Flexible and Biodegradable Electronics and Novel Semiconductor Devices

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".

Deadline for manuscript submissions: 31 March 2026 | Viewed by 724

Special Issue Editor


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Guest Editor
School of Microelectronics and the State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Xidian University, Xi'an 710071, China
Interests: novel brain-computer interface and brain-like devices; flexible wearable and degradable electronics; heterogeneous integration of novel semiconductor devices

Special Issue Information

Dear Colleagues,

Continuous innovation in electronics requires flexible, biocompatible, sustainable, and high-performance materials and devices, and the rapid advancement of flexible and biodegradable electronics is revolutionizing healthcare, wearable technology, and sustainable electronics. Innovations in semiconductor materials and fabrication techniques are at the heart of this progress. This special issue highlights breakthroughs in flexible hybrid electronics (FHE), biodegradable materials, and novel semiconductor architectures to address challenges in healthcare, wearable technology, environmental sustainability, and next-generation computing. Interdisciplinary research results from leading institutions around the world showcase key advances in material design, fabrication techniques, and multifunctional applications.

Dr. Chen Liu
Guest Editor

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Keywords

  • flexible electronics
  • biodegradable electronics
  • stretchable materials
  • printed electronics
  • bioelectronics
  • electronic waste
  • transistors
  • nanoscale devices
  • soft robotics
  • flexible encapsulation
  • wide-bandgap semiconductors
  • field effect transistors

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Published Papers (1 paper)

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Research

14 pages, 3520 KiB  
Article
Design and Fabrication of Embedded Microchannel Cooling Solutions for High-Power-Density Semiconductor Devices
by Yu Fu, Guangbao Shan, Xiaofei Zhang, Lizheng Zhao and Yintang Yang
Micromachines 2025, 16(8), 908; https://doi.org/10.3390/mi16080908 - 4 Aug 2025
Viewed by 608
Abstract
The rapid development of high-power-density semiconductor devices has rendered conventional thermal management techniques inadequate for handling their extreme heat fluxes. This manuscript presents and implements an embedded microchannel cooling solution for such devices. By directly integrating micropillar arrays within the near-junction region of [...] Read more.
The rapid development of high-power-density semiconductor devices has rendered conventional thermal management techniques inadequate for handling their extreme heat fluxes. This manuscript presents and implements an embedded microchannel cooling solution for such devices. By directly integrating micropillar arrays within the near-junction region of the substrate, efficient forced convection and flow boiling mechanisms are achieved. Finite element analysis was first employed to conduct thermo–fluid–structure simulations of micropillar arrays with different geometries. Subsequently, based on our simulation results, a complete multilayer microstructure fabrication process was developed and integrated, including critical steps such as deep reactive ion etching (DRIE), surface hydrophilic/hydrophobic functionalization, and gold–stannum (Au-Sn) eutectic bonding. Finally, an experimental test platform was established to systematically evaluate the thermal performance of the fabricated devices under heat fluxes of up to 1200 W/cm2. Our experimental results demonstrate that this solution effectively maintains the device operating temperature at 46.7 °C, achieving a mere 27.9 K temperature rise and exhibiting exceptional thermal management capabilities. This manuscript provides a feasible, efficient technical pathway for addressing extreme heat dissipation challenges in next-generation electronic devices, while offering notable references in structural design, micro/nanofabrication, and experimental validation for related fields. Full article
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