Micro Thermal Devices and Their Applications, 2nd Edition
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".
Deadline for manuscript submissions: 31 July 2025 | Viewed by 271
Special Issue Editor
Interests: microfluidics; fluid flow; heat transfer; micro thermal devices; microfabrication techniques
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Microsystems are widely used in the microelectronics, biomedical, pharmaceutical, chemical, automotive, and aerospace fields, among others. Among the microcomponents that are commonly used in these fields, devices with improved heat exchange capacities due to their very large surface-to-volume ratio are represented by microchannel heat transfer devices.
Although the performances of microchannel heat transfer devices have been investigated by many authors, more research is required to better understand the thermal phenomena acting at the microscale and to evaluate new scenarios.
In particular, more accurate methodologies are needed to generate sufficient knowledge of the fluid flow and the heat transfer mechanism in microdevices, thus providing accurate correlations between the performances of these apparatuses and the relevant parameters that affect their performance.
On the other hand, the advent of new microfabrication technologies and additive manufacturing has enabled innovative geometries. In particular, new fabrication technologies can be used to obtain simple, novel geometries, while additive manufacturing allows the user to build highly complex polymer and metal parts via the layer-wise process.
This Special Issue seeks to showcase research papers, short communications, and review articles that focus on the investigation of the performances of novel microchannel geometries, novel developments in microfabrication techniques and novel experimental approaches. Moreover, comparisons between different cooling techniques (such as micro heat pipes, micro heat sinks, and micro heat exchangers) are welcome.
Dr. Pamela Vocale
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Keywords
- microsystems
- new microfabrication techniques
- additive manufacturing
- micro thermal devices
- microscale cooling techniques
- heat transfer enhancement
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Related Special Issue
- Micro Thermal Devices and Their Applications in Micromachines (5 articles)
