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Micromachines
Special Issues
Flexible and Biodegradable Electronics and Novel Semiconductor Devices
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Flexible and Biodegradable Electronics and Novel Semiconductor Devices

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: 31 March 2026 | Viewed by 2139

Special Issue Editor

Dr. Chen Liu

E-Mail Website
Guest Editor
School of Microelectronics and the State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Xidian University, Xi'an 710071, China
Interests: novel brain-computer interface and brain-like devices; flexible wearable and degradable electronics; heterogeneous integration of novel semiconductor devices

Special Issue Information

Dear Colleagues,

Continuous innovation in electronics requires flexible, biocompatible, sustainable, and high-performance materials and devices, and the rapid advancement of flexible and biodegradable electronics is revolutionizing healthcare, wearable technology, and sustainable electronics. Innovations in semiconductor materials and fabrication techniques are at the heart of this progress. This special issue highlights breakthroughs in flexible hybrid electronics (FHE), biodegradable materials, and novel semiconductor architectures to address challenges in healthcare, wearable technology, environmental sustainability, and next-generation computing. Interdisciplinary research results from leading institutions around the world showcase key advances in material design, fabrication techniques, and multifunctional applications.

Dr. Chen Liu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • flexible electronics
  • biodegradable electronics
  • stretchable materials
  • printed electronics
  • bioelectronics
  • electronic waste
  • transistors
  • nanoscale devices
  • soft robotics
  • flexible encapsulation
  • wide-bandgap semiconductors
  • field effect transistors

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Further information on MDPI's Special Issue policies can be found here.

Published Papers (3 papers)

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Research

19 pages, 1885 KB  
Article
Theoretical Model for a Pneumatic Nozzle–Cylindrical Flapper System
by Peimin Xu, Kazuaki Inaba and Toshiharu Kagawa
Micromachines 2025, 16(10), 1148; https://doi.org/10.3390/mi16101148 - 10 Oct 2025
Abstract
To increase semiconductor production yield and meet the growing global demand, air bearings offering higher processing speeds and reduced friction losses have been proposed as an ideal solution. However, due to the non-contact support characteristic of air bearings, challenges such as shaft displacement [...] Read more.
To increase semiconductor production yield and meet the growing global demand, air bearings offering higher processing speeds and reduced friction losses have been proposed as an ideal solution. However, due to the non-contact support characteristic of air bearings, challenges such as shaft displacement caused by processing resistance inevitably arise. As an engineering requirement, the shaft must restrict lateral deflection to within 30 μm under transverse force. In our previous research, a compensation system using a nozzle–flapper mechanism as a displacement sensor was proposed to address shaft displacement. The effectiveness of the nozzle–flapper system in measuring shaft displacement was validated at rotational speeds up to 20,000 rpm. Furthermore, the compensation system’s ability to maintain the shaft’s initial position under a 5 N external force was verified in related collaborative research. In this study, building upon prior work, we further analyze the system characteristics of the cylindrical nozzle–flapper. This includes modeling the geometric space formed by the specific shape of the cylindrical flapper and nozzle and proposing an airflow hypothesis based on this geometry. The hypothesis is incorporated into the theoretical model of a standard nozzle–flapper system, resulting in an optimized theoretical method applicable to cylindrical configurations. Experimental results validating the effectiveness of the proposed model are also presented. Full article
(This article belongs to the Special Issue Flexible and Biodegradable Electronics and Novel Semiconductor Devices)
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17 pages, 2725 KB  
Article
Physics-Guided Neural Surrogate Model with Particle Swarm-Based Multi-Objective Optimization for Quasi-Coaxial TSV Interconnect Design
by Zheng Liu, Guangbao Shan, Zeyu Chen and Yintang Yang
Micromachines 2025, 16(10), 1134; https://doi.org/10.3390/mi16101134 - 30 Sep 2025
Viewed by 183
Abstract
In reconfigurable radio frequency (RF) microsystems, the interconnect structure critically affects high-frequency signal integrity, and the accuracy of electromagnetic (EM) modeling directly determines the overall system performance. Conventional neural network-based surrogate models mainly focus on minimizing numerical errors, while neglecting essential physical constraints, [...] Read more.
In reconfigurable radio frequency (RF) microsystems, the interconnect structure critically affects high-frequency signal integrity, and the accuracy of electromagnetic (EM) modeling directly determines the overall system performance. Conventional neural network-based surrogate models mainly focus on minimizing numerical errors, while neglecting essential physical constraints, such as causality and passivity, thereby limiting their applicability in both time and frequency domains. This paper proposes a physics-constrained Neuro-Transfer surrogate model with a broadband output architecture to directly predict S-parameters over the 1–50 GHz range. Causality and passivity are enforced through dedicated regularization terms during training. Furthermore, a particle swarm optimization (PSO)-based multi-objective intelligent optimization framework is developed, incorporating fixed-weight normalization and a linearly decreasing inertia weight strategy to simultaneously optimize the S11, S21, and S22 performance of a quasi-coaxial TSV composite structure. Target values are set to −25 dB, −0.54 dB, and −24 dB, respectively. The optimized structural parameters yield prediction-to-simulation deviations below 1 dB, with an average prediction error of 2.11% on the test set. Full article
(This article belongs to the Special Issue Flexible and Biodegradable Electronics and Novel Semiconductor Devices)
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14 pages, 3520 KB  
Article
Design and Fabrication of Embedded Microchannel Cooling Solutions for High-Power-Density Semiconductor Devices
by Yu Fu, Guangbao Shan, Xiaofei Zhang, Lizheng Zhao and Yintang Yang
Micromachines 2025, 16(8), 908; https://doi.org/10.3390/mi16080908 - 4 Aug 2025
Cited by 1 | Viewed by 1741
Abstract
The rapid development of high-power-density semiconductor devices has rendered conventional thermal management techniques inadequate for handling their extreme heat fluxes. This manuscript presents and implements an embedded microchannel cooling solution for such devices. By directly integrating micropillar arrays within the near-junction region of [...] Read more.
The rapid development of high-power-density semiconductor devices has rendered conventional thermal management techniques inadequate for handling their extreme heat fluxes. This manuscript presents and implements an embedded microchannel cooling solution for such devices. By directly integrating micropillar arrays within the near-junction region of the substrate, efficient forced convection and flow boiling mechanisms are achieved. Finite element analysis was first employed to conduct thermo–fluid–structure simulations of micropillar arrays with different geometries. Subsequently, based on our simulation results, a complete multilayer microstructure fabrication process was developed and integrated, including critical steps such as deep reactive ion etching (DRIE), surface hydrophilic/hydrophobic functionalization, and gold–stannum (Au-Sn) eutectic bonding. Finally, an experimental test platform was established to systematically evaluate the thermal performance of the fabricated devices under heat fluxes of up to 1200 W/cm2. Our experimental results demonstrate that this solution effectively maintains the device operating temperature at 46.7 °C, achieving a mere 27.9 K temperature rise and exhibiting exceptional thermal management capabilities. This manuscript provides a feasible, efficient technical pathway for addressing extreme heat dissipation challenges in next-generation electronic devices, while offering notable references in structural design, micro/nanofabrication, and experimental validation for related fields. Full article
(This article belongs to the Special Issue Flexible and Biodegradable Electronics and Novel Semiconductor Devices)
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