Table of Contents
Micromachines, Volume 11, Issue 6 (June 2020) – 87 articles
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Cover Story (view full-size image) In this study, an alternative fan-out wafer-level packaging (FOWLP) concept implementing additively [...] Read more. In this study, an alternative fan-out wafer-level packaging (FOWLP) concept implementing additively manufactured redistribution layers (RDLs) for capacitive micromachined ultrasound transducer (CMUT) array packaging was proposed. The printed RDLs served as an interconnect between capacitive microphones and speakers, operating in the ultrasonic domain, with corresponding application-specific integrated circuits (ASICs), which allow features such as touchless activation or control using gestures. View this paper