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J. Compos. Sci. 2018, 2(2), 28; https://doi.org/10.3390/jcs2020028

Development of Pb-Free Nanocomposite Solder Alloys

1
Adelaide Microscopy, the University of Adelaide, Adelaide, SA 5005, Australia
2
Department of Mechanical Engineering, Curtin University, Bentley, WA 6845, Australia
3
Department of Materials Engineering, Isfahan University of Technology, Isfahan 83714, Iran
4
School of Mechanical Engineering, the University of Adelaide, Adelaide, SA 5005, Australia
*
Author to whom correspondence should be addressed.
Received: 23 March 2018 / Revised: 12 April 2018 / Accepted: 16 April 2018 / Published: 20 April 2018
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Abstract

As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC) based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs) during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1) Al2O3 or (2) Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys. View Full-Text
Keywords: Pb free; solder alloy; nanocomposite; microstructure Pb free; solder alloy; nanocomposite; microstructure
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Basak, A.K.; Pramanik, A.; Riazi, H.; Silakhori, M.; Netting, A.K.O. Development of Pb-Free Nanocomposite Solder Alloys. J. Compos. Sci. 2018, 2, 28.

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