Microplastics (MPs) have been attracting considerable interest in recent years due to their ubiquitous existence and accumulation within different systems and ecosystems. Moreover, their presence in electroplating baths involves a more serious challe...
As semiconductor integration scales expand and chip sizes shrink, Through Silicon Via (TSV) technology advances towards smaller diameters and higher aspect ratios, posing significant challenges in thermo-mechanical reliability, particularly within in...
Electroplating has been favored to date as a surface treatment technology in various industries in the development of semiconductors, automobiles, ships, and steel due to its advantages of being a simple, solution-based process, with low cost and hig...
Interconnections are essential for integrating the packaging substrate, and defect-free copper-filling can further improve the reliability in through holes (THs). The coating properties and filling processes are mainly dominated by the interplays amo...
Introducing nano-twins into electrolytic copper foil is an effective method to enhance strength and toughness. While pulse electrodeposition enables the easier preparation of high-density nano-twin copper, large-scale industrial production mainly rel...
An electrical connector is an important component for achieving the interconnection of electric equipment. However, the degradation of contacting parts within the electrical connector under repetitive mechanical insertion and extraction operations ca...
As leading candidates of sheet steels for advanced nuclear reactors, three types of Ni–Mo–Cr high-strength low alloy (HSLA) steels named as CNST1, CNST2 and CNSS3 were irradiated by 400 keV Fe+ with peak fluence to 1.4 × 1014, 3.5 &...
This clinical report details the prosthetic rehabilitation of a patient following maxillary ablation to remove a peripheral giant cell granuloma. After a hemimaxillectomy, the defect was reconstructed with a fasciocutaneous radial free flap. Implant...
The application of nanotechnology in developing novel thermoelectric materials has yielded remarkable advancements in material efficiency. In many instances, dimensional constraints have resulted in a beneficial decoupling of thermal conductivity and...
The use of wastes, some of them hazards, as raw materials of ceramic pigments has been a way to diminish their environmental impact, to economically valorize them, and to face the depletion of virgin raw materials. In this work were prepared pigments...
In order to obtain high-quality through-silicon via (TSV) arrays for high voltage applications, we optimized the fabrication processes of the Si holes, evaluated the dielectric layers, carried out hole filling by Cu plating, and detected the final st...
This study investigates the use of nanocrystalline Cu (NC-Cu) to suppress interfacial voids in low-temperature Cu-Cu bonding for 3D IC packaging. We quantitatively compared the void characteristics of electrodeposited NC-Cu (grain size ~89.3 nm) and...
Single-shot grating-based phase-contrast imaging techniques offer additional contrast modalities based on the refraction and scattering of X-rays in a robust and versatile configuration. The utilization of a single optical element is possible in such...
With the increasing demand for high-density integration, low power consumption and high bandwidth, creating more sophisticated interconnection technologies is becoming increasingly crucial. Three-dimensional (3D) integration technology is known as th...
The novel pyridine oxime-based complexing agents 2-pyridinecarboxaldehyde oxime, 2-acetylpyridine ketoxime and 2-pyridine amidoxime were synthesized for alkaline Zn-Ni alloy electrodeposition, outperforming conventional citrate/TEPA systems in corros...
Co-plating of Cu-Ni coatings by supercritical CO2 (sc-CO2) and conventional electroplating processes was studied in this work. 1,4-butynediol was chosen as the surfactant and the effects of adjusting the surfactant content were described. Although th...
To enhance the sliding wear and corrosion behavior of steels with low carbon content, cermet composite coatings are usually deposited on their surface by various deposition processes. Laser cladding, compared to other deposition techniques such as el...
Recent advances in chiplet architectures, heterogeneous integration, 2.5D/3D packaging, high-performance computing, and RF applications have increased the demand for high-density vertical interconnects and low-loss packaging platforms. Glass substrat...
With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-spee...
2 at.% Cu + 2 at.% Ni were co-doped in ZnO nanoparticles by a simple hydrothermal method, and then the modified nanoparticles were compounded into Cu-Ni alloy coatings using an electroplating technique. The effects of the current density (15–45...
(1) Background: Electroplating sludge (ES) and water-washed municipal solid waste incineration fly ash (WFA) are classified as hazardous solid wastes, and their conventional disposal approaches trigger severe heavy metal pollution. Conventional color...
Copper coatings with refined grains and smooth surface morphology were electrodeposited from electrolytes comprising a novel accelerator, the disodium salt of 4,4-dithiobenzene disulfonic acid (DBDA), with sodium chloride and polyethylene glycol (PEG...