Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging
Abstract
:1. Introduction
2. Materials and Methods
2.1. Materials and Soldering
2.2. Isothermal Aging
2.3. Characterization Methods
3. Results and Discussion
3.1. Interfacial IMC Evolution of the Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints during Isothermal Aging
3.2. Interfacial IMC Growth Kinetics of the Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints during Isothermal Aging
3.3. Mechanical Properties of the Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints during Isothermal Aging
4. Conclusions
Author Contributions
Funding
Conflicts of Interest
References
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Area | Mole Fraction/% | ||
---|---|---|---|
Sn | Cu | Ag | |
A | 93.49 | 5.34 | 1.18 |
B | 24.72 | 75.28 | - |
C | 46.64 | 53.36 | - |
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Zhao, D.; Zhang, K.; Ma, N.; Li, S.; Yin, C.; Huo, F. Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging. Materials 2020, 13, 831. https://doi.org/10.3390/ma13040831
Zhao D, Zhang K, Ma N, Li S, Yin C, Huo F. Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging. Materials. 2020; 13(4):831. https://doi.org/10.3390/ma13040831
Chicago/Turabian StyleZhao, Di, Keke Zhang, Ning Ma, Shijie Li, Chenxiang Yin, and Fupeng Huo. 2020. "Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging" Materials 13, no. 4: 831. https://doi.org/10.3390/ma13040831