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19 Results Found

  • Article
  • Open Access
2 Citations
2,152 Views
11 Pages

Vertical Interconnection Technology for RF MicroSystem Packaging

  • Yongfang Hu,
  • Wei Sun,
  • Yipeng Sun and
  • Qingan Huang

11 July 2024

In this work, 1.5-level interconnections of RF microsystems with good RF performance, integration process compatibility, and high reliability are developed to meet the future demand for wireless communication microsystems in the millimeter wave band....

(This article belongs to the Special Issue Advanced Electronic Packaging Technology: From Hard to Soft)
  • Article
  • Open Access
986 Views
23 Pages

Packaging Design and Simulation-Guided Multi-Domain Design Refinement of a High-Density Integrated RF Microsystem Based on an ABF Substrate

  • Guoliang Zhu,
  • Feng Liu,
  • Xuan Liu,
  • Jinjian Zhang and ,
  • He Chen,
  • Yu Yan and
  • Guojun Wang
  • + 2 authors+ 0 author

1 September 2026

With the increasing demand for miniaturization, multi-channel RF transceiver capability, and high-speed digital processing in unmanned aerial vehicles, satellite remote sensing, and anti-jamming communication systems, conventional board-level discret...

(This article belongs to the Special Issue Artificial Intelligence and Microsystems)
  • Article
  • Open Access
2 Citations
3,126 Views
8 Pages

Wafer-Level Amplitude Equalizer Based on an Integrated Passive Device Process with Two Resonance Points for Wavy In-Band Transmission

  • Xiaodong Yang,
  • Mengjiang Xing,
  • Gan Liu,
  • Xiaozhen Li and ,
  • Xiangyu Sun,
  • Wenzhi Liu and
  • Yaobing Lu
  • + 2 authors+ 0 author

Amplitude equalizers play an important role in microwave transmission systems, and their performance can directly improve the signal transmission quality. Nowadays, the miniaturized equalizer is in good need of a highly integrated radio frequency (RF...

(This article belongs to the Section Microelectronics)
  • Article
  • Open Access
799 Views
26 Pages

Microstrip Antenna Bandwidth Optimization for RF Microsystems Using Swarm Intelligence and Reinforcement Learning

  • Shaolong Cao,
  • Yu Shao,
  • Jie Zhang,
  • Yang Wang and ,
  • Ju Tan,
  • Kai Zhu and
  • Lianghong Li
  • + 2 authors+ 0 author

As essential radiating elements in RF and microwave microsystems, microstrip antennas require sufficient bandwidth to ensure stable operation, integration flexibility, and overall microsystem performance. From a microsystem optimization perspective,...

  • Article
  • Open Access
1 Citations
3,292 Views
18 Pages

22 July 2025

Electrical connectors play a vital role in ensuring reliable signal transmission in high-frequency microsystems. This study explores the impact of microscale scratch-induced surface roughness on the alternating current (AC) contact impedance of RF co...

(This article belongs to the Special Issue Emerging Micro Manufacturing Technologies and Applications, 3rd Edition)
  • Article
  • Open Access
2 Citations
2,938 Views
13 Pages

Modeling and Validation of Total Ionizing Dose Effect on the TSVs in RF Microsystem

  • Lihong Yang,
  • Zhumeng Li,
  • Guangbao Shan,
  • Qijun Lu and
  • Yu Fu

31 May 2023

Radio frequency (RF) systems utilizing through-silicon vias (TSVs) have been widely used in the aerospace and nuclear industry, which means that studying the total ionizing dose (TID) effect on TSV structures has become necessary. To investigate the...

(This article belongs to the Special Issue Selected Papers from the 8th International Conference on Sensors and Electronic Instrumentation Advances (SEIA' 2022))
  • Article
  • Open Access
5 Citations
3,104 Views
8 Pages

A 3D LTCC-Based Ceramic Microfluidic System with RF Dielectric Heating of Liquids

  • Kostja Makarovič,
  • Darko Belavič,
  • Matjaž Vidmar and
  • Barbara Malič

2 December 2021

The design, fabrication and functional evaluation of the radio-frequency dielectric heating of liquids in an LTCC-based ceramic microfluidic system are described and discussed. The device, which relies on the dielectric heating of liquids, was fabric...

(This article belongs to the Special Issue Materials for LTCC Technology)
  • Proceeding Paper
  • Open Access
1 Citations
3,230 Views
4 Pages

Fabrication of Planar Copper Microcoils for Telemetric Orthodontic Applications

  • Julian Hafner,
  • Matthias Kuhl,
  • Michael Schwaerzle,
  • Thorsten Hehn and ,
  • Daniel Rossbach and
  • Oliver Paul
  • + 1 author+ 0 author

The fabrication of electroplated planar copper microcoils for telemetric orthodontic applications is presented. A set of microcoils with overall dimensions of 2 × 2.5 × 0.5 mm3, track widths down to 5 μm and turn numbers up to 35 were fabricated on g...

(This article belongs to the Proceedings of Proceedings of Eurosensors 2017, Paris, France, 3–6 September 2017)
  • Article
  • Open Access
5 Citations
8,361 Views
10 Pages

18 February 2019

MEMS switches include mobile beams in their mechanical structure and these suspended parts are essential for the device functioning. This paper illustrates the most important instability phenomena related to MEMS switches. Starting from the most impo...

(This article belongs to the Special Issue Instability Phenomena and Complex Responses in Electrically-Actuated Microbeam-Based MEMS)
  • Article
  • Open Access
16 Citations
4,441 Views
15 Pages

Design of U-Shaped Frequency Tunable Microwave Filters in MEMS Technology

  • Flavio Giacomozzi,
  • Emanuela Proietti,
  • Giovanni Capoccia,
  • Giovanni Maria Sardi and ,
  • Giancarlo Bartolucci,
  • Jacopo Iannacci,
  • Girolamo Tagliapietra,
  • Benno Margesin and
  • Romolo Marcelli
  • + 4 authors+ 0 author

1 January 2023

U-shaped microwave resonators implemented by RF MEMS switches can be considered the result of a novel design approach for obtaining small-footprint tunable resonators, owing to the bent shape of the resonator and the microsystem solution for changing...

(This article belongs to the Collection Next Generation MEMS: Design, Development, and Application)
  • Communication
  • Open Access
20 Citations
8,500 Views
12 Pages

Autonomous Microsystems for Downhole Applications: Design Challenges, Current State, and Initial Test Results

  • Myungjoon Choi,
  • Yu Sui,
  • In Hee Lee,
  • Ryan Meredith and ,
  • Yushu Ma,
  • Gyouho Kim,
  • David Blaauw,
  • Yogesh B. Gianchandani and
  • Tao Li
  • + 4 authors+ 0 author

23 September 2017

This paper describes two platforms for autonomous sensing microsystems that are intended for deployment in chemically corrosive environments at elevated temperatures and pressures. Following the deployment period, the microsystems are retrieved, rech...

(This article belongs to the Special Issue Sensors and Materials for Harsh Environments)
  • Article
  • Open Access
9 Citations
3,959 Views
28 Pages

23 March 2023

The emerging paradigms of Beyond-5G (B5G), 6G and Future Networks (FN), will capsize the current design strategies, leveraging new technologies and unprecedented solutions. Focusing on the telecom segment and on low-complexity Hardware (HW) component...

(This article belongs to the Section Physical Sensors)
  • Editorial
  • Open Access
868 Views
3 Pages

1 September 2026

The relentless expansion of modern wireless communications, high-resolution radar imaging, and decentralized mobile networks demands unprecedented adaptability, extreme compactness, and superior radiation efficiency from electromagnetic systems [...]

(This article belongs to the Special Issue RF MEMS and Microsystems)
  • Article
  • Open Access
477 Views
13 Pages

A Simulation Study of a Bandpass Filter Formed by CNT-Core Cu-TSVs with Enhanced Thermal Management

  • Han Wang,
  • Yingtao Ding,
  • Ziyue Zhang,
  • Jiaxuan Zhang and ,
  • Anda Zhang,
  • Xiang Pei and
  • Zhiming Chen
  • + 2 authors+ 0 author

15 June 2026

Bandpass filters based on through-silicon-via (TSV) interposers offer advantages such as compact footprint, excellent radio frequency (RF) performance, simplified processing, and low cost. However, as power densities in three-dimensional (3D) integra...

(This article belongs to the Special Issue Microelectronics Assembly and Packaging: Materials and Technologies, 3rd Edition)
  • Article
  • Open Access
489 Views
14 Pages

30 September 2026

Voltage reference has always been an essential building block in integrated circuits and microsystems, such as communication systems and RF modules, as well as wearable and portable devices. This paper proposes a high-power-supply-rejection (PSR) ban...

(This article belongs to the Special Issue High-Reliability Semiconductor Devices and Integrated Circuits, 4th Edition)
  • Article
  • Open Access
9 Citations
2,489 Views
17 Pages

30 September 2025

In reconfigurable radio frequency (RF) microsystems, the interconnect structure critically affects high-frequency signal integrity, and the accuracy of electromagnetic (EM) modeling directly determines the overall system performance. Conventional neu...

(This article belongs to the Special Issue Flexible and Biodegradable Electronics and Novel Semiconductor Devices)
  • Review
  • Open Access
8 Citations
3,648 Views
57 Pages

15 February 2026

Porous silicon (PSi), characterized by its high specific surface area and highly tunable morphology, presents significant potential across optoelectronics, energy storage, and biomedical applications. This review provides a systematic analysis of the...

(This article belongs to the Section Nanoelectronics, Nanosensors and Devices)
  • Feature Paper
  • Article
  • Open Access
13 Citations
8,383 Views
15 Pages

Design of a Ka-Band Heterogeneous Integrated T/R Module of Phased Array Antenna

  • Qinghua Zeng,
  • Zhengtian Chen,
  • Mengyun He,
  • Song Wang and ,
  • Xiao Liu and
  • Haitao Xu
  • + 1 author+ 0 author

The central element of a phased array antenna that performs beam electrical scanning, as well as signal transmission and reception, is the transceiver (T/R) module. Higher standards have been set for the integration, volume, power consumption, stabil...

(This article belongs to the Special Issue Recent Advances in Antennas and Millimeter-Wave Applications for Mobile Communication Systems)
  • Review
  • Open Access
43 Citations
18,825 Views
26 Pages

Low Power Design for Future Wearable and Implantable Devices

  • Katrine Lundager,
  • Behzad Zeinali,
  • Mohammad Tohidi,
  • Jens K. Madsen and
  • Farshad Moradi

With the fast progress in miniaturization of sensors and advances in micromachinery systems, a gate has been opened to the researchers to develop extremely small wearable/implantable microsystems for different applications. However, these devices are...