Ultra-Precision Micro Cutting and Micro Polishing
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: 31 October 2025 | Viewed by 92
Special Issue Editors
Interests: ultra-precision machining technologies; chemo-mechanical polishing; chemical catalyst-assisted polishing; plasma polishing; tribological mechanisms and superlubricity behaviors of solid-film surfaces; ultra-smooth surface manufacturing for optical materials
Special Issue Information
Dear Colleagues,
Next-generation products with atomic precision have attracted researchers’ attention, prompting the development of ultra-precision micro-cutting and micro-polishing technologies to facilitate atomic- and close-to-atomic-scale manufacturing. Therefore, this Special Issue will showcase the latest advancements in the field of micro-cutting and micro-polishing, covering novel methods, experimental and simulated results, and traditional technologic models. In addition, micro-cutting and micro-polishing processes involve interfacial and surficial mechanical effects, tribo-chemical reactions, and material transfer and migration. We invite the submission of original research articles, review articles, and communications on changes in the surface/subsurface and material evolution during ultra-precision micro-cutting and micro-polishing, with topics of interest including but not limited to the following:
- Ultra-precision cutting;
- Cutting mechanisms;
- Chemical and mechanical polishing;
- Elastic emission machining;
- Photoelectrochemical polishing;
- Plasma polishing;
- Jet polishing;
- Magnetic fluid polishing;
- Ion beam polishing;
- Laser-assisted polishing;
- Ultraviolet-assisted polishing;
- Catalyst-referenced etching polishing.
All submitted papers will undergo a rigorous peer review process to ensure the quality and novelty of the work.
We look forward to receiving your valuable contributions.
Dr. Yinhui Wang
Dr. Weijia Guo
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- ultra-precision cutting
- cutting mechanisms
- chemical and mechanical polishing
- elastic emission machining
- photoelectrochemical polishing
- plasma polishing
- jet polishing
- magnetic fluid polishing
- ion beam polishing
- laser-assisted polishing
- ultraviolet-assisted polishing
- catalyst-referenced etching polishing
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