Under the operating conditions of high power and high switching frequency, an insulated gate bipolar transistor (IGBT) chip can produce relatively large power loss, causing the junction temperature to rise rapidly; consequently, the reliability of th...
In this paper, the feasibility of applying a multi-branch equivalent model employing first- and second-order Cauer circuits for the analysis of electromagnetic transducers used in systems of wireless power transfer is discussed. A method of formulati...
Insulated-gate bipolar transistor (IGBT) modules exhibit thermal behavior governed by interacting mechanisms spanning carrier transport, chip-scale diffusion, multilayer heat spreading, coolant convection, and thermomechanical response. This study pr...
The Cole–Davidson function is an efficient tool for describing the tissue behavior, but the conventional methods of approximation are not applicable due the form of this function. In order to overcome this problem, a novel scheme for approximat...
Light-emitting diodes are nowadays the most dynamically developing type of light sources. Considering that temperature is the main factor affecting the electrical and lighting parameters of these devices, thermal models are essential subcomponents of...
At present, optical fiber microducts are joined together by mechanical type joints. Mechanical joints are bulky, require more space in multiple duct installations, and have poor water sealing capability. Optical fiber microducts are made of high-dens...
High-voltage fuses are critical safety components in electric vehicle (EV) battery systems, yet their thermal behavior under charging currents remains insufficiently characterized. This study develops and validates a physics-based thermal resistor-ca...
This paper proposes a novel method for optimizing the Cauer-type thermal network model considering both the temperature influence on the extraction of parameters and the errors caused by the physical structure. In terms of prediction of the transient...
Optical fiber microducts are joined together by mechanical joints. These mechanical joints are bulky, require more space per joint, and are prone to air pressure leakage and water seepage during service. A battery powered electrofusion welding system...
Due to the rise of e-mobility applications, there is an increased demand to create more accurate control methods, which can reduce the loss in an e-drive system. The accurate modeling of the rotating machines needs to resolve a partial differential e...
The traditional method of calculating junction temperature does not consider the dependence of a material’s thermal conductivity on temperature, in which the thermal conductivity changes with temperature. However, with an increase in junction t...
There is a growing demand in the semiconductor industry to integrate many functionalities on a single portable device. The integration of sensor fabrication with the mature CMOS technology has made this level of integration a reality. However, sensor...
When a high-power radio frequency (RF) metal oxide semiconductor field effect transistor (MOSFET) works in low-efficiency situations, considerable power is dissipated into heat, resulting in an excessive junction temperature and a likely failure. In...
Accurate fault simulation and failure prediction have long been challenges for SiC MOSFETs users. This paper presents a behavior model of Silicon Carbide (SiC) double-implanted MOSFET (DMOSFET), considering thermal-runaway failures in short-circuit a...
Accurately simulating fuses is challenging because the fuse behavior is affected by a variety of thermal and electrical factors. This paper presents a SPICE fuse model and its parameterization procedure. The model mimics the physical behavior of the...
This paper presents a method for determining the equivalent circuit parameters of magnetically coupled air-core coils used in wireless power transfer (WPT) systems. The proposed approach enables fast and accurate modeling of inductively coupled energ...
Reliable multilevel inverter IGBT modules require precise loss and heat management, particularly in severe traction applications. This paper presents a comprehensive modeling framework for three-level T-type neutral-point clamped (TNPC) inverters usi...