Special Issue "Selected Papers from the ICAE 2019"

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: 15 March 2020.

Special Issue Editors

Prof. Dong-Weon Lee
E-Mail Website
Guest Editor
School of Mechanical Engineering, Chonnam National University, Korea
Interests: energy harvester; Biomedical MEMS; micro- and nano-fabrication; cantilevers
Prof. Jeong-Bong Lee
E-Mail Website
Guest Editor
Erik Jonsson School of Engineering and Computer Science, RL 10 The University of Texas at Dallas, 800 W. Campbell Rd., Richardson, TX 75080, USA
Interests: biomedical MEMS; RF MEMS; nanophotonics; MEMS packaging
Special Issues and Collections in MDPI journals
Prof. Hongsoo Choi
E-Mail Website
Guest Editor
Department of Robotics Engineering, Daegu Gyeongbuk Institute of Science & Technology, Daegu, Korea
Interests: piezoelectric MEMS; microrobot; biomedical MEMS; micromachined ultrasonic transducer
Prof. Dr. Sang-Jae Kim
E-Mail Website1 Website2
Guest Editor
Department of Mechatronics Engineering, Jeju National University, Korea
Interests: self-charging power cell; hybrid fuel cell; energy harvesting; nanogenerator; nano biosensor
Special Issues and Collections in MDPI journals

Special Issue Information

Dear Colleagues,

This Special Issue will publish selected papers from the 5th International Conference on Advanced Electromaterials (ICAE 2019, http://www.icae.kr/), 5-8 November 2019, in Jeju, Korea.

The ICAE is a bi-annual conference series hosted by The Korean Institute of Electrical and Electronic Material Engineers focusing on all aspects of "electromaterials". We welcome manuscripts on the following topics:

  • ferroelectric and piezoelectric materials and devices;
  • green energy materials and devices;
  • solar cells and fuel cells;
  • functional thin films and devices;
  • energy storage materials and devices;
  • transparent electronics;
  • printable electronics;
  • smart nano-materials and devices;
  • emerging optoelectronic materials and devices based on LEDs and OLEDs;
  • biomedical materials and devices.

Papers attracting most interest at the conference, or that provide novel contributions, have been selected for publication in Micromachines. These papers will be peer-reviewed for validation of research results, developments and applications.

Prof. Dong-Weon Lee
Prof. Jeong-Bong Lee
Prof. Hongsoo Choi
Prof. Sang-Jae Kim
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers (3 papers)

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Research

Open AccessArticle
Development of a Piezo-Driven Liquid Jet Dispenser with Hinge-Lever Amplification Mechanism
Micromachines 2020, 11(2), 117; https://doi.org/10.3390/mi11020117 - 21 Jan 2020
Abstract
Owing to the quick response, compact structure, high precision, huge blocking force generation, and ease of operation, piezoelectric actuators are urgently being adopted in the field of advanced dispensing for jetting performance improvement and fulfillment of precision requirements in microelectronics packaging, adhesive bonding, [...] Read more.
Owing to the quick response, compact structure, high precision, huge blocking force generation, and ease of operation, piezoelectric actuators are urgently being adopted in the field of advanced dispensing for jetting performance improvement and fulfillment of precision requirements in microelectronics packaging, adhesive bonding, and miniaturization industry. This research focuses on the fundamental design and development of a piezo-electrically driven compact fluid dispenser using the principle of a class-one lever for amplification of needle displacement, and enhancement of application areas of the developed jet dispenser. Using fundamental lever principle, geometry-based modelling is carried out to fabricate a working prototype of a normally closed hinge-lever type dispenser. Preliminary experiments are carried out to witness the workability of the fabricated dispenser to deliver 100 dots of working fluid per second that will provide a novel device for dispensing of various fluids, and the proposed amplification mechanism suits various other piezoelectric applications as well. Full article
(This article belongs to the Special Issue Selected Papers from the ICAE 2019)
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Open AccessArticle
Role of a 193 nm ArF Excimer Laser in Laser-Assisted Plasma-Enhanced Chemical Vapor Deposition of SiNx for Low Temperature Thin Film Encapsulation
Micromachines 2020, 11(1), 88; https://doi.org/10.3390/mi11010088 - 13 Jan 2020
Abstract
In this study, silicon nitride thin films are deposited on organic polyethylene-naphthalate (PEN) substrates by laser assisted plasma enhanced chemical vapor deposition (LAPECVD) at a low temperature (150 °C) for the purpose of evaluating the encapsulation performance. A plasma generator is placed above [...] Read more.
In this study, silicon nitride thin films are deposited on organic polyethylene-naphthalate (PEN) substrates by laser assisted plasma enhanced chemical vapor deposition (LAPECVD) at a low temperature (150 °C) for the purpose of evaluating the encapsulation performance. A plasma generator is placed above the sample stage as conventional plasma enhanced chemical vapor deposition (PECVD) configuration, and the excimer laser beam of 193 nm wavelength illuminated in parallel to the sample surface is coupled to the reaction zone between the sample and plasma source. Major roles of the laser illumination in LAPECVD process are to compete with or complement the plasma decomposition of reactant gases. While a laser mainly decomposes ammonia molecules in the plasma, it also contributes to the photolysis of silane in the plasma state, possibly through the resulting hydrogen radicals and the excitation of intermediate disilane products. It will also be shown that the LAPECVD with coupled laser illumination of 193 nm wavelength improves the deposition rate of silicon nitride thin film, and the encapsulation performance evaluated via the measurement of water vapor transmission rate (WVTR). Full article
(This article belongs to the Special Issue Selected Papers from the ICAE 2019)
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Open AccessArticle
Process Optimization of Via Plug Multilevel Interconnections in CMOS Logic Devices
Micromachines 2020, 11(1), 32; https://doi.org/10.3390/mi11010032 - 25 Dec 2019
Abstract
This paper reports on the optimization of the device and wiring in a via structure applied to multilevel metallization (MLM) used in CMOS logic devices. A MLM via can be applied to the Tungsten (W) plug process of the logic device by following [...] Read more.
This paper reports on the optimization of the device and wiring in a via structure applied to multilevel metallization (MLM) used in CMOS logic devices. A MLM via can be applied to the Tungsten (W) plug process of the logic device by following the most optimized barrier deposition scheme of RF etching 200 Å IMP Ti (ion metal plasma titanium) 200 Å CVD TiN (titanium nitride deposited by chemical vapor deposition) 2 × 50 Å. The resistivities of the glue layer and barrier, i.e., IMP Ti and CVD TiN, were 73 and 280 μΩ·cm, respectively, and the bottom coverages were 57% and 80%, respectively, at a 3.2:1 aspect ratio (A/R). The specific resistance of the tungsten film was approximately 11.5 μΩ·cm, and it was confirmed that the via filling could be performed smoothly. RF etching and IMP Ti should be at least 200 Å each, and CVD TiN can be performed satisfactorily with the existing 2 × 50 Å process. Tungsten deposition showed no difference in the via resistance with deposition temperature and SiH4 reduction time. When the barrier scheme of RF etching 200 Å IMP Ti 200 ÅCVD TiN 2 × 50 Å was applied, the via resistance was less than 20 Ω, even with a side misalignment of 0.05 μm and line-end misalignment of ~0.1 μm. Full article
(This article belongs to the Special Issue Selected Papers from the ICAE 2019)
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