On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
Roshanghias, A.; Dreissigacker, M.; Scherf, C.; Bretthauer, C.; Rauter, L.; Zikulnig, J.; Braun, T.; Becker, K.-F.; Rzepka, S.; Schneider-Ramelow, M. On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers. Micromachines 2020, 11, 564.
Roshanghias A, Dreissigacker M, Scherf C, Bretthauer C, Rauter L, Zikulnig J, Braun T, Becker K-F, Rzepka S, Schneider-Ramelow M. On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers. Micromachines. 2020; 11(6):564.
Chicago/Turabian StyleRoshanghias, Ali; Dreissigacker, Marc; Scherf, Christina; Bretthauer, Christian; Rauter, Lukas; Zikulnig, Johanna; Braun, Tanja; Becker, Karl-F.; Rzepka, Sven; Schneider-Ramelow, Martin. 2020. "On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers" Micromachines 11, no. 6: 564.