Advanced Electronic Packaging Technology: From Hard to Soft (Second Edition)
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: 20 September 2025 | Viewed by 2022
Special Issue Editors
Interests: soft electronic devices; electronic packaging; electrophysiology; flexible actuators and sensors; materials science
Special Issues, Collections and Topics in MDPI journals
Interests: electronic packaging; heterogeneous integration; opto-electronics and photonic devices; power electronics; thermal managment
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
This Special Issue, “Advanced Electronic Packaging Technology: From Hard to Soft (Second Edition)”, will address advances in Electronic Packaging Technology, including design, structure, material, processing, and testing of electronic, photonic, and power electronic devices. A particular perspective of this Special Issue focuses on the technologies associated with soft design and engineering of electronic packaging, potentially used in soft electronic devices. Electronic devices have been rapidly developing with the growing necessities of high-computing, low-power consumption, miniaturization, and multi-function in computers and consumer electronics products. Advanced electronic packaging technologies bridge the design and use of the powerful functions of electronic devices, so they play a significant role in their development.
Smart electronics permeate into human’s daily life and become the extension of the human body. Soft electronic packaging represents one of the most promising approaches to form imperceptive and comfortable interfaces of human and electronic devices. In this regard, the demonstration of advanced soft materials, structures, and designs in advanced electronic packaging is strongly demanded to comply with the requirements of the developments of soft electronic devices.
Power electronics have been rapidly growing as another major economic sector of semiconductor industry, along with the recent developments in wide bandgap semiconductor materials such as SiC, GaN, and Ga2O3. Packaging materials have new challenges in meeting the strict requirements of power electronics in automotive and aerospace applications. Emerging interconnect methods, such as nanomaterial sintering and transient liquid phase bonding, may answer some of the particular needs. Other types of packaging materials, such as ceramic substrates, polymer underfill, and thermal management materials, have also taken a very important role in the development of power electronics.
Original papers are solicited on all types of advanced electronic packaging technologies involving designs, structures, materials, processing, and testing. Of particular interest are recent developments in soft materials, structures, processes, and devices. Articles and reviews dealing with electronic packaging technologies in wearable electronics and power devices are very welcome.
Dr. Yue Gu
Dr. Yongjun Huo
Guest Editors
Manuscript Submission Information
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Keywords
- electronic packing technology
- soft electronic and photonic devices
- power electronics
- ceramic substrates
- thermal interface materials
- solder alloys
- thermal management
- intrinsically soft materials
- flexible and stretchable structures
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Related Special Issue
- Advanced Electronic Packaging Technology: From Hard to Soft in Materials (10 articles)
