Announcements

MDPI will be attending the 23rd International Conference on Solid-State Sensors, Actuators and Microsystems in Orlando, Florida, USA. The conference will begin on Sunday, 29 June 2025, with short courses providing a scholarly introduction and overview of some selected topics of interest, which will help academics and professionals become familiar with the latest trends in the field; the topics of the short courses will be announced shortly. Conference registration will also open on 29 June, with a welcome reception at which attendees can meet and greet each other at that evening. The conference technical program will begin on the morning of 30 June, with plenary sessions that will then breakout into parallel sessions, industry talks, and poster sessions throughout the duration of the conference. The exhibition portion, which will take place from 30 June through 3 July, is designed to give companies, start-ups, and scientific associations the opportunity to share information about or demonstrate their latest advances, products, and/or services. We welcome you to visit the MDPI booth, number 29, where you can have face-to-face exchanges with our representatives, learn more about our open access publishing services, and receive gifts. The program has been designed to provide plenty of opportunities for technical exchange and professional networking.

The following MDPI journals will be represented at the conference:

• Sensors;
• Micromachines;
• Biosensors;
• JETA;
• Nanomaterials;
• JSAN;
• JLPEA;
• Electronics;
• Biomimetics;
• Nanomanufacturing;
• Chemosensors;
• Acoustics;
• Magnetism.

If you are attending this conference, please feel free to start a conversation with us at our booth. Our delegates look forward to meeting you in person and answering any questions that you may have.

Conference: 2025 International Conference on Intelligent Systems
Date: 19−21 April 2025
Location: Seoul, South Korea

The ISDEA 2025 conference provides an idea-exchange and discussion platform for the world’s engineers and academia to share cutting-edge information, address the hottest issue in Intelligent Systems Design and Engineering Applications, explore new technologies, and exchange and build upon ideas.

MDPI will be attending the conference as exhibitors. We welcome researchers from various backgrounds to visit and share their latest ideas with us.

The following MDPI journals will be represented:

• Electronics;
• Eng;
• Technologies;
• JLPEA;
• AI;
• Signals;
• Smart Cities;
• BDCC;
• Applied Mechanics;
• Machines;
• Biomimetics;
• Designs;
• JETA.

If you plan to attend this conference, please contact us online. Our delegates look forward to meeting you in person at our booth and answering any questions you may have. For more information about the conference, please visit the following website: https://www.isdea.org/.

The “Microwave and Wireless Communications” Section publishes articles on advanced theories and technologies across a wide research spectrum. The scope covers microwave and millimeter wave communication, including radar sensors, from fundamentals to applications, elements, systems, hardware, software, methodological theory, and measurements. Overall, we hope to present state-of-the-art technologies in this Section.

Due to the open access format of Electronics (ISSN: 2079-9292), you have free and unlimited access to all full-text articles in our journal. We welcome you to read the most highly cited papers published in our journal in 2023, listed below.

1. “Analysis of Challenges and Solutions of IoT in Smart Grids Using AI and Machine Learning Techniques: A Review”
by Tehseen Mazhar, Hafiz Muhammad Irfan, Inayatul Haq, Inam Ullah, Madiha Ashraf, Tamara Al Shloul, Yazeed Yasin Ghadi, Imran and Dalia H. Elkamchouchi
Electronics 2023, 12(1), 242; https://doi.org/10.3390/electronics12010242
Available online: https://www.mdpi.com/2079-9292/12/1/242

2. “Smart Load-Based Resource Optimization Model to Enhance the Performance of Device-to-Device Communication in 5G-WPAN”
by Jaganathan Logeshwaran, Thangavel Kiruthiga, Raju Kannadasan, Loganathan Vijayaraja, Ali Alqahtani, Nayef Alqahtani and Abdulaziz A. Alsulami
Electronics 2023, 12(8), 1821; https://doi.org/10.3390/electronics12081821
Available online: https://www.mdpi.com/2079-9292/12/8/1821

3. “From 5G to beyond 5G: A Comprehensive Survey of Wireless Network Evolution, Challenges, and Promising Technologies”
by Ali Sufyan, Khan Bahadar Khan, Osama A. Khashan, Talha Mir and Usama Mir
Electronics 2023, 12(10), 2200; https://doi.org/10.3390/electronics12102200
Available online: https://www.mdpi.com/2079-9292/12/10/2200

4. “A Review of Indoor Positioning Systems for UAV Localization with Machine Learning Algorithms”
by Chamali Sandamini, Madduma Wellalage Pasan Maduranga, Valmik Tilwari, Jamaiah Yahaya, Faizan Qamar, Quang Ngoc Nguyen and Siti Rohana Ahmad Ibrahim
Electronics 2023, 12(7), 1533; https://doi.org/10.3390/electronics12071533
Available online: https://www.mdpi.com/2079-9292/12/7/1533

5. “Effective Resource Allocation Technique to Improve QoS in 5G Wireless Network”
by Ramkumar Jayaraman, Baskar Manickam, Suresh Annamalai, Manoj Kumar, Ashutosh Mishra and Rakesh Shrestha
Electronics 2023, 12(2), 451; https://doi.org/10.3390/electronics12020451
Available online: https://www.mdpi.com/2079-9292/12/2/451

6. “A Detailed Survey on Federated Learning Attacks and Defenses”
by Hira Shahzadi Sikandar, Huda Waheed, Sibgha Tahir, Saif U. R. Malik and Waqas Rafique
Electronics 2023, 12(2), 260; https://doi.org/10.3390/electronics12020260
Available online: https://www.mdpi.com/2079-9292/12/2/260

7. “A Review on Cell-Free Massive MIMO Systems”
by Joumana Kassam, Daniel Castanheira, Adão Silva, Rui Dinis and Atílio Gameiro
Electronics 2023, 12(4), 1001; https://doi.org/10.3390/electronics12041001
Available online: https://www.mdpi.com/2079-9292/12/4/1001

8. “Programmable Beam-Steering Capabilities Based on Graphene Plasmonic THz MIMO Antenna via Reconfigurable Intelligent Surfaces (RIS) for IoT Applications”
by Sherif A. Khaleel, Ehab K. I. Hamad, Naser Ojaroudi Parchin and Mohamed B. Saleh
Electronics 2023, 12(1), 164; https://doi.org/10.3390/electronics12010164
Available online: https://www.mdpi.com/2079-9292/12/1/164

9. “A Study on Multi-Antenna and Pertinent Technologies with AI/ML Approaches for B5G/6G Networks”
by Maraj Uddin Ahmed Siddiqui, Faizan Qamar, Syed Hussain Ali Kazmi, Rosilah Hassan, Asad Arfeen and Quang Ngoc Nguyen
Electronics 2023, 12(1), 189; https://doi.org/10.3390/electronics12010189
Available online: https://www.mdpi.com/2079-9292/12/1/189

10. “Drone Detection Method Based on MobileViT and CA-PANet”
by Qianqing Cheng, Xiuhe Li, Bin Zhu, Yingchun Shi and Bo Xie
Electronics 2023, 12(1), 223; https://doi.org/10.3390/electronics12010223
Available online: https://www.mdpi.com/2079-9292/12/1/223

11. “Enhancing Privacy-Preserving Intrusion Detection through Federated Learning”
by Ammar Alazab, Ansam Khraisat, Sarabjot Singh and Tony Jan
Electronics 2023, 12(16), 3382; https://doi.org/10.3390/electronics12163382
Available online: https://www.mdpi.com/2079-9292/12/16/3382

All articles published in Electronics (ISSN: 2079-9292) are open access, and as such, you have free and unlimited access to the full text of all articles. We welcome you to read our notable papers in the field of artificial intelligence in electronics, which are listed below:

1. “YOLO-Drone: An Optimized YOLOv8 Network for Tiny UAV Object Detection”
by Xianxu Zhai, Zhihua Huang, Tao Li, Hanzheng Liu and Siyuan Wang
Electronics 2023, 12(17), 3664; https://doi.org/10.3390/electronics12173664
Available online: https://www.mdpi.com/2079-9292/12/17/3664

2. “A Scenario-Generic Neural Machine Translation Data Augmentation Method”
by Xiner Liu, Jianshu He, Mingzhe Liu, Zhengtong Yin, Lirong Yin and Wenfeng Zheng
Electronics 2023, 12(10), 2320; https://doi.org/10.3390/electronics12102320
Available online: https://www.mdpi.com/2079-9292/12/10/2320

3. “Enhancing Electrical Load Prediction Using a Bidirectional LSTM Neural Network”
by Christos Pavlatos, Evangelos Makris, Georgios Fotis, Vasiliki Vita and Valeri Mladenov
Electronics 2023, 12(22), 4652; https://doi.org/10.3390/electronics12224652
Available online: https://www.mdpi.com/2079-9292/12/22/4652

4. “Intelligent Robotics—A Systematic Review of Emerging Technologies and Trends”
by Josip Tomo Licardo, Mihael Domjan and Tihomir Orehovački
Electronics 2024, 13(3), 542; https://doi.org/10.3390/electronics13030542
Available online: https://www.mdpi.com/2079-9292/13/3/542

5. “Machine Learning and AI Technologies for Smart Wearables”
by Kah Phooi Seng, Li-Minn Ang, Eno Peter and Anthony Mmonyi
Electronics 2023, 12(7), 1509; https://doi.org/10.3390/electronics12071509
Available online: https://www.mdpi.com/2079-9292/12/7/1509

6. “IoT-Based Intrusion Detection System Using New Hybrid Deep Learning Algorithm”
by Sami Yaras and Murat Dener
Electronics 2024, 13(6), 1053; https://doi.org/10.3390/electronics13061053
Available online: https://www.mdpi.com/2079-9292/13/6/1053

7. “Depression Detection in Speech Using Transformer and Parallel Convolutional Neural Networks”
by Faming Yin, Jing Du, Xinzhou Xu, and Li Zhao
Electronics 2023, 12(2), 328; https://doi.org/10.3390/electronics12020328
Available online: https://www.mdpi.com/2079-9292/12/2/328

8. “Predictive Maintenance for Distribution System Operators in Increasing Transformers’ Reliability”
by Vasiliki Vita, Georgios Fotis, Veselin Chobanov, Christos Pavlatos and Valeri Mladenov
Electronics 2023, 12(6), 1356; https://doi.org/10.3390/electronics12061356
Available online: https://www.mdpi.com/2079-9292/12/6/1356

9. “Combining Machine Learning and Edge Computing: Opportunities, Challenges, Platforms, Frameworks, and Use Cases”
by Piotr Grzesik and Dariusz Mrozek
Electronics 2024, 13(3), 640; https://doi.org/10.3390/electronics13030640
Available online: https://www.mdpi.com/2079-9292/13/3/640

10. “Combining Machine Learning and Edge Computing: Opportunities, Challenges, Platforms, Frameworks, and Use Cases”
by J. de Curtò, I. de Zarzà, Gemma Roig, Juan Carlos Cano, Pietro Manzoni and Carlos T. Calafate
Electronics 2023, 12(13), 2814; https://doi.org/10.3390/electronics12132814
Available online: https://www.mdpi.com/2079-9292/12/13/2814

We would like to invite you to view and submit relevant papers to the journal Electronics.

Electronics Editorial Office

The primary focus of the “Computer Science & Engineering” Section in Electronics (ISSN: 2079-9292) is the field of advanced computer science and engineering. It presents high-quality papers that address state-of-the-art technology, including deep tech, edge computing, fog computing, artificial intelligence, machine learning, deep learning, emotional systems, fintech, blockchain, IoT, Industry 4.0, smart cities, smart grids, intelligent textiles, distributed computing, and other significant technologies in this field.

As they are of an open access format, you have free and unlimited access to the full text of all the articles published in our journal. We welcome you to read our most downloaded papers in 2024 below:

“A Systematic Review of Synthetic Data Generation Techniques Using Generative AI”
by Mandeep Goyal and Qusay H. Mahmoud
Electronics 2024, 13(17), 3509; https://doi.org/10.3390/electronics13173509
Full text available online: https://www.mdpi.com/2079-9292/13/17/3509

“The Challenges of Machine Learning: A Critical Review”
by Enrico Barbierato and Alice Gatti
Electronics 2024, 13(2), 416; https://doi.org/10.3390/electronics13020416
Full text available online: https://www.mdpi.com/2079-9292/13/2/416

“A Social Perspective on AI in the Higher Education System: A Semisystematic Literature Review”
by Budur Turki Alshahrani, Salvatore Flavio Pileggi and Faezeh Karimi
Electronics 2024, 13(8), 1572; https://doi.org/10.3390/electronics13081572
Full text available online: https://www.mdpi.com/2079-9292/13/8/1572

“Prompt Engineering in Healthcare”
by Rajvardhan Patil, Thomas F. Heston and Vijay Bhuse
Electronics 2024, 13(15), 2961; https://doi.org/10.3390/electronics13152961
Full text available online: https://www.mdpi.com/2079-9292/13/15/2961

“Cardiac Healthcare Digital Twins Supported by Artificial Intelligence-Based Algorithms and Extended Reality—A Systematic Review”
by Zofia Rudnicka, Klaudia Proniewska, Mark Perkins and Agnieszka Pregowska
Electronics 2024, 13(5), 866; https://doi.org/10.3390/electronics13050866
Full text available online: https://www.mdpi.com/2079-9292/13/5/866

“How Artificial Intelligence (AI) Is Powering New Tourism Marketing and the Future Agenda for Smart Tourist Destinations”
by Lázaro Florido-Benítez and Benjamín del Alcázar Martínez
Electronics 2024, 13(21), 4151; https://doi.org/10.3390/electronics13214151
Full text available online: https://www.mdpi.com/2079-9292/13/21/4151

“Survey on AI Applications for Product Quality Control and Predictive Maintenance in Industry 4.0”
by Tojo Valisoa Andrianandrianina Johanesa, Lucas Equeter and Sidi Ahmed Mahmoudi
Electronics 2024, 13(5), 976; https://doi.org/10.3390/electronics13050976
Full text available online: https://www.mdpi.com/2079-9292/13/5/976  

“IoT Solutions with Artificial Intelligence Technologies for Precision Agriculture: Definitions, Applications, Challenges, and Opportunities”
by Elisha Elikem Kofi Senoo, Lia Anggraini, Jacqueline Asor Kumi, Luna Bunga Karolina, Ebenezer Akansah, Hafeez Ayo Sulyman, Israel Mendonça and Masayoshi Aritsugi
Electronics 2024, 13(10), 1894; https://doi.org/10.3390/electronics13101894
Full text available online: https://www.mdpi.com/2079-9292/13/10/1894

“A Survey of Intelligent End-to-End Networking Solutions: Integrating Graph Neural Networks and Deep Reinforcement Learning Approaches”
by Prohim Tam, Seyha Ros, Inseok Song, Seungwoo Kang and Seokhoon Kim
Electronics 2024, 13(5), 994; https://doi.org/10.3390/electronics13050994
Full text available online: https://www.mdpi.com/2079-9292/13/5/994

MDPI is excited to announce its participation as an exhibitor at the 2025 International Conference on Unmanned Aircraft Systems (ICUAS), which will be held in Charlotte, USA, from 14 to 17 May 2025.

ICUAS 2025 will focus on the civil and public domain applications of unmanned aviation and its impact on society. This conference provides opportunities for collaboration and interaction across technical, regulatory, and legal communities.

The conference will focus on the following topics:

• Aerial manipulation;
• Bio-inspired aerial robots;
• Multi-UAV systems;
• Learning-based perception;
• Navigation and control;
• Autonomous operations.

The following MDPI journals will be represented:

• Drones;
• Automation;
• Imaging;
• Actuators;
• Designs;
• Smart Cities;
• Applied Mechanics;
• Sensors;
• Aerospace;
• Standards;
• Biomimetics;
• Signals;
• Electronics;
• Remote Sensing;
• JSAN.

Discover how MDPI can support your research and academic goals. Our team will be at the booth to discuss MDPI’s submission process, editorial support, and the benefits of open access publishing. Plus, enjoy exciting gifts and exclusive resources available only at our booth!

If you are planning to attend the conference, we would love to connect with you! Our delegates are eager to meet you in person and answer any questions you may have. For more details about the conference, please visit the following website: https://uasconferences.com/2025_icuas/. We look forward to seeing you there!

MDPI is excited to collaborate with the University of Valencia, Spain, to host an exclusive author workshop aimed at empowering researchers with the knowledge and tools needed for successful academic publishing. This workshop will cover key aspects of MDPI’s open access publishing model, including journal selection, editorial workflow, and publication ethics. Participants will receive practical tips on improving their scientific writing and addressing reviewer comments, guided by experienced editors.

Date: 27 May 2025
Time: 12:30–14:00
Venue: ETSE, Valencia University
Registration link: https://www.surveymonkey.com/r/LVVGW55

Schedule:

Chairs:

Dr. José Martin and Dr. Rafael Magdalena
University of Valencia, Department of Electronic Engineering, Valencia, Spain

Speakers:

In collaboration with Newcastle Australia Institute of Higher Education (NAIHE) and Singapore University of Technology and Design (SUTD), MDPI is hosting the MDPI Scientific Publishing Exchange. This workshop aims to empower researchers and graduate students with essential skills for academic publishing and professional development. The programme will feature a 2–3-hour session to cover manuscript preparation, submission processes, and strategies for successful publishing, with additional sharing sessions delivered by the faculty members of NAIHE and SUTD.

Participants will also have opportunities to engage in discussions and network with peers and experts. Designed to be both practical and insightful, this workshop will provide attendees with tools to excel in their academic and research endeavours.

Date: 24 April 2025
Time: 9:30 a.m.–4:50 p.m.
Venue: Newcastle Australia Institute of Higher Education, Bugis Junction Tower, 230 Victoria Street 04-09/10, Singapore 188024

Seats are limited and available on a first-come, first-served basis. Registrations using an institutional email address will be prioritized.

Registration: https://www.surveymonkey.com/r/Y9ZGW6K.

Schedule:

MDPI will be attending the 2025 International Conference on Electronics Packaging and iMAPs All Asia Conference (ICEP-IAAC 2025) in Nagano, Japan, which will take place from 15 to 19 April 2025. ICEP is Japan’s largest international conference on electronic packaging, attracting more than 360 attendees and hosting roughly 35 technical sessions. The conference comprises technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless components, interconnections, materials and processes, optoelectronics, power electronics integration, and thermal management. 

The following MDPI journals will be represented at the conference:

• Electronics;
• Applied Sciences;
• Chips;
• Hardware;
• Journal of Experimental and Theoretical Analyses;
• Journal of Low Power Electronics and Applications;
• Journal of Sensor and Actuator Networks;
• Materials;
• Micromachines;
• Technologies. 

If you are planning to attend the above conference, please visit our booth. Our delegates look forward to meeting you in person and answering any questions that you may have. For more information about this conference, please visit the following website: https://www.jiep.or.jp/icep/.

We are pleased to announce that Prof. Bo Ai has been appointed as an Associate Editor of Electronics (ISSN: 2079-9292).

Prof. Bo Ai is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE), a Fellow of the Asia-Pacific Artificial Intelligence Association (AAIA), and a Fellow of the Institution of Engineering and Technology (IET). He currently serves as the Dean of the School of Electronic and Information Engineering at Beijing Jiaotong University, China, where he is also a professor and Ph.D. supervisor.

His research focuses on broadband mobile communication systems, dedicated mobile communications, communication engineering, and artificial intelligence.

We extend our sincere congratulations to Prof. Ai and wish him great success in both his research and his contributions to the development of the journal.

Electronics is recruiting scholars from around the world to join our Editorial Board. To apply for membership, recommend potential candidates, or request further information, please contact the Electronics Editorial Office (electronics@mdpi.com) and provide the following files:

• A full academic CV;
• A short cover letter that details your interest in the position.

Electronics Editorial Office