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Micromachines
Special Issues
Precision Optical Manufacturing and Processing
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Precision Optical Manufacturing and Processing

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: 30 July 2025 | Viewed by 15244

Special Issue Editors

Dr. Zhongchen Cao

E-Mail Website
Guest Editor
School of Mechanical Engineering, Tianjin University, Tianjin 300072, China
Interests: ultra-precision machining technology; intelligent manufacturing and industrial robotics; abrasive machining technology; innovative hybrid manufacturing processes for difficult-to-machine materials; materials science/workpiece surface integrity analysis; modelling, simulation, and optimization of manufacturing processes
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Lingbao Kong

E-Mail Website
Guest Editor
Department of Optical Science and Engineering, Fudan University, Shanghai 200438, China
Interests: manufacturing process mechanics; 3D printing; ultra-precision manufacturing and metrology; freeform measurement and characterization; manufacturing process optimization; fring projection; 3D vision; VR/AR/MR; light field; machine learning
Special Issues, Collections and Topics in MDPI journals
Dr. Dongxu Wu

E-Mail
Guest Editor
Xi'an Jiaotong University-GENERTEC Joint Research Institute, Xi'an, China
Interests: precision and ultra-precision machining technology; ultra-precision single point diamond cutting technology and machine tools; advanced optical manufacturing; machining process and on-line measurement; processing of difficult-to-machine materials

Special Issue Information

Dear Colleagues,

Precision optical elements have always been essential to strategic fields such as aerospace, defense, medical equipment, and electronics. In recent years, the development of those fields has created new requirements for optical manufacturing technology, which mainly focus on higher precision, efficiency, complexity, and intelligence. Therefore, developing new advanced micro/nanoscale machining technologies, state-of-the-art processing techniques, and corresponding equipment and establishing theoretical systems for better understanding and application of the process are of great significance. Accordingly, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on, but are not limited to, the recent advances and frontiers of the following areas:

  1. Precision engineering, inspection, measurement, and metrology;
  2. Manufacturing planning, optimization, and simulation;
  3. Computer-integrated manufacturing systems;
  4. Smart manufacturing;
  5. Micro/nanofabrication and manufacturing;
  6. Ultraprecision machining technology.

We look forward to receiving your contributions.

Dr. Zhongchen Cao
Prof. Dr. Lingbao Kong
Dr. Dongxu Wu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • optical manufacturing
  • precision processing
  • process chains
  • micro- and nanometrology
  • modelling and simulation

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Further information on MDPI's Special Issue policies can be found here.

Published Papers (7 papers)

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Research

13 pages, 9547 KiB  
Article
Vector Atomic Magnetometer with Free Induction Decay Detection Based on a Microfabricated Vapor Cell
by Pengbo Jiang, Qi Li, Jianan Qin and Zhiyuan Jiang
Micromachines 2025, 16(1), 41; https://doi.org/10.3390/mi16010041 - 30 Dec 2024
Viewed by 3601
Abstract
Atomic magnetometers are highly sensitive instruments widely used for measurements of weak magnetic field. Extracting vector information while maintaining high-precision scalar detection has become the trend in atomic magnetometer development. We introduce a vector atomic magnetometer containing a 5 mm-thick microfabricated vapor cell [...] Read more.
Atomic magnetometers are highly sensitive instruments widely used for measurements of weak magnetic field. Extracting vector information while maintaining high-precision scalar detection has become the trend in atomic magnetometer development. We introduce a vector atomic magnetometer containing a 5 mm-thick microfabricated vapor cell operating in free-induction-decay mode. By employing orthogonal modulation techniques, the system achieves high-precision in-plane vector magnetic field measurements. The high-precision vector magnetic field measurements are demonstrated in the x–z plane. The sensitivity of the total field detection in the miniaturized atomic magnetometer is 30 pT·Hz−1/2 @11 µT. The average angular error of the decoupled measurement is as low as 4.7 mrad @7.6 µT for vector magnetic fields, providing a new approach for vector magnetic field measurement in miniaturized atomic magnetometers. Full article
(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)
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18 pages, 10302 KiB  
Article
Investigation on Aluminum Alloy Reflector Mirror Processing Technology Combining Ultrasonic Rolling and Single-Point Diamond Turning
by Yuanhao Ma, Zhanjie Li, Gang Jin, Xiangyu Zhang, Longsi Li, Huaixin Lin, Guangyu Wang and Zhenyu Long
Micromachines 2024, 15(12), 1527; https://doi.org/10.3390/mi15121527 - 22 Dec 2024
Viewed by 925
Abstract
In the process of aluminum alloy reflector mirror processing, the structural defects of aluminum alloys present bottlenecks restricting the development of aluminum alloy reflector mirror processing technologies. Therefore, this study proposes an aluminum alloy reflector mirror processing method involving ultrasonic rolling and single-point [...] Read more.
In the process of aluminum alloy reflector mirror processing, the structural defects of aluminum alloys present bottlenecks restricting the development of aluminum alloy reflector mirror processing technologies. Therefore, this study proposes an aluminum alloy reflector mirror processing method involving ultrasonic rolling and single-point diamond turning. The core idea of this method is to use ultrasonic rolling to pretreat the surface of the workpiece to refine the grains and increase the hardness, then perform single-point diamond turning to improve the optical reflection performance. In this study, an ultrasonic rolling cutting experiment was carried out, and the influence of the material preparation method on the microstructure and hardness of the workpiece was analyzed. An ultrasonic rolling single-point diamond turning experiment was carried out, and the influence of the material preparation method on the reflection performance of single-point diamond turning was studied. Results showed that compared with single-point diamond turning after ordinary milling, the ultrasonic rolling single-point diamond turning method has certain advantages in improving the surface reflection performance, with an increase of 5.116%. The method proposed in this study can provide new ideas for the high-quality processing of aluminum alloy reflector mirrors. Full article
(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)
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21 pages, 5975 KiB  
Article
High-Precision Measurement of Microscales Based on Optoelectronics and Image Integration Method
by Yanlong Zhu, Yinbao Cheng, Hongtang Gao, Shuanghua Sun, Xudong Zhang, Liang Xue, Jiangwen Tang and Yingqi Tang
Micromachines 2024, 15(9), 1162; https://doi.org/10.3390/mi15091162 - 17 Sep 2024
Cited by 1 | Viewed by 1100
Abstract
Currently, there are various types of microscales and the conventional line detection system usually has only one detection method, which is difficult to adapt to the diverse calibration needs of microscales. This article investigates the high-precision measurement method of a microscale based on [...] Read more.
Currently, there are various types of microscales and the conventional line detection system usually has only one detection method, which is difficult to adapt to the diverse calibration needs of microscales. This article investigates the high-precision measurement method of a microscale based on optoelectronics and the image integration method to solve the diversified calibration needs of microscales. The automatic measurement and processing system integrates two methods: the photoelectric signal measurement method and the photoelectric image measurement method. This article studies the smooth motion method based on ordinary linear guides, investigates the method of reducing the cosine error of a small-range interference length measurement, proposes an image-based line positioning method, and studies the edge and center recognition algorithms of the line. According to the experimental data, the system’s measurement accuracy was analyzed using the photoelectric signal measurement method to measure the 1 mm microscale, the maximum difference from the reference value was 0.105 μm, the standard uncertainty was 0.068 μm, and the absolute value of normalized error was less than 1. The accuracy of the image measurement method to measure the 1 mm microscale was consistent with that of the photoelectric signal method. The results show good consistency in the measurement results between the two methods of the integrated measurement system. The photoelectric signal method has the technical characteristics of high measurement efficiency and high accuracy, while the pixel-based measurement of the image method has two-dimensional measurement characteristics, which can realize measurements that cannot be realized by the photoelectric signal method; therefore, the measurement system of optoelectronics and image integration is characterized by high precision and a wide range of measurement adaptations. Full article
(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)
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17 pages, 7390 KiB  
Article
Pipeline Elbow Corrosion Simulation for Strain Monitoring with Fiber Bragg Gratings
by Kaimin Yu, Zixuan Peng, Yuanfang Zhang, Peibin Zhu, Wen Chen and Jianzhong Hao
Micromachines 2024, 15(9), 1098; https://doi.org/10.3390/mi15091098 - 29 Aug 2024
Viewed by 1008
Abstract
This study addresses the limitation of traditional non-destructive testing methods in real-time corrosion monitoring of pipe elbows by proposing the utilization of fiber Bragg grating (FBG) strain sensors, renowned for their resilience in harsh environments. However, the current mathematical relationship model for strain [...] Read more.
This study addresses the limitation of traditional non-destructive testing methods in real-time corrosion monitoring of pipe elbows by proposing the utilization of fiber Bragg grating (FBG) strain sensors, renowned for their resilience in harsh environments. However, the current mathematical relationship model for strain representation of elbow corrosion is still lacking. This paper develops a finite element model to scrutinize the strain changes in the elbow due to corrosion under hydrostatic pressure and bending loads. To mitigate temperature loading effects, the corrosion degree is evaluated through the disparity between hoop and axial strains. Simulation outcomes reveal that, under hydrostatic pressure, the strain difference exhibits minimal changes with the increase in corrosion degree, while under bending moment loading, the strain difference escalates proportionally with corrosion progression. Consequently, strain induced by bending moment loading solely characterizes the corrosion degree. Moreover, the optimal placement for FBG sensors is identified at the extrados of the pipe elbow, where strain is most prominent. These insights enhance comprehension of strain–corrosion dynamics in pipe elbows, offering valuable guidance for developing an FBG-based monitoring system for real-time corrosion tracking and predictive maintenance of pipeline infrastructures. Full article
(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)
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15 pages, 6691 KiB  
Article
Atomic Depth Image Transfer of Large-Area Optical Quartz Materials Based on Pulsed Ion Beam
by Shuyang Ran, Kefan Wen, Lingbo Xie, Xingyu Zhou, Ye Tian, Shuo Qiao, Feng Shi and Xing Peng
Micromachines 2024, 15(7), 914; https://doi.org/10.3390/mi15070914 - 15 Jul 2024
Viewed by 1260
Abstract
The high-efficiency preparation of large-area microstructures of optical materials and precision graphic etching technology is one of the most important application directions in the atomic and near-atomic-scale manufacturing industry. Traditional focused ion beam (FIB) and reactive ion etching (RIE) methods have limitations in [...] Read more.
The high-efficiency preparation of large-area microstructures of optical materials and precision graphic etching technology is one of the most important application directions in the atomic and near-atomic-scale manufacturing industry. Traditional focused ion beam (FIB) and reactive ion etching (RIE) methods have limitations in precision and efficiency, hindering their application in automated mass production. The pulsed ion beam (PIB) method addresses these issues by enhancing ion beam deflection to achieve high-resolution material removal on a macro scale, which can reach the equivalent removal resolution of 6.4 × 10−4 nm. Experiments were conducted on a quartz sample (10 × 10 × 1 mm) with a specific pattern mask using the custom PIB processing device. The surface morphology, etching depth, and roughness were measured post-process. The results demonstrated that precise control over cumulative sputtering time yielded well-defined patterns with expected average etching depths and surface roughness. This confirms the PIB technique’s potential for precise atomic depth image transfer and its suitability for industrial automation, offering a significant advancement in microfabrication technology. Full article
(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)
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17 pages, 74022 KiB  
Article
Optimization of Grayscale Lithography for the Fabrication of Flat Diffractive Infrared Lenses on Silicon Wafers
by Angelos Bouchouri, Muhammad Nadeem Akram, Per Alfred Øhlckers and Xuyuan Chen
Micromachines 2024, 15(7), 866; https://doi.org/10.3390/mi15070866 - 30 Jun 2024
Viewed by 4993
Abstract
Grayscale lithography (GSL) is an alternative approach to the standard binary lithography in MEMS fabrication, enabling the fabrication of complicated, arbitrary 3D structures on a wafer without the need for multiple masks and exposure steps. Despite its advantages, GSL’s effectiveness is highly dependent [...] Read more.
Grayscale lithography (GSL) is an alternative approach to the standard binary lithography in MEMS fabrication, enabling the fabrication of complicated, arbitrary 3D structures on a wafer without the need for multiple masks and exposure steps. Despite its advantages, GSL’s effectiveness is highly dependent on controlled lab conditions, equipment consistency, and finely tuned photoresist (PR) exposure and etching processes. This works presents a thorough investigation of the challenges of GSL for silicon (Si) wafers and presents a detailed approach on how to minimize fabrication inaccuracies, aiming to replicate the intended design as closely as possible. Utilizing a maskless laser writer, all aspects of the GSL are analyzed, from photoresist exposure parameters to Si etching conditions. A practical application of GSL is demonstrated in the fabrication of 4-μm-deep f#/1 Si Fresnel lenses for long-wave infrared (LWIR) imaging (8–12 μm). The surface topography of a Fresnel lens is a good case to apply GSL, as it has varying shapes and size features that need to be preserved. The final fabricated lens profiles show a good match with the initial design, and demonstrate successful etching of coarse and fine features, and demonstrative images taken with an LWIR camera. Full article
(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)
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16 pages, 8260 KiB  
Article
Research on the Influence of the Material Removal Profile of a Spherical Polishing Tool on the Mid-Spatial Frequency Errors of Optical Surfaces
by Zhaohao He, Kuo Hai, Kailong Li, Jiahao Yu, Lingwei Wu, Lin Zhang, Xing Su, Lisheng Cai, Wen Huang and Wei Hang
Micromachines 2024, 15(5), 654; https://doi.org/10.3390/mi15050654 - 15 May 2024
Viewed by 1224
Abstract
Elastic spherical polishing tools effectively conform to the polishing surface and exhibit high efficiency in the removal of materials, so they are extensively used in the sub-aperture polishing stages of optical components. However, their processing is often accompanied by significant mid-spatial frequency (MSF) [...] Read more.
Elastic spherical polishing tools effectively conform to the polishing surface and exhibit high efficiency in the removal of materials, so they are extensively used in the sub-aperture polishing stages of optical components. However, their processing is often accompanied by significant mid-spatial frequency (MSF) errors, which critically degrade the performance of optical systems. To suppress the MSF errors generated during polishing with spherical tools, this study investigates the influence factor of MSF errors during the polishing process through an analysis of the convolution effect in material removal. A material removal profile model is established, and a uniform removal simulation is conducted to assess the influence of different shape material removal profiles on MSF errors. Simulation and experimental results show that a Gaussian-like shape material removal profile is more effective in suppressing the MSF errors during polishing compared to the “W” and trapezoidal shape material removal profiles. In addition, based on the characteristics of the RMS decreasing in a serrated trend with the decrease in path spacing, a path spacing optimization method considering the polishing efficiency is proposed to improve the polishing efficiency while controlling the MSF errors, and the effectiveness of the path spacing optimization method is verified by comparing the MSF error at the maximum theoretical path spacing and the path spacing that is less than this. Finally, the path spacing optimization method is used to polish single-crystal silicon to further illustrate its practicality. Full article
(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)
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