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Electronics 2018, 7(12), 438;

A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis

Department of Aerospace and Mechanical Engineering, University of Arizona, Tucson, AZ 85721, USA
Department of Naval Architecture, Ocean and Marine Engineering, University of Strathclyde, Glasgow G4 0LZ, UK
Author to whom correspondence should be addressed.
Received: 31 October 2018 / Revised: 9 December 2018 / Accepted: 10 December 2018 / Published: 14 December 2018
(This article belongs to the Section Microelectronics and Optoelectronics)
PDF [4644 KB, uploaded 14 December 2018]


In this study, a novel wetness and moisture concentration analysis approach is presented. A finite element method is utilized for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element-based solutions and the newly introduced peridynamics theory. For numerical analysis, a reflow soldering stage is simulated for a multi-material system with time-dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is more general than some other existing models which are limited to certain conditions. View Full-Text
Keywords: moisture; diffusion; finite element; wetness; concentration moisture; diffusion; finite element; wetness; concentration

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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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Diyaroglu, C.; Madenci, E.; Oterkus, S.; Oterkus, E. A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis. Electronics 2018, 7, 438.

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