, particularly...
The development of advanced electronic devices leads to highly miniaturized interconnect circuits (ICs), which significantly increases the electromigration (EM) phenomenon of solder and circuits due to higher current density. The electromigration of...
The dimensions of microbumps in three-dimensional integration reach microscopic scales and thus necessitate a study of the multiscale microstructures in microbumps. Here, we present simulated mesoscale and atomic-scale microstructures of microbumps u...
The reliability of photovoltaic (PV) modules operating under various weather conditions attracts the manufacturer’s concern since several studies reveal a degradation rate higher than 0.8% per year for the silicon-based technology and reached up to 2...
Electromigration is one of the most important research issues affecting the reliability of solder joints. Current-induced Joule heating affects the electromigration behavior of solder joints. Solder joints with different cross-sectional areas were de...
Current-induced changes of surface morphology in printed Ag thin wires were investigated by current stressing tests and numerical simulation. The samples were printed Ag thin wires on a flexible substrate with input and output pads. Different experim...
The investigation on tin (Sn) whiskers formation has been widely applied in the field of lead-free electronic packaging. This is due to the fact that use of the Sn–Pb finishes has converted to Pb-free finishes in the electronic industry. Sn whiskers...
A transient three-dimensional comprehensive numerical model was established to study ion transport caused by diffusion, convection, and electro-migration in the electro-refining process for scrap-metal recycling. The Poisson–Nernst–Planck...
Electromigration (EM) is a critical reliability issue in integrated circuits and is becoming increasingly significant as fabrication technology nodes continue to advance. The analysis of the hydrostatic stress, which is paramount in electromigration...
As electronic devices continue to shrink in size and increase in complexity, the current densities in interconnects drastically increase, intensifying the effects of electromigration (EM). This renders the understanding of EM crucial, due to its sign...
Appropriate accelerated deterioration methods are crucial for studying the deterioration behavior of reinforced concrete linings in subsea tunnels. To investigate the deterioration mechanisms of reinforced concrete (RC) structures in marine environme...
This paper suggests an extensive inferential method for the Power Pratibha Distribution (PPD) under Unified Hybrid Censoring Schemes (UHCSs), since there is a growing interest in flexible models in both reliability and service operations. This work s...
New diamond chip resistors have been used in high-power devices widely due to excellent heat dissipation and high-frequency performance. However, systematic research about their solder joint reliability is rare. In this paper, a related study was con...
Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packagin...
The Cu/low-k damascene process was introduced to alleviate the increase in the RC delay of Al/SiO2 interconnects, but now that the technology generation has reached 1× nm or lower, a number of limitations have become apparent. Due to the integr...
With the ongoing miniaturization of solder joints in three-dimensional integrated electronic packaging, electromigration reliability has become a pressing concern. This study systematically examines the interfacial intermetallic compound (IMC) growth...
Schmitt Triggers are essential building blocks in noise-resilient systems and are useful in managing switching behavior in low-power designs. Yet, as CMOS technologies scale down, their designs become increasingly challenging. This paper presents a c...
Fiber traces are one of (micro)traces that can be found at a crime scene. They are easily transferable and, like other forms of evidence, can provide a link between a suspect and a victim. The main purpose of this review is to present methods develop...
With the increasing power density of electronic devices, solder joints are prone to electromigration under high currents, which results in a significant threat to reliability. In this study, the molecular dynamics method is used to study the diffusio...
Copper is the most common interconnecting material in the field of microelectronic packaging, which is widely used in advanced electronic packaging technologies. However, with the trend of the miniaturization of electronic devices, the dimensions of...
The crystallographic characteristic effect of Cu substrate on cathode dissolution behavior in line-type Cu/Sn–3.0Ag–0.5Cu (SAC305)/Cu solder joints during electromigration (EM) was investigated by scanning electron microscope (SEM), electron backscat...
High-temperature micro-electro-mechanical systems (MEMSs) are critical for applications in extreme environments and applications where the operating temperature can exceed 1000 °C, but their long-term performance is limited by complex failure mec...
As electronic packaging technology advances towards miniaturization and integration, the issue of electromigration (EM) in lead-free solder joints has become a significant factor affecting solder joint reliability. In this study, a Sn-3.0Ag-0.5Cu (SA...
Aluminum–copper alloy (AlCu) is commonly utilized as interconnect material in low-power devices. However, as the size of electronic devices continues to decrease and current density increases, electromigration (EM) has emerged as a significant...
Ruggedized computers are the core of modern communication, guidance, control, and data-processing systems, and typically operate under extreme environmental conditions. However, under extreme service conditions such as temperature cycling, vibration,...
As the integration of chips in 3D integrated circuits (ICs) increases and the size of micro-bumps reduces, issues with the reliability of service due to electromigration and thermomigration are becoming more prevalent. In the practical application of...
Although lead-free piezoelectric ceramics have been extensively studied, many problems must still be overcome before they are suitable for practical use. One of the main problems is fabricating a multilayer structure, and one solution attracting grow...
Sustainability of products that seek to maintain ecosystem balance, such as electric vehicles or solar system inverters, often require extensive testing during their developmental stages in a manner that minimizes wastage and drives creativity. Multi...
Silicon-Based Physical Unclonable Functions (PUFs) exploit inherent manufacturing variations to produce a unique, random, and ideally unclonable secret key. As electronic devices are decommissioned and sent for End of Life (EOL) recycling, the encryp...
Due to the rapid increase in current density encountered in new chips, the phenomena of thermomigration and electromigration in the solder bump become a serious reliability issue. Currently, Ni or TiN, as a barrier layer, is widely academically studi...