This paper presents a new approach to the simulation of the thermal reflow of e-beam-exposed polymethyl methacrylate (PMMA) taking into account its nonuniform viscosity profile. This approach is based on numerical “soapfilm” modeling of t...
A theoretical model is proposed to investigate the mechanism of shape formation in polydimethylsiloxane (PDMS) assisted thermal reflow. The thermal curing of PDMS is characterized by a dual-Arrhenius equation and its effect on the reflow process is d...
In this paper, we proposed an efficient and high-precision process for fabricating large-area microlens arrays using thermal reflow combined with ICP etching. When the temperature rises above the glass transition temperature, the polymer cylinder wil...
This paper presents a microlens fabrication process using the timed-development-and-thermal-reflow process, which can fabricate various types of aperture geometry with a parabolic profile on a single substrate in the same batch of the process. By con...
In hard disk drive (HDD) manufacturing, a reflow soldering process (RSP) implements heat generated by the welding tip to melt a solder ball for bonding the following essential HDD components: a flexible printed circuit (FPC) and a printed circuit cab...
Thermoplastic polymer micro- and nanostructures suffer pattern decay when heated to a temperature close to or above the polymer’s glass transition temperature. In this work, we report enhanced thermal stability of polycarbonate nanostructures a...
Retroreflectors are an important optical component, but current retroreflector structures and manufacturing processes are relatively complex. This paper proposes a rapid, low-cost, large-area method for fabricating retroreflectors based on microlens...
We investigated the thermal stability of a 1Mbit OxRRAM array embedded in 28 nm COMS technology. A back-end-of-line (BEOL) solution with a TaN–Ta interfacial layer was proposed to eliminate the failure rate after reflow soldering assembly at 26...
This paper presents a detailed physical model for a novel method of two- and three-dimensional microstructure formation: dry electron beam etching of the resist (DEBER). This method is based on the electron-beam induced thermal depolymerization of po...
A reflow soldering process (RSP) is generally implemented in advanced manufacturing factories for welding small electronic components together to create a product using heat generated at the welding tip (WT). Improper WT design and operating conditio...
The thermal warpage of a server-computer-used DIMM socket-PCB assembly after the solder reflow process is studied experimentally, theoretically, and numerically, especially along the socket lines and over the entire assembly. Strain gauge and shadow...
Measurements of the curvatures and warpages of a printed circuit board (PCB) during a thermal solder reflow process using strain gauges are proposed in this study. In the experiments, a shadow moiré is used for measuring the out-of-plane deformations...
The process design of hot air reflow soldering is one of the key factors affecting the quality of PCBA (Printed Circuit Board Assembly) component products. In order to improve the product quality during the design process, this paper proposes a robus...
Sn–Bi alloys are desirable candidates for soldering components on printed circuit boards (PCBs) because of their low melting point and reduced cost. While certain tin–bismuth solders are well characterized many new alloys in this family h...
Material extrusion-based polymer 3D printing, one of the most commonly used additive manufacturing processes for thermoplastics and composites, has drawn extensive attention due to its capability and cost effectiveness. However, the low surface finis...
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system...
Multilayer ceramic capacitors (MLCCs) are critical components when thermal processes such as reflow desoldering are used during rework of electronic assemblies. The capacitor’s ferroelectric BaTiO3 body is very brittle. Therefore, thermomechani...
In this article, a novel Pyrex reflow bonding technology is introduced which bonds two functional units made of silicon via a Pyrex reflow bonding process. The practical application demonstrated here is a precision dosing system that uses a mechanica...
This study investigated the influence of reinforcing 0.50 wt.% of titanium oxide (TiO2) and aluminium oxide (Al2O3) nanoparticles on the wettability performance of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy. The thermal properties of the SAC305 nanocompo...
For the problem of high waste heat in the active area of high-power VCSEL arrays and the difficulty of heat dissipation, we took advantage of laser 3D printing technology and combined it with the relevant principles of fluid-structure coupling, three...
In this paper, we analyze the residual stress of different components of the crystal structures of electronic device materials following exposure to elevated temperatures using a combination of experimental tests and finite element simulations. X-ray...
In this study, the effect of intermetallic compound (IMC) bridging on the cracking resistance of microbumps with two different under bump metallization (UBM) systems, Cu/solder/Cu and Cu/solder/Ni, under a thermal cycling test (TCT) is investigated....
Vacuum packaging of Micro-electro-mechanical system (MEMS) devices is a hot topic for its advantages of improving performance and reducing power consumption. In this paper, the physics package of a chip scale atomic clock (CSAC), as a typical kind of...
In this study, a novel wetness and moisture concentration analysis approach is presented. A finite element method is utilized for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current app...
As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC) based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs) during...
Indium-based micro-bump arrays, among other things, are used for the bonding of infrared photodetectors and focal plane arrays. In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morpho...
A 3–5 μm Cu@Sn core-shell powder was prepared by chemical plating. Based on the mixture of this Cu@Sn and Ag NPs (nanoparticles), a soldering material for third-generation semiconductors was prepared. The joints prepared with this soldering...
This paper presents a warpage analysis method that predicts the warpage behavior of electroplated Cu films on glass fiber-reinforced polymer (GFRP) packaging substrates. The analysis method is performed using the following sequence: fabricate specime...
The application of microtechnology to traditional mechanical industries is limited owing to the lack of suitable micropatterning technology for durable materials including metal. In this research, a glassy carbon (GC) micromold was applied for the di...
High-Bandwidth Memory (HBM) enables the bandwidth required by modern AI and high-performance computing, yet its three dimensional stack traps heat and amplifies thermo mechanical stress. We first review how conventional solutions such as heat spreade...
As semiconductor devices demand higher input–output density and faster signal transmission, fan-out panel-level packaging has emerged as a promising solution for next-generation electronic systems. However, the hygroscopic nature of epoxy moldi...
Microjoining technologies are crucial for producing reliable electrical connections in modern microelectronic and optoelectronic devices, as well as for the assembly of electronic circuits, sensors, and batteries. However, the production of miniature...
Silicon solar cells have the advantages of non-toxicity, reliability, low price, and stability. Microlens arrays (MLAs) are widely used in solar cells to improve photoelectrical conversion efficiency (PCE). In this research, different MLAs mold was d...
Due to the growing demand for ultra-high-density integrated circuits in the integrated circuit industry, flip-chip bonding (FCB) has become the mainstream solution for chip interconnection. In flip-chip bonding (FCB), however, alloy solder is no long...
Sn–Sb system solders and ENIG/ENEPIG surface finish layers are commonly used in electronic products. To illustrate the thermal reliability evaluation of such solder joints, we studied the interfacial microstructure and shear properties of Sn-4....
Characterized by its low melting temperature of 138 °C, the eutectic Sn-58Bi solder expands the melting temperature range of interconnect joints in electronic packaging, making it widely used in multi-level packaging processes. However, its relia...
This present study applied Cu∙Zn/Al ribbon in place of a traditional Cu ribbon to a photovoltaic (PV) ribbon. A hot-dipped and an electroplated Sn PV ribbon reflowed onto an Ag electrode on a Si solar cell and estimated the feasibility of the tested...
Thermoset materials offer a multitude of advantageous properties in terms of shrinkage and warpage as well as mechanical, thermal and chemical stability compared to thermoplastic materials. Thanks to these properties, thermosets are commonly used to...
This study investigated the use of distributed optical fiber sensing to measure temperature and strain during thermomechanical processes in printed circuit board (PCB) manufacturing. An optical fiber (OF) was bonded to a PCB for simultaneous measurem...
The era of 20 nm integrated circuits has arrived. There exist abundant heterogeneous micro/nano structures, with thicknesses ranging from hundreds of nanometers to sub-microns in the IC back end of the line stack, which put stringent demands on the r...
Surface mount technology (SMT) plays an important role in integrated circuits, but due to thermal stress alternation caused by temperature cycling, it tends to have thermo-mechanical reliability problems. At the same time, considering the environment...
Electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) is a common surface finish in electronic packaging, while the Ni(P) layer increases the impedance of solder joints and leads to signal quality degradation in high-frequency circuits. Reducing the...
A novel three-dimensional (3D) wafer-level sandwich packaging technology is here applied in the dual mass MEMS butterfly vibratory gyroscope (BFVG) to achieve ultra-high Q factor. A GIS (glass in silicon) composite substrate with glass as the main bo...
As an energy-efficient additive manufacturing process, vat photopolymerization 3D-printing has become a convenient technology to fabricate functional devices with high resolution and freedom in design. However, due to their permanently crosslinked ne...
Dynamic polymer networks combine the noteworthy (thermo)mechanical features of thermosets with the processability of thermoplastics. They rely on externally triggered bond exchange reactions, which induce topological rearrangements and, at a sufficie...
The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58...
Reliability is one of the major requirements for power and opto-electronic devices across all segments. High operation temperature and/or high thermomechanical stress cause defects and degradation of materials and interconnects, which may lead to mal...
Light trapping micro-nano structures have been widely used to optimize the function of solar cell devices, especially microlens arrays (MLAs). In this article, we first prepared composite films by using sol-gel technology and the spin coating method,...
We propose a hybrid laser microfabrication approach for the manufacture of three-dimensional (3D) optofluidic spot-size converters in fused silica glass by a combination of femtosecond (fs) laser microfabrication and carbon dioxide laser irradiation....
At present, there is an increasing need to mimic the in vivo micro-environment in the culture of cells and tissues in micro-tissue engineering. Concave microwells are becoming increasingly popular since they can provide a micro-environment that is cl...