211 Results Found

The traditional hot-dip tinning processes face challenges in controlling excessive copper dissolution and interfacial instability. This study involved designing a dissolution experiment using the hot-dip tin plating process. Through microscopic chara...

The electromigration behavior of microbumps is inevitably altered under bidirectional currents. Herein, based on a designed test system, the effect of current direction and time proportion of forward current is investigated on Cu Pillar/Ni/Sn-1.8 Ag/...

It is difficult to confirm the existence of intermetallic compounds (IMCs) between SnIn and Cu, as their atomic numbers are very close, making it challenging to differentiate them through experimental tests. In order to determine IMCs and understand...

Electromigration tests of SnAg solder bump samples with 15 μm bump height and Cu under-bump-metallization (UBM) were performed. The test conditions were 1.45 × 104 A/cm2 at 185 °C and 1.20 × 104 A/cm2 at 0 °C. A porous Cu3Sn intermetallic compound (I...

Ni-xCu/Sn soldering joints were aged at 200 °C, and the microstructure evolution and mechanical properties during the solid-state reaction were studied under shear loading. Results showed that the intermetallic compounds (IMCs) exhibited a Cu con...

In this work, the effects of electroplated Cu (EP Cu) and Cu addition (0.7%) in Sn solder on the intermetallic compounds (IMCs) growth and void formation were clarified by comparison with solder joints comprising of high purity Cu (HP Cu) substrate a...

The present study applied Sn–0.7Cu–0.2Zn alloy solders to a photovoltaic ribbon. Intermetallic compounds of Cu6Sn5 and Ag3Sn formed at the Cu/solder/Ag interfaces of the module after reflow. Electron probe microanalyzer images showed that...

Dynamic observation of the microstructure evolution of Sn2.5Ag0.7Cu0.1RE/Cu solder joints and the relationship between the interfacial intermetallic compound (IMC) and the mechanical properties of the solder joints were investigated during isothermal...

Eutectic In-48Sn was considered a promising candidate for low-temperature solder due to its low melting point and excellent mechanical properties. Both Cu2(In,Sn) and Cu(In,Sn)2 formation were observed at the In-48Sn/Cu interface after 160 °C sol...

Sn-9Zn solder is a promising Pb-free solder, but it tends to form bulky intermetallic compounds (IMC) grains at the interface when soldered with common simple metal Cu or Ni substrates. Interfacial reaction between Sn-9Zn solder and Ni(Cu) solid solu...

In this study, we designed and manufactured an ideal electromigration testing device for soldering joints to solve the reliability problems caused by temperature and current density changes in the electromigration processes of micro solder joints. We...

Intermetallic compounds (IMCs) growth can simultaneously bring about low-resistance electrical pathways and drastically reduce joint lifetime. Recently, incorporated trace nanoparticles into the free-Pb solder were found to promote the performance of...

This study investigated the suppression of the growth of the intermetallic compound (IMC) layer that forms between epoxy solder joints and the substrate in electronic packaging by adding graphene nano-sheets (GNSs) to 96.5Sn–3.0Ag–0.5Cu (...

In deep space exploration the exploration equipment will inevitably experience the harsh environment of cryogenic temperature. Solder joints belong to the most vulnerable parts of electronic equipment, and the harsh environment of extreme cryogenic t...

The interface microstructure and shear strength of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal-cycle loading were investigated with scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and physical...

Full intermetallic compound (IMC) solder joints present fascinating advantages in high-temperature applications. In this study, the mechanical properties and elastic anisotropy of η′-Cu6Sn5 and Cu3Sn intermetallic compounds were investigate...

In 3D-system packaging technologies, eutectic bonding is the key technology of multilayer chip stacking and vertical interconnection. Optimized from the aspects of the thickness of the electroplated metal layer, the pretreatment of the wafer surface...

We describe a potentially new species of a platinum cupride–stannide mineral (PCSM) of composition Pt(Cu0.67Sn0.33). It occurs in a placer deposit in the River Bolshoy Khailyk, southern Krasnoyarskiy kray, Russia. A synthetic equivalent of PCSM was o...

Cu6Sn5-xAg alloys (x = 0, 3, 6; %, mass fraction) were synthesized using Ag as a dopant through a high-temperature melting technique. The microstructure of the alloy was analyzed using X-ray diffraction (XRD), scanning electron microscopy (SEM), and...

A new ternary compound Cu2SnTi3 has been synthesized by vacuum sintering at 900 °C. The atomic structures of CaCu5- and InNi2-like Cu2SnTi3 are calculated using density functional theory methods. The X-ray diffraction (XRD) analysis and selected...

Ni–Cu under-bump metallisation (UBM) can reduce stress and improve wetting ability in technology for electronic packaging technology advances with three-dimensional integrated circuit (3D IC) devices. The bond between the Sn-based solder and Ni...

The evolution of the transient liquid-phase sintered (TLPS) Cu–Sn skeleton microstructure during thermal aging was evaluated to clarify the thermal reliability for die-attach applications. The Cu–Sn skeleton microstructure, which consists...

To reduce the use of the toxic Pb element in the Cu-Sn alloy with high friction performance, Cu-xBi-10Sn alloys with different Bi contents were prepared by gravity casting, and the effect of Bi content on the microstructure, mechanical properties and...

The electronic, magnetic and mechanical properties of the quaternary compound Cu2FeSnS4 have been investigated with first principle calculations. Its half-metallicity has been identified with spin polarized band structures and its magnetic originatio...

The aim of this research was a comparative analysis of selected mechanical properties of epoxy compounds that were modified with metallic fillers and aged in aqueous environments. The tested epoxy compounds consisted of three components: styrene modi...

In this work, combined with previous assessments of the Ag-Cu, Ag-Sn and Cu-Sn binary systems, thermodynamic modeling of the Ag-Cu-Sn ternary system was performed using the CALPHAD method using the reported phase diagram data and thermodynamic data....

This study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous...

Formation of intermetallic compounds (IMCs) exhibits remarkable microstructural features and provides opportunities for microstructure control of microelectronic interconnects. Excessive formation of brittle IMCs at the Cu/Sn interface such as η-Cu6S...

Studies have already established that the mechanical properties of Babbitt coatings significantly depend on the microstructural characteristics, such as the amount and distribution of intermetallic compounds dispersed in a soft solid solution matrix....

Solder/Cu joints are important components responsible for interconnection in microelectronics. Construction of the solder/Cu joints through liquid/solid (L/S) reactions accompanies the formation of the Cu–Sn intermetallic compounds (IMCs) at th...

Miniaturization of electronic devices has led to the development of 3D IC packages which require ultra-small-scale interconnections. Such small interconnects can be completely converted into Cu-Sn based intermetallic compounds (IMCs) after reflow. In...

Depending on operating conditions, metals and alloys are exposed to various factors: wear, friction, corrosion, and others. Plasma surface alloying of machine and tool parts is now an effective surface treatment process of commercial and strategic im...

In this study, the interfacial structure and abnormal long-term increase of tensile strength in the interfacial intermetallic compounds (IMCs) between SnAg3Cu0.5 solder and Cu substrates during isothermal aging were investigated. After reflow solderi...

Transient liquid-phase bonding (TLPB) enables the low-temperature fabrication of encapsulated solder joints with high-temperature resistance and electromigration resilience; yet, Ni-Sn TLPB joints suffer from brittle fracture due to intermetallic com...

This study illustrates test results and comparative literature data on the influence of isothermal aging and thermal cycling associated with Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) ball grid array (BGA) solder joints finished with ENIG an...

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58...

We have proposed a low-temperature bonding technology utilizing the sintering of Cu particles with transient liquid-phase of Sn-based solder, called transient liquid-phase sintering (TLPS), as a die-attach solution for high-temperature power modules....

The fracture behavior of the Cu/Sn-3.0Ag-0.5Sn (SAC305)/Cu solder joint was investigated by conducting tensile tests with in situ X-ray micro-computed tomography (μ-CT) observation, and finite element (FE) simulation. The tensile fracture process of...

Electronic devices and their associated sensors are exposed to increasing mechanical, thermal and chemical stress in modern applications. In many areas of application, the electronics are completely encapsulated with thermosets in a single process st...

The use of scaled-down micro-bumps in miniaturized consumer electronic products has led to the easy realization of full intermetallic solder bumps owing to the completion of the wetting layer. However, the direct contact of the intermetallic compound...

Tin sulfide doped with copper (SnS:Cu) thin films were deposited on glass substrates by the ultrasonic spray pyrolysis (USP) technique at different concentration ratios (y = [Cu]/[Sn] = 0% (undoped), 2%, 5% and 10%). The aim of this work is to analyz...

With the rapid iteration of microsystem integrated technology, the miniaturization of electronic devices requires packaging materials with higher reliability. In this work, the microstructure evolution and mechanical properties of novel epoxy composi...

The co-addition of chromium (Cr) and tin (Sn) is known to enhance the wettability between copper (Cu) and graphite (Cgr), but the effect of Sn content remains poorly understood. This study aims to systematically investigate the influence of Sn conten...

In-situ observations of the polymorphic transformation in a single targeted Cu6Sn5 grain constrained between Sn-0.7 wt % Cu solder and Cu-Cu3Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high...

This paper provides results on the tribological behavior of experimental Al–Sn–Pb–Si–Cu–Mg–Zn aluminum alloys and describes the adaptation phenomena that reduce wear intensity during friction with steel. The main f...

It is well-known that Cu–Sn intermetallic compounds are easily produced during reflow process and result in poor reliability of solder bump. Recently, amorphous metallic films have been considered to be the most effective barrier layer because...

As the integration of chips in 3D integrated circuits (ICs) increases and the size of micro-bumps reduces, issues with the reliability of service due to electromigration and thermomigration are becoming more prevalent. In the practical application of...

Copper is the most common interconnecting material in the field of microelectronic packaging, which is widely used in advanced electronic packaging technologies. However, with the trend of the miniaturization of electronic devices, the dimensions of...

In this study, the effects of electromigration on a solder/copper substrate due to temperature and current density stress were investigated. The copper–tin (Cu–Sn) film samples were subjected under a fixed current and various heating cond...

In this work, epoxy was added into commercial Sn-3.0Ag-0.5Cu (SAC305) solder paste to enhance the thermal cycling reliability of the joint. The microstructure and fracture surface were observed using a scanning electron microscope/energy dispersive s...