Conferences

The IEEE International Workshop on Advances in Sensors and Interfaces (IWASI) is a premier bi-annual workshop on sensors and sensor interfaces that for 20 years has presented advances and disruptive solutions in the fields of software, architecture, design, manufacturing, and materials for sensors and integrated circuits.

The 9th IEEE International Workshop on Advances in Sensors and Interfaces focuses on the modeling, analysis, design, and development of embedded cyber-physical systems, sensors, and actuators for personalized medicine and healthcare applications, machine learning for low-power embedded systems and smart sensing applications, high-energy physics, chemical sensing, autonomous sensors and interfaces, hardware and software co-design for security, and cryptography, cybersecurity, autonomous driving, and security for airplanes and trains.

Papers are solicited covering, but not limited to, the following topics:

• Sensors and actuators for personalized medicine and healthcare applications
• Brain–computer interfaces: from algorithm to implementation
• Remote sensing applications for environmental control
• Sensor systems for robotics and Industry 4.0
• Smart sensors and devices for artificial intelligence
• Sensor systems for autonomous driving in the railway and automotive industries
• Embedded sensor systems for near-sensor computing
• High-energy physics
• Ultra-low power communication devices for sensor networks
• Biochemical sensors, labs on a chip, multi-electrode arrays, and their interfaces
• Sensor interfaces: analog and digital sensor data processing architectures and ICs
• Novel testing and modeling techniques for sensor systems
• Printed, flexible, biodegradable, and biocompatible sensors and interfaces
• New materials and new technologies for sensors, including 1D and 2D materials
• Remote sensors for applications at multi-acquisition levels and resolutions
• Three-dimensional (3D) materials and techniques for sensing-oriented additive manufacturing
• Energy harvesters and self-powered sensors for portable and smart electronics
• Label-free sensors for biomedical and environmental monitoring
• Wireless technologies for IoT applications

Additional conference information:

https://mclabservices.di.uniroma1.it/iwasi/2023/index.php

LPM2023—the 24th International Symposium on Laser Precision Microfabrication—will be held from June 13 to June 16, 2023, as an "in-person" conference in Hirosaki city, Aomori prefecture, Japan.

AIM AND SCOPE 

Miniaturization and high precision are rapidly becoming requirements in many industrial processes and products. Consequently, there is greater interest regarding the use of laser micro fabrication approaches to achieve these goals. The International Symposium on Laser Precision Microfabrication (LPM) is alternatively held in Japan and in other host countries. To date, the LPM symposium has been successfully hosted in Omiya, Singapore, Osaka, Munich, Nara, Williamsburg, Kyoto, Vienna, Quebec, Kobe, Stuttgart, Takamatsu, Washington D.C., Niigata, Vilnius, Kokura, Xi'an, Toyama, Edinburgh, Hiroshima, and Dresden. The aim of this symposium is to provide a forum for the discussion of the fundamental aspects of laser–matter interaction, the state of the art regarding the processing of laser materials, and topics for the next generation with respect to fundamental scientists, end users, and laser manufactures. We expect that LPM2023 will play an important role in terms of both aiding its participants’ comprehension of laser precision microfabrication as well as forecasting future technologies to be developed and the prospects of the future laser market. 

For more conference information, please see the following link:

http://www.jlps.gr.jp/lpm/lpm2023/

The International Conference on Electronic Packaging Technology (ICEPT) has been recognized as one of the top four electronic packaging academic conferences, and is hosted by the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), IEEE Electronics Packaging Society (IEEE-EPS), and Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics (CIE-EMPT), and is organized by the Beijing branch of IEEE-EPS and Bei Jing Heng Ren Zhi Xin Consulting Company, China. ICEPT is held in China every year, with conference topics including Packaging Design, Manufacturing Technologies, R&D, Photonics, MEMS, System Integrated Packaging, etc. Since it was inaugurated in 1994, ICEPT has been held by the Tsinghua University, Fudan University, Harbin Institute of technology, Huazhong University of Science and Technology, Shanghai Jiaotong University, Xi'an University of Electronic Science and Technology, Shanghai University, Guilin University of Electronic Science and Technology, Dalian University of Technology, University of Electronic Science and Technology, Central South University, Hong Kong University of Science and Technology, Guangdong University of Technology, and other universities for more than 20 sessions. It is supported by relevant government units at all levels. ICEPT attracts a large number of domestic and foreign universities, research institutions, electronic packaging manufacturers, more than 500 well-known experts, scholars, and business people from about 20 countries and regions. 

http://www.icept.org/

The International Conference of Reliable Systems Engineering (ICoRSE) is a well-established conference that provides opportunities to both researchers in academia and professionals of the industry to exchange new ideas and application experiences, to establish business or research relations, and to find global partners for future collaboration. 

The conference aims to promote scientific research results and technological development in reliable systems engineering, cyber–physical systems, mechatronics, applied mechanics, and complementary fields, by facilitating the interaction and exchange of experience and good practice between specialists in universities, research institutes and private companies. 

For more details about the conference, please click here to download the Call For Papers (CFP). 

MAIN TOPICS: 

The Main Topics of the event include the following:

• Mechatronics, integronics and adaptronics;
• Reliable systems engineering;
• Cyber–physical systems;
• Optics;
• Theoretical and applied mechanics;
• High-tech mechatronic, micro-mechatronic and nano-mechatronic systems;
• Mechatronic processes in production and smart integrated control;
• Smart mechatronic system production and control;
• Robotics, micro-robotics and nano-robotics;
• Modeling and simulation in mechanics and mechatronics;
• Integrated smart control systems;
• Computer image and imaging processing;
• Smart bio-medical and bio-mechatronic systems;
• MEMS and NEMS;
• New materials;
• Sensors and transducers;
• System and computer engineering;
• Nano-chemistry and physical chemistry of biological systems;
• Micro- and nanotechnology;
• System optimization;
• Communication and distributed smart systems. 

More conference information: 

http://www.icorseng.eu/#welcome

The 2023 9th International Conference on Mechanical Engineering and Automation Science (ICMEAS 2023) will be held in Xi'an, China, on Oct. 13–15, 2023, which is organized by Xi'an Jiaotong University, technically sponsored by York University, Capitol Technology University and China University of Mining and Technology, China University of Geosciences (Wuhan) and Hong Kong Society of Mechanical Engineers (HKSME). The ICMEAS has been held for 8 years since 2015 with 8 successful conferences online and in Wuhan, Beijing, Birmingham, Singapore and Hong Kong, attracting a large number of researchers, scholars and students from all over the world. The ICMEAS conference will provide a wonderful forum for you to update your knowledge base and explore the innovations in Mechanical Engineering and Automation Science. The conference will strive to offer you plenty of networking opportunities to meet and interact with the leading scientists, engineers and researchers, friends and colleagues as well as sponsors and exhibitors. We warmly welcome prospected authors to submit your new research papers to ICMEAS 2023 and share your valuable experiences with all of the attendees. 

Micromachines has set up a Special Issue of "Selected Papers from the 9th International Conference on Mechanical Engineering and Automation Science (ICMEAS 2023)", which will publish selected papers from this conference.

We aim to collect high-quality research papers and review articles from ICMEAS, which focus on mechanical design, actuator/sensor, advanced manufacturing, automation method & technology, robotic system, and related cutting-edge multidisciplinary fields. 

More Special Issue information: https://www.mdpi.com/journal/micromachines/special_issues/Z3T3WV6Z85

More Conference information: 

https://www.icmeas.org/

The 25th Annual Conference of the Chinese Society of Micro-Nano Technology and the 14th International Conference of the Chinese Society of Micro-Nano Technology (CSMNT2023) will be held between October 20 and 23, 2023 in Shenzhen, China. The conferences will be hosted by the Chinese Society of Micro-Nano Technology, and organized by Tsinghua Shenzhen International Graduate School, Peking University ShenZhen Graduate School, the Harbin Institute of Technology, and Shenzhen Society of Micro-Nano Technology. The theme of this conference is "Magical Micro-Nano • Wonderful World"; 10-12 leading experts will be invited to deliver plenary speeches. CSMNT2023 will focus in detail on new technologies, new achievements, new breakthroughs, and new trends in the fields of micro/nano and other related frontiers. Through various activities, such as the opening ceremony, plenary talks, special sessions, training, a call for papers, and technology exhibitions, it will build a bridge for communication and cooperation between domestic and foreign micro/nano technology workers.

Scope:

CSMNT2023 welcomes academic papers in micro/nano technology and related fields. Eligible topics include (but are not limited to):

Instructions for Submission:

Please click on “Pre-Notification of CSMNT2023” in “Download” at the following link for more information:
http://annual2023.csmnt.org.cn

Contact:

http://annual2023.csmnt.org.cn/?sid=2854&mid=732&v=100

We are pleased to invite you to attend the Nanotechnology Materials and Devices Conference.

IEEE NMDC is a flagship conference series of the IEEE Nanotechnology Council (NTC), focusing on research advances in the fields of nanoscience and nanotechnology.

The IEEE NMDC 2023 will be held in the pleasant environment of the ancient city of Paestum, one of the most important archeological sites of south Italy, which has had UNESCO heritage since 1997. 

Conference Scope:
The conference focuses on the latest scientific and technological advances related to the following areas: 

• Nanorobotics & Nanomanufacturing
• Nano-biomedicine
• Nanofabrication
• Nano-optics, Nano-photonics & Nano-optoelectronics
• Spintronics
• Nanoelectronics: Emerging material and device challenges in futuristic systems
• Nanosensors & Nanoactuators
• Nanomaterials
• Nanometrology & Characterization
• Modeling & Simulation
• Nanopackaging
• Nanomagnetics
• Nanoenergy, Environment & Safety
• Nanoscale Communications and Nanonetworks
• Nano-acoustic Devices, Processes & Materials
• Quantum, Neuromorphic & Unconventional Computing
• Emerging Plasma Nanotechnologies
• MEMS/NEMS
• Nanodiamond and nanocarbon structures: materials and devices
• Education in nanotechnology
• Commercializing nanotechnology
• Fundamentals and applications of nanotubes, nanowires, quantum dots and other low dimensional materials
• DNA Nanotechnology
• Nano-fluidics and integrated bio-chips
• Nanotechnology Ethics

Key Dates:
Extended abstract submission deadline: April 30th, 2023
Acceptance Notification: May 15th, 2023
Early Registration Deadline: May 30th, 2023
Full Paper Submission Deadline: July 15th, 2023
Accepted full papers (4 to 6 pages) for IEEE-NMDC will be included in IEEE Xplore as well as other Abstracting & Indexing (A&I) databases.
IEEE NMDC 2023 will be the perfect stage to promote research from all over the world. 

General Chair:
Antonio Di Bartolomeo, University of Salerno, Italy 

Co-Chairs:
Filippo Giubileo, CNR-SPIN, Italy
Nadia Martucciello, CNR-SPIN, Italy 

More information is available at:

https://ieeenmdc.org/nmdc-2023/

The SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference is a biennial forum on microwave, millimeter wave, terahertz and photonics methods and techniques for both science and engineering. It is sponsored by the Brazilian Microwave and Optoelectronics Society (SBMO) and the IEEE Microwave Theory and Techniques Society of the Institute of Electrical and Electronics Engineers (IEEE MTT-S). 

IMOC 2023 will provide a major international forum for exchanging information on research and development in the theoretical and experimental fields of Microwaves and Optoelectronics including millimeter, terahertz, antennas, propagation, wireless communication, fiber optics and photonics networks. In its twentieth edition, the conference will be held at the amazing city of Castelldefels-Barcelona, with the best beach in Spain, near Barcelona Center, from November 5th to 9th, 2023. 

More information is available at: 

https://www.events.sbmo.org.br/imoc2023/home