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Open AccessArticle

Imaging the Polymorphic Transformation in a Single Cu6Sn5 Grain in a Solder Joint

1
Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, Brisbane QLD 4072, Australia
2
Centre of Excellence Geopolymer and Green Technology, School of Materials Engineering, Universiti Malaysia Perlis, Taman Muhibbah, Arau 02600, Malaysia
3
The Ultramicroscopy Research Center, Kyushu University, Fukuoka 819-0395, Japan
4
Department of Applied Quantum Physics and Nuclear Engineering, Kyushu University, Fukuoka 819-0395, Japan
*
Author to whom correspondence should be addressed.
Materials 2018, 11(11), 2229; https://doi.org/10.3390/ma11112229
Received: 16 October 2018 / Revised: 2 November 2018 / Accepted: 7 November 2018 / Published: 9 November 2018
(This article belongs to the Special Issue Material Interconnections and Microstructure Control-Related)
In-situ observations of the polymorphic transformation in a single targeted Cu6Sn5 grain constrained between Sn-0.7 wt % Cu solder and Cu-Cu3Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (HV-TEM) technique. Here, we show that the monoclinic η′-Cu6Sn5 superlattice reflections appear in the hexagonal η-Cu6Sn5 diffraction pattern upon cooling to isothermal 140 °C from 210 °C. The in-situ real space imaging shows that the η′-Cu6Sn5 contrast pattern is initiated at the grain boundary. This method demonstrates a new approach for further understanding the polymorphic transformation behavior on a real solder joint. View Full-Text
Keywords: Cu6Sn5 intermetallic compound; high-voltage transmission electron microscopy; polymorphic phase transformation; electron diffraction; time-temperature transformation Cu6Sn5 intermetallic compound; high-voltage transmission electron microscopy; polymorphic phase transformation; electron diffraction; time-temperature transformation
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MDPI and ACS Style

Somidin, F.; Maeno, H.; Tran, X.Q.; D. McDonald, S.; Mohd Salleh, M.A.A.; Matsumura, S.; Nogita, K. Imaging the Polymorphic Transformation in a Single Cu6Sn5 Grain in a Solder Joint. Materials 2018, 11, 2229.

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