- Article
The Effect of Multiple Solder Reflows on the Formation of Cu6Sn5 Intermetallics and the Decomposition of SnAg3.0Cu0.5 Solder Joints in the Framework of Rework and Reuse of MLCC Components
- Erik Wiss and
- Steffen Wiese
A rework of electronic assemblies and the reuse of electronic components are the most effective ways to reduce electronic waste. Since neither components nor substrates were developed with the intention of multiple usage, the question of how the inte...