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Micromachines
Volume 17
Issue 6
10.3390/mi17060720
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This is an early access version, the complete PDF, HTML, and XML versions will be available soon.
Review

Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review

by
Dong Bae Park
1,2,
Jinho Jo
3,
Seonwoo Kim
3,
Da-Yeong Lee
3,
Suin Chae
3,
Soobin Park
3,
Se-Hoon Park
3,
Tae-Young Lee
1,
Kyoung-Min Kim
1,
Nam Son Park
1,
Seong-Eui Lee
2,
Sang O Kim
4 and
Hyunjin Nam
4,*
1
Center for Cooperative Research Facilities, Tech University of Korea, 65, Emtibeuibuk-ro, Siheung-si 15119, Gyeonggi-do, Republic of Korea
2
Department of Advanced Materials Engineering, Tech University of Korea, 237 Sangidaehak-ro, Siheung-si 15073, Gyeonggi-do, Republic of Korea
3
ICT Device Packaging Research Center, Korea Electronics Technology Institute, 25, Saenari-ro, Bundang-gu, Seongnam-si 13509, Gyeonggi-do, Republic of Korea
4
ICT Device Packaging Research Center, Korea Electronics Technology Institute, 65, Emtibeuibuk-ro, Siheung-si 15119, Gyeonggi-do, Republic of Korea
*
Author to whom correspondence should be addressed.
Micromachines 2026, 17(6), 720; https://doi.org/10.3390/mi17060720 (registering DOI)
Submission received: 19 May 2026 / Revised: 3 June 2026 / Accepted: 12 June 2026 / Published: 14 June 2026
(This article belongs to the Collection Microdevices and Applications Based on Advanced Glassy Materials)
Versions Notes

Abstract

Recent advances in chiplet architectures, heterogeneous integration, 2.5D/3D packaging, high-performance computing, and RF applications have increased the demand for high-density vertical interconnects and low-loss packaging platforms. Glass substrates have attracted considerable attention for next-generation advanced packaging because of their low dielectric loss, high dimensional stability, smooth surface, and compatibility with large-area panel-level processing. Through-glass vias (TGVs) are essential vertical interconnect structures that enable the electrical integration of glass substrates. This focused review summarizes TGV technologies for glass-based advanced packaging from the perspectives of via formation, seed layer deposition, metallization, Cu filling, defect formation, reliability, and plugging-based alternative architectures. Representative TGV formation methods, including laser drilling, selective laser etching, laser-induced deep etching, wet/dry etching, and photosensitive glass processing, are compared. Metallization approaches based on sputtering, electroless plating, ALD/CVD, and hybrid processes are discussed together with Cu electroplating strategies such as conformal plating, bottom-up filling, pulse or pulse-reverse plating, and engineered-geometry filling. Key defects, including voids, seams, pinch-off, seed discontinuity, Cu/glass interfacial delamination, glass cracking, and Cu protrusion, are reviewed in relation to thermomechanical reliability. Finally, polymer/dielectric plugging, plugging/re-drilling, conductive paste plugging, and hybrid Cu/plugging structures are discussed as application-specific alternatives for balancing electrical performance, reliability, manufacturability, yield, and cost.
Keywords: through-glass via; glass substrate; advanced packaging; metallization; Cu filling; conductive paste plugging through-glass via; glass substrate; advanced packaging; metallization; Cu filling; conductive paste plugging

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MDPI and ACS Style

Park, D.B.; Jo, J.; Kim, S.; Lee, D.-Y.; Chae, S.; Park, S.; Park, S.-H.; Lee, T.-Y.; Kim, K.-M.; Park, N.S.; et al. Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review. Micromachines 2026, 17, 720. https://doi.org/10.3390/mi17060720

AMA Style

Park DB, Jo J, Kim S, Lee D-Y, Chae S, Park S, Park S-H, Lee T-Y, Kim K-M, Park NS, et al. Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review. Micromachines. 2026; 17(6):720. https://doi.org/10.3390/mi17060720

Chicago/Turabian Style

Park, Dong Bae, Jinho Jo, Seonwoo Kim, Da-Yeong Lee, Suin Chae, Soobin Park, Se-Hoon Park, Tae-Young Lee, Kyoung-Min Kim, Nam Son Park, and et al. 2026. "Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review" Micromachines 17, no. 6: 720. https://doi.org/10.3390/mi17060720

APA Style

Park, D. B., Jo, J., Kim, S., Lee, D.-Y., Chae, S., Park, S., Park, S.-H., Lee, T.-Y., Kim, K.-M., Park, N. S., Lee, S.-E., Kim, S. O., & Nam, H. (2026). Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review. Micromachines, 17(6), 720. https://doi.org/10.3390/mi17060720

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