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19 pages, 8898 KiB

Open AccessArticle

Modeling and Optimization of Structural Parameters for High-Efficiency Multi-Jet Polishing of Optical Glass

by Zhongchen Cao, Yiwei Miao, Ming Wang and Zhenfeng Zhu

Micromachines 2025, 16(5), 551; https://doi.org/10.3390/mi16050551 - 30 Apr 2025

Viewed by 115

Multi-jet polishing (MJP) is a promising method for enhanced polishing efficiency by integrating multiple nozzles, allowing for the high-efficiency polishing of large-scale surfaces. However, the optimization of the structural parameters, such as the distribution form of the nozzles and outlet diameter, remains a [...] Read more.

Multi-jet polishing (MJP) is a promising method for enhanced polishing efficiency by integrating multiple nozzles, allowing for the high-efficiency polishing of large-scale surfaces. However, the optimization of the structural parameters, such as the distribution form of the nozzles and outlet diameter, remains a critical challenge for achieving uniform and stable polishing performance. This paper presents a dynamic model of MJP based on the theory of fluid dynamic pressure and particle erosion. The flow field and particle motion characteristics in multi-nozzle jet polishing were studied using simulation experiments. The influence of the nozzle spacing and form and outlet diameter on the flow field characteristics and material removal profile was explored, and the structural parameters of the multi-nozzle polishing tool were optimized. According to the simulation results, two kinds of multi-nozzle polishing tools with a linear arrangement and cross arrangement were processed, and a series of single-point and surface polishing experiments was carried out. The optimized multi-nozzle jet polishing tool has no interference in the removal contour of each point, exhibits high consistency and stability, and is consistent with the theoretical model prediction results, which effectively improve the surface polishing efficiency. The results can provide a theoretical and experimental reference for MJP in the ultra-precision and high-efficiency polishing of large-sized components. Full article

(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)

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13 pages, 9547 KiB

Open AccessArticle

Vector Atomic Magnetometer with Free Induction Decay Detection Based on a Microfabricated Vapor Cell

by Pengbo Jiang, Qi Li, Jianan Qin and Zhiyuan Jiang

Micromachines 2025, 16(1), 41; https://doi.org/10.3390/mi16010041 - 30 Dec 2024

Viewed by 3761

Abstract

Atomic magnetometers are highly sensitive instruments widely used for measurements of weak magnetic field. Extracting vector information while maintaining high-precision scalar detection has become the trend in atomic magnetometer development. We introduce a vector atomic magnetometer containing a 5 mm-thick microfabricated vapor cell [...] Read more.

Atomic magnetometers are highly sensitive instruments widely used for measurements of weak magnetic field. Extracting vector information while maintaining high-precision scalar detection has become the trend in atomic magnetometer development. We introduce a vector atomic magnetometer containing a 5 mm-thick microfabricated vapor cell operating in free-induction-decay mode. By employing orthogonal modulation techniques, the system achieves high-precision in-plane vector magnetic field measurements. The high-precision vector magnetic field measurements are demonstrated in the x–z plane. The sensitivity of the total field detection in the miniaturized atomic magnetometer is 30 pT·Hz^−1/2 @11 µT. The average angular error of the decoupled measurement is as low as 4.7 mrad @7.6 µT for vector magnetic fields, providing a new approach for vector magnetic field measurement in miniaturized atomic magnetometers. Full article

(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)

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18 pages, 10302 KiB

Open AccessArticle

Investigation on Aluminum Alloy Reflector Mirror Processing Technology Combining Ultrasonic Rolling and Single-Point Diamond Turning

by Yuanhao Ma, Zhanjie Li, Gang Jin, Xiangyu Zhang, Longsi Li, Huaixin Lin, Guangyu Wang and Zhenyu Long

Micromachines 2024, 15(12), 1527; https://doi.org/10.3390/mi15121527 - 22 Dec 2024

Cited by 1 | Viewed by 1047

Abstract

In the process of aluminum alloy reflector mirror processing, the structural defects of aluminum alloys present bottlenecks restricting the development of aluminum alloy reflector mirror processing technologies. Therefore, this study proposes an aluminum alloy reflector mirror processing method involving ultrasonic rolling and single-point [...] Read more.

In the process of aluminum alloy reflector mirror processing, the structural defects of aluminum alloys present bottlenecks restricting the development of aluminum alloy reflector mirror processing technologies. Therefore, this study proposes an aluminum alloy reflector mirror processing method involving ultrasonic rolling and single-point diamond turning. The core idea of this method is to use ultrasonic rolling to pretreat the surface of the workpiece to refine the grains and increase the hardness, then perform single-point diamond turning to improve the optical reflection performance. In this study, an ultrasonic rolling cutting experiment was carried out, and the influence of the material preparation method on the microstructure and hardness of the workpiece was analyzed. An ultrasonic rolling single-point diamond turning experiment was carried out, and the influence of the material preparation method on the reflection performance of single-point diamond turning was studied. Results showed that compared with single-point diamond turning after ordinary milling, the ultrasonic rolling single-point diamond turning method has certain advantages in improving the surface reflection performance, with an increase of 5.116%. The method proposed in this study can provide new ideas for the high-quality processing of aluminum alloy reflector mirrors. Full article

(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)

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21 pages, 5975 KiB

Open AccessArticle

High-Precision Measurement of Microscales Based on Optoelectronics and Image Integration Method

by Yanlong Zhu, Yinbao Cheng, Hongtang Gao, Shuanghua Sun, Xudong Zhang, Liang Xue, Jiangwen Tang and Yingqi Tang

Micromachines 2024, 15(9), 1162; https://doi.org/10.3390/mi15091162 - 17 Sep 2024

Cited by 1 | Viewed by 1149

Abstract

Currently, there are various types of microscales and the conventional line detection system usually has only one detection method, which is difficult to adapt to the diverse calibration needs of microscales. This article investigates the high-precision measurement method of a microscale based on [...] Read more.

Currently, there are various types of microscales and the conventional line detection system usually has only one detection method, which is difficult to adapt to the diverse calibration needs of microscales. This article investigates the high-precision measurement method of a microscale based on optoelectronics and the image integration method to solve the diversified calibration needs of microscales. The automatic measurement and processing system integrates two methods: the photoelectric signal measurement method and the photoelectric image measurement method. This article studies the smooth motion method based on ordinary linear guides, investigates the method of reducing the cosine error of a small-range interference length measurement, proposes an image-based line positioning method, and studies the edge and center recognition algorithms of the line. According to the experimental data, the system’s measurement accuracy was analyzed using the photoelectric signal measurement method to measure the 1 mm microscale, the maximum difference from the reference value was 0.105 μm, the standard uncertainty was 0.068 μm, and the absolute value of normalized error was less than 1. The accuracy of the image measurement method to measure the 1 mm microscale was consistent with that of the photoelectric signal method. The results show good consistency in the measurement results between the two methods of the integrated measurement system. The photoelectric signal method has the technical characteristics of high measurement efficiency and high accuracy, while the pixel-based measurement of the image method has two-dimensional measurement characteristics, which can realize measurements that cannot be realized by the photoelectric signal method; therefore, the measurement system of optoelectronics and image integration is characterized by high precision and a wide range of measurement adaptations. Full article

(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)

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17 pages, 7390 KiB

Open AccessArticle

Pipeline Elbow Corrosion Simulation for Strain Monitoring with Fiber Bragg Gratings

by Kaimin Yu, Zixuan Peng, Yuanfang Zhang, Peibin Zhu, Wen Chen and Jianzhong Hao

Micromachines 2024, 15(9), 1098; https://doi.org/10.3390/mi15091098 - 29 Aug 2024

Viewed by 1082

Abstract

This study addresses the limitation of traditional non-destructive testing methods in real-time corrosion monitoring of pipe elbows by proposing the utilization of fiber Bragg grating (FBG) strain sensors, renowned for their resilience in harsh environments. However, the current mathematical relationship model for strain [...] Read more.

This study addresses the limitation of traditional non-destructive testing methods in real-time corrosion monitoring of pipe elbows by proposing the utilization of fiber Bragg grating (FBG) strain sensors, renowned for their resilience in harsh environments. However, the current mathematical relationship model for strain representation of elbow corrosion is still lacking. This paper develops a finite element model to scrutinize the strain changes in the elbow due to corrosion under hydrostatic pressure and bending loads. To mitigate temperature loading effects, the corrosion degree is evaluated through the disparity between hoop and axial strains. Simulation outcomes reveal that, under hydrostatic pressure, the strain difference exhibits minimal changes with the increase in corrosion degree, while under bending moment loading, the strain difference escalates proportionally with corrosion progression. Consequently, strain induced by bending moment loading solely characterizes the corrosion degree. Moreover, the optimal placement for FBG sensors is identified at the extrados of the pipe elbow, where strain is most prominent. These insights enhance comprehension of strain–corrosion dynamics in pipe elbows, offering valuable guidance for developing an FBG-based monitoring system for real-time corrosion tracking and predictive maintenance of pipeline infrastructures. Full article

(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)

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15 pages, 6691 KiB

Open AccessArticle

Atomic Depth Image Transfer of Large-Area Optical Quartz Materials Based on Pulsed Ion Beam

by Shuyang Ran, Kefan Wen, Lingbo Xie, Xingyu Zhou, Ye Tian, Shuo Qiao, Feng Shi and Xing Peng

Micromachines 2024, 15(7), 914; https://doi.org/10.3390/mi15070914 - 15 Jul 2024

Viewed by 1304

Abstract

The high-efficiency preparation of large-area microstructures of optical materials and precision graphic etching technology is one of the most important application directions in the atomic and near-atomic-scale manufacturing industry. Traditional focused ion beam (FIB) and reactive ion etching (RIE) methods have limitations in [...] Read more.

The high-efficiency preparation of large-area microstructures of optical materials and precision graphic etching technology is one of the most important application directions in the atomic and near-atomic-scale manufacturing industry. Traditional focused ion beam (FIB) and reactive ion etching (RIE) methods have limitations in precision and efficiency, hindering their application in automated mass production. The pulsed ion beam (PIB) method addresses these issues by enhancing ion beam deflection to achieve high-resolution material removal on a macro scale, which can reach the equivalent removal resolution of 6.4 × 10⁻⁴ nm. Experiments were conducted on a quartz sample (10 × 10 × 1 mm) with a specific pattern mask using the custom PIB processing device. The surface morphology, etching depth, and roughness were measured post-process. The results demonstrated that precise control over cumulative sputtering time yielded well-defined patterns with expected average etching depths and surface roughness. This confirms the PIB technique’s potential for precise atomic depth image transfer and its suitability for industrial automation, offering a significant advancement in microfabrication technology. Full article

(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)

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17 pages, 74022 KiB

Open AccessArticle

Optimization of Grayscale Lithography for the Fabrication of Flat Diffractive Infrared Lenses on Silicon Wafers

by Angelos Bouchouri, Muhammad Nadeem Akram, Per Alfred Øhlckers and Xuyuan Chen

Micromachines 2024, 15(7), 866; https://doi.org/10.3390/mi15070866 - 30 Jun 2024

Viewed by 5151

Abstract

Grayscale lithography (GSL) is an alternative approach to the standard binary lithography in MEMS fabrication, enabling the fabrication of complicated, arbitrary 3D structures on a wafer without the need for multiple masks and exposure steps. Despite its advantages, GSL’s effectiveness is highly dependent [...] Read more.

Grayscale lithography (GSL) is an alternative approach to the standard binary lithography in MEMS fabrication, enabling the fabrication of complicated, arbitrary 3D structures on a wafer without the need for multiple masks and exposure steps. Despite its advantages, GSL’s effectiveness is highly dependent on controlled lab conditions, equipment consistency, and finely tuned photoresist (PR) exposure and etching processes. This works presents a thorough investigation of the challenges of GSL for silicon (Si) wafers and presents a detailed approach on how to minimize fabrication inaccuracies, aiming to replicate the intended design as closely as possible. Utilizing a maskless laser writer, all aspects of the GSL are analyzed, from photoresist exposure parameters to Si etching conditions. A practical application of GSL is demonstrated in the fabrication of 4-μm-deep

f

#/1 Si Fresnel lenses for long-wave infrared (LWIR) imaging (8–12 μm). The surface topography of a Fresnel lens is a good case to apply GSL, as it has varying shapes and size features that need to be preserved. The final fabricated lens profiles show a good match with the initial design, and demonstrate successful etching of coarse and fine features, and demonstrative images taken with an LWIR camera. Full article

(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)

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16 pages, 8260 KiB

Open AccessArticle

Research on the Influence of the Material Removal Profile of a Spherical Polishing Tool on the Mid-Spatial Frequency Errors of Optical Surfaces

by Zhaohao He, Kuo Hai, Kailong Li, Jiahao Yu, Lingwei Wu, Lin Zhang, Xing Su, Lisheng Cai, Wen Huang and Wei Hang

Micromachines 2024, 15(5), 654; https://doi.org/10.3390/mi15050654 - 15 May 2024

Cited by 1 | Viewed by 1286

Abstract

Elastic spherical polishing tools effectively conform to the polishing surface and exhibit high efficiency in the removal of materials, so they are extensively used in the sub-aperture polishing stages of optical components. However, their processing is often accompanied by significant mid-spatial frequency (MSF) [...] Read more.

Elastic spherical polishing tools effectively conform to the polishing surface and exhibit high efficiency in the removal of materials, so they are extensively used in the sub-aperture polishing stages of optical components. However, their processing is often accompanied by significant mid-spatial frequency (MSF) errors, which critically degrade the performance of optical systems. To suppress the MSF errors generated during polishing with spherical tools, this study investigates the influence factor of MSF errors during the polishing process through an analysis of the convolution effect in material removal. A material removal profile model is established, and a uniform removal simulation is conducted to assess the influence of different shape material removal profiles on MSF errors. Simulation and experimental results show that a Gaussian-like shape material removal profile is more effective in suppressing the MSF errors during polishing compared to the “W” and trapezoidal shape material removal profiles. In addition, based on the characteristics of the RMS decreasing in a serrated trend with the decrease in path spacing, a path spacing optimization method considering the polishing efficiency is proposed to improve the polishing efficiency while controlling the MSF errors, and the effectiveness of the path spacing optimization method is verified by comparing the MSF error at the maximum theoretical path spacing and the path spacing that is less than this. Finally, the path spacing optimization method is used to polish single-crystal silicon to further illustrate its practicality. Full article

(This article belongs to the Special Issue Precision Optical Manufacturing and Processing)

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