Fabrication of Planar Copper Microcoils for Telemetric Orthodontic Applications†
AbstractThe fabrication of electroplated planar copper microcoils for telemetric orthodontic applications is presented. A set of microcoils with overall dimensions of 2 × 2.5 × 0.5 mm3, track widths down to 5 μm and turn numbers up to 35 were fabricated on glass substrates. The coils were electrically characterized and assembled via flip-chip bonding onto a stress-mapping CMOS chip for smart orthodontic brackets. The passive system was successfully read out telemetrically with a reader microcoil for a coil-coil distance of 1 mm at 13.56 MHz. The digital signal representing the measured stress values was extracted telemetrically using a commercially available RFID reader.
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Hafner, J.; Kuhl, M.; Schwaerzle, M.; Hehn, T.; Rossbach, D.; Paul, O. Fabrication of Planar Copper Microcoils for Telemetric Orthodontic Applications. Proceedings 2017, 1, 571.
Hafner J, Kuhl M, Schwaerzle M, Hehn T, Rossbach D, Paul O. Fabrication of Planar Copper Microcoils for Telemetric Orthodontic Applications. Proceedings. 2017; 1(4):571.Chicago/Turabian Style
Hafner, Julian; Kuhl, Matthias; Schwaerzle, Michael; Hehn, Thorsten; Rossbach, Daniel; Paul, Oliver. 2017. "Fabrication of Planar Copper Microcoils for Telemetric Orthodontic Applications." Proceedings 1, no. 4: 571.
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