In this paper, three Pd-coated Cu (PCC) wires with different Pd-layer thicknesses were used to make bonding samples, and the influence of Pd-layer thickness on the reliability of bonded points before and after a high-temperature storage test was stud...
A new method of detecting the thickness of each layer of Cu/Al laminates based on laser ultrasound was proposed for the online non-contact measurement of the thickness of each layer of Cu/Al laminates during the rolling process. This method utilized...
Transparent conductive IWO/Cu/IWO (W-doped In2O3) films were deposited on quartz substrates by magnetron sputtering of IWO and Cu in the Ar atmosphere. The X-ray diffraction (XRD) patterns identified the cubic iron–manganese ore crystal structu...
Electrodeposited Ni65Co35/Cu multilayers were prepared with Cu spacer layer thicknesses between 0.5 nm and 7 nm. Their structure and magnetic and magnetoresistance properties were investigated. An important feature was that the Cu layers were deposit...
The effect of copper substrate roughness and tin layer thickness were investigated on whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both unpolished and mechanically polished Cu substrates with 1 µm and 2 μm...
This paper conducted a high-temperature storage test (HTST) on bonded samples made of Pd100 (Pd-coated Cu wire with a Pd layer thickness of 100 nm) and Pd120, and studied the growth law of Cu-Ag intermetallic compounds and the inhibitory mechanism of...
Thick Cu−Sn alloy layers were produced in an [EMIM]Cl ionic-liquid solution from CuCl2 and SnCl2 in different ratios. All work, including the electrodeposition, took place outside the glovebox with a continuous argon stream over the electrolyte at 95...
By adjusting the Cu layer thickness, this study systematically investigated the evolution of the microstructure and optoelectronic properties of WZO/Al/Cu/Al/WZO multilayer films. The results indicated that all the films exhibited a ZnO phase with he...
The native oxide layer that forms on copper (Cu) metal spherical particle surfaces under ambient handling conditions has been shown to have a significant effect on sintering behavior during microwave heating in a previous study, where an abnormal exp...
In this paper, we report the development of Cd-free buffers using atomic layer deposition (ALD) for Cu(In,Ga)(S,Se)2-based solar cells. The ALD process gives good control of thickness and the S/S +O ratio content of the films. The influence of the gr...
In this study, a new thin-film deposition process, spray coating method (SPM), was investigated to deposit the high-densified CuInSe2 absorber layers. The spray coating method developed in this study was a non-vacuum process, based on dispersed nano-...
In general, the optical and electrical characteristics of Cu(In,Ga)Se2 (CIGS) solar cells have been studied under the condition that sunlight is normally incident from the air to the CIGS solar cell having no thick front encapsulation layers. To obta...
This study examines the influence of layer thickness (0.9, 1.6, 2.4, and 4 mm) on the distribution of residual stress, microstructural evolution, and tensile properties of Cu18150/Al1060/Cu18150 multilayered composites fabricated via a combined cast-...
A gradient structure (GS) design is a prominent strategy for strength-ductility balance in metallic materials, including Cu alloys. However, producing a thick GS surface layer without surface damage is still a challenging task limited by the availabl...
In this paper, the lattice Boltzmann–cellular automata (LBM-CA) model with dynamic and static grids was used to study the growth of three-dimensional (3D) multidendrites under directional solidification with random preferred angles. In the static gri...
This study clarified the evolution of texture in the thickness direction of the cylindrical cup which was spun from a rolled aluminum sheet in 13 passes, using electron backscatter diffraction pattern analysis. The study also obtained the relationshi...
X-ray reflectometry (XRR) and X-ray photoelectron spectroscopy (XPS) measurements (core levels and valence bands) were made of Cu thin films that were prepared and coated by capping Ta layers with different thicknesses (5, 10, 15, 20, and 30 Å)...
Due to exceptional conductivity, lightweight nature, corrosion resistance, and various other advantages, Cu/Al bimetallic composites are extensively utilized in the fields of communication, new energy, electronics, and other industries. To solve the...
A single-mode optical fiber sensor uses surface plasmon resonance (SPR) with a bimetallic silver–copper (Ag–Cu) coating compared to a single layer of Ag and Cu itself. Bimetallic Ag–Cu sensors are constructed by simple fabrication o...
Dissimilar metal joining between Al and Cu is effective for reducing the weight and cost of electrical components. In this study, dissimilar lap joining of pure Al to pure Cu with an Al-Ni filler material was conducted using tungsten inert gas (TIG)...
Reactive co-sputtering was applied to deposit TaN-(Ag,Cu) nanocomposite films on Si and tool steels. Prior to post-deposition annealing, the films were deposited with TaN cap (diffusion barrier) layers in various thicknesses in order to slow down the...
The strength–ductility trade-off has been a long-standing challenge when designing and fabricating a novel metal matrix composite. In this study, graphene-nanosheets (GNSs)-reinforced copper (Cu)-matrix-laminated composites were fabricated thro...
A new CuNi/TiB2 thin-film thermocouple was fabricated using magnetron sputtering. A 400 nm thick CuNi interior layer was deposited on a dielectric substrate initiatory, and then covered by an 800 nm thick TiB2 layer. The tests revealed that the TiB2...
We grew Sr1-xLaxCuO2 thin films and SrCuO2/Sr0.9La0.1CuO2/SrCuO2 trilayers by reflection high-energy diffraction-calibrated layer-by-layer molecular beam epitaxy, to study their electrical transport properties as a function of the doping and thicknes...
Infrared dissimilar joining Ti50Ni50 and 316L stainless steel using Cu foil in between Cusil-ABA and BAg-8 filler metals has been studied. The Cu foil serves as a barrier layer with thicknesses of 70 μm and 50 μm, and it successfully isolates the int...
This research aims to replace the activator NH4Cl in a vanadizing agent and reduce air pollution and harm to the human body. This study adopts powder pack cementation to prepare the vanadizing layer on the surface of GCr15 steel, focusing on the infl...
Using pulsed double electrode-gas metal arc welding, aluminum wires are joined to copper plates with fillers of different fractions of silicon. Two layers of different microstructures are formed near the Al-Cu interface: one consists of a hypoeutecti...
Metal laminated composites are widely used in industrial and commercial applications due to their excellent overall performance. In this study, the copper/graphene-aluminum-copper/graphene (Cu/Gr-Al-Cu/Gr) laminated composites were prepared by ingeni...
This study proposes a method to enhance the airtightness of the joint between the ZrO2 and Crofer alloy using coating technology. With the aid of vacuum sputtering technology, a titanium–copper alloy layer with a thickness between 1.5 μm and...
Anodized aluminum oxide (AAO) films, which have numerous nanochannels ca. 75 nm in diameter, D and ca. 70 µm in length, L (ca. 933 in aspect ratio, L/D), were used as a template material for growing Co/Cu multilayered nanowire arrays. The multi...
Anodized aluminum oxide (AAO) nanochannels of diameter, D, of ~50 nm and length, L, of ~60 µm (L/D: approx. 1200 in the aspect ratio), were synthesized and applied as an electrode for the electrochemical growth of Co/Cu multilayered heterojunct...
An ultrathin Al layer was introduced into AZO/Cu/AZO films to further enhance the optoelectronic performance. The AZO/Al/Cu/AZO films were deposited on glass substrates by DC and RF magnetron sputtering; the microstructure and optoelectronic properti...
C-axis trilayer cuprate Josephson junctions are essential for basic science and digital circuit applications of high-temperature superconductors. We present a method for probing the interface perfection in La2−xSrxCuO4 (LSCO)-LaSrAlO4 (LSAO)-La...
The effective diffusion of Cu in Fe is the key to forming a stable transition layer between copper and low-carbon steel, but it is seriously affected by several factors, especially temperature, and the diffusion of Cu can only be completed at high te...
The magnetic properties of 50 nm Ni80Fe20 deposited on Cu underlayers with different thicknesses by obliquely sputtering were studied. It was found that the in-plane uniaxial magnetic anisotropy (IPUMA) of the Ni80Fe20 film can be induced by the obli...
Metallic porous microtubes were obtained from commercial wires (200–250 µm diameter) of Cu-65Ni-2Fe, Cu-44Ni-1Mn and Cu-23Ni, alloys (wt. %) by surface oxidation at 1173 K in air, removal of the unoxidized core by chemical etching, and reduction in a...
The biomarker carcinoembryonic antigen (CEA) plays an important role in the diagnosis and monitoring of cancer, like breast, surveillance, colon, and liver cancer. The highly sensitive surface plasmon resonance (SPR) sensor presented in this work use...
We examined the feasibility of alumina substrate metallization by magnetron deposition of copper coatings with thickness of several tens µm for its prospective applications in production of ceramic PCBs and packaging. The films were prepared in...
Highly transparent indium-free multilayers of TiO2/Cu/TiO2 were obtained by means of annealing. The effects of Cu thickness and annealing temperature on the electrical and optical properties were investigated. The critical thickness of Cu mid-layer w...
The formation of conductive copper patterns on mica holds promise for developing cost-effective flexible electronics and sensing devices, though it is challenging due to the low adhesion of mica’s atomically flat surface. Herein, we present a w...
In this study, various factors affecting the efficiency of the MAPbI3 perovskite solar cell (PSC) were analyzed using the SCAPS-1D simulation program. The basic device analyzed in this study had a structure of ITO/TiO2/MAPbI3/Cu2O/Au. The thickness o...
The electrodes of thin film transistors (TFTs) have evolved from conventional single Cu layers to multi-layered structures formed by Cu and other metals or alloys. Different etching rates of various metals and galvanic corrosion between distinct meta...
In 3D-system packaging technologies, eutectic bonding is the key technology of multilayer chip stacking and vertical interconnection. Optimized from the aspects of the thickness of the electroplated metal layer, the pretreatment of the wafer surface...
Al/Cu dissimilar joining is a key technology for reducing the weight and cost of electrical components. In this study, the dissimilar friction stir lap welding (FSLW) of a Ni-containing Al alloy to pure Cu was performed, and the effects of the additi...
Al/Fe bimetals prepared by a compound casting method, combining the excellent properties of both the Al alloy and the ductile cast iron, exhibit great potential for application in achieving engine weight reduction. However, the problem of insufficien...
The effects of different brazing processes on the interfacial microstructure and shear strength of TiZrHfNbMo high-entropy alloy (HEAS) and Si3N4 ceramic brazed joints were studied. There is no obvious defect in a brazed TiZrHfNbMo HEAS/AgCuTi/Si3N4...
The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu sold...
The interface microstructure and shear strength of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal-cycle loading were investigated with scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and physical...
Cu2O solar cells are regarded as a promising emerging inorganic photovoltaic technology due to their power conversion efficiency (PCE) potential and material sustainability. While previous studies primarily focused on the band offset between n-type b...
A thin Pd-based H2-permeable membrane is required to produce high-purity H2 with high efficiency. In this study, a porous Ni-supported Pd60Cu40 composite H2-permeable membrane was developed using a reverse build-up method to produce economical H2 pur...
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