Announcements

MDPI will be attending the 16th International Symposium on Measurement Technology and Intelligent Instruments (ISMTII 2025) and the 3rd International Conference of Optical Imaging and Measurement (ICOIM 2025), which will be jointly held from 25 to 28 May 2025, at the East Lake Hotel in Wuhan, China.

The 1st International Symposium on Measurement Technology and Intelligent Instruments (ISMTII) was held from 15 to 17 May 1989, in Wuhan, China. For the last 35 years, ISMTII has been successfully organized in Wuhan, Hayama, Miskolc-Lillafured, Cairo, Hong Kong, Huddersfield, Sendai, St. Petersburg, Daejeon, Aachen, Taipei, Xi'an, Niigata, and Seoul. ISMTII has established itself as a prominent meeting for international metrology experts. The conference has been jointly organized and sponsored by the International Committee on Measurements and Instrumentation (ICMI) since 1993 and has attracted more than 5,000 participants from over 50 countries and regions.

In 2025, the 16th ISMTII will be held in Wuhan, China, again. It will be jointly held with the 3rd International Conference on Optical Imaging and Measurement (ICOIM 2025), which is a prominent meeting focusing on the most recent challenges, trends, solutions, and innovations within different aspects of optical imaging and measurement.

ISMTII/ICOIM 2025 aims to provide a forum for world-class experts in the fields of optical imaging, nanometrology, precision metrology, and instrumentation to exchange ideas and inspire enthusiasm. 

The four-day symposium will not only provide opportunities for established and early career investigators to exchange cutting-edge techniques on measurement and instrumentation, but also bridge the gap between academia and industry by offering the opportunity to disclose the most challenging roadblocks in measurement and inspection in industry.

The following MDPI journals will be represented:

• Metrology;
• Sensors;
• Micromachines;
• J. Imaging;
• Optics;
• Photonics;
• Instruments;
• NDT.

If you are attending the conference, please visit our booth #A02. Our delegates look forward to meeting you in person and answering any questions that you may have. For more information about the conference, please visit the following website: https://www.ismtii2025.com/En/Default.

MDPI will be attending the 4th National Conference on Electronic Information Materials and Devices, which will be held in Nanjing, China, from 18 to 20 April 2025. The 4th National Conference on Electronic Information Materials and Devices is a national academic conference organized and initiated by the Expert Committee of Electronic Information Materials and Devices, held once a year, and is an effective platform for academic exchange and the release of new results in the field. The conference aims to gather domestic scientific and technological workers and industrial units to discuss the key, hot, cutting-edge and common scientific issues in the field of research, share the latest results, explore basic research ideas and priority development directions, promote technological progress and industrialization coordination, grasp the development trend of scientific research and industry, and promote industry–university–research contracts and leapfrog development.

The following MDPI journals will be represented:

• Journal of Low Power Electronics and Applications;
• Electronic Materials;
• Electronics;
• Hardware;
• Journal of Sensor and Actuator Networks;
• Journal of Experimental and Theoretical Analyses;
• Quantum Beam Science;
• AI;
• Chips;
• Photonics;
• Designs;
• Micromachines.

MDPI will be attending the 23rd International Conference on Solid-State Sensors, Actuators and Microsystems in Orlando, Florida, USA. The conference will begin on Sunday, 29 June 2025, with short courses providing a scholarly introduction and overview of some selected topics of interest, which will help academics and professionals become familiar with the latest trends in the field; the topics of the short courses will be announced shortly. Conference registration will also open on 29 June, with a welcome reception at which attendees can meet and greet each other at that evening. The conference technical program will begin on the morning of 30 June, with plenary sessions that will then breakout into parallel sessions, industry talks, and poster sessions throughout the duration of the conference. The exhibition portion, which will take place from 30 June through 3 July, is designed to give companies, start-ups, and scientific associations the opportunity to share information about or demonstrate their latest advances, products, and/or services. We welcome you to visit the MDPI booth, number 29, where you can have face-to-face exchanges with our representatives, learn more about our open access publishing services, and receive gifts. The program has been designed to provide plenty of opportunities for technical exchange and professional networking.

The following MDPI journals will be represented at the conference:

• Sensors;
• Micromachines;
• Biosensors;
• JETA;
• Nanomaterials;
• JSAN;
• JLPEA;
• Electronics;
• Biomimetics;
• Nanomanufacturing;
• Chemosensors;
• Acoustics;
• Magnetism.

If you are attending this conference, please feel free to start a conversation with us at our booth. Our delegates look forward to meeting you in person and answering any questions that you may have.

Conference: Conference on Lasers and Electro-Optics 2025
Date: 6–8 May 2025
Location: California, USA

MDPI will be attending the Conference on Lasers and Electro-Optics 2025, which will be held from 6 to 8 May 2025 in California, USA.

CLEO is the world's premier academic conference in the field of laser and optoelectronics science, sponsored by the international authority Optica (formerly the Optical Society of America), to promote cutting-edge research in photonics, quantum technology, ultrafast optics and interdisciplinary applications.

The 2025 edition of CLEO has the following highlights:

• 150+ invited speakers: Hear from luminaries at prestigious institutions such as MIT, Stanford, and international research hubs;
• 29 topic categories: Explore cutting-edge themes spanning ultrafast lasers, quantum photonics, optical engineering, biomedical optics, and next-gen communication technologies;
• Plenary program: Visionary keynotes will address transformative trends, including AI-driven photonics and sustainable energy solutions.

The following MDPI journals will be represented at the conference:

• Applied Sciences;
• Photonics;
• Micromachines;
• Technologies;
• Quantum Reports;
• Optics;
• Instruments;
• Entropy;
• Chips;
• Metrology;
• Chemosensors.

If you are planning to attend the conference, we encourage you to visit our booth and speak to our representatives. We are eager to meet you in person and assist you with any queries that you may have.

For more information about the conference, please visit the official website: https://cleoconference.org/.

MDPI will be attending the 2025 International Conference on Electronics Packaging and iMAPs All Asia Conference (ICEP-IAAC 2025) in Nagano, Japan, which will take place from 15 to 19 April 2025. ICEP is Japan’s largest international conference on electronic packaging, attracting more than 360 attendees and hosting roughly 35 technical sessions. The conference comprises technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless components, interconnections, materials and processes, optoelectronics, power electronics integration, and thermal management. 

The following MDPI journals will be represented at the conference:

• Electronics;
• Applied Sciences;
• Chips;
• Hardware;
• Journal of Experimental and Theoretical Analyses;
• Journal of Low Power Electronics and Applications;
• Journal of Sensor and Actuator Networks;
• Materials;
• Micromachines;
• Technologies. 

If you are planning to attend the above conference, please visit our booth. Our delegates look forward to meeting you in person and answering any questions that you may have. For more information about this conference, please visit the following website: https://www.jiep.or.jp/icep/.

Throughout history, engineering has played an essential role in development and human welfare. Ensuring that future generations of engineers and scientists will be able to design solutions for local and global challenges is critical.

World Engineering Day for Sustainable Development on March 4th aims to raise awareness of the role of engineering in modern life, which is essential to mitigate the impact of climate change and advancing sustainable development, especially in Africa and Small Island Developing States (SIDS). This year’s theme is “Unleashing the Power of Engineers to Advance the Sustainable Development Goals (SDGs)”.

Sustainability has always been a core value of MDPI, starting with the collection and preservation of rare chemical samples that started in 1996 and led to the first journal, Molecules (ISSN: 1420-3049). As a global enterprise, it is our duty to advance responsible practices that will ensure a bright future for our planet. MDPI’s commitment to sustainability is focused on open access publishing that promotes content related not only to environmental sustainability, but to all 17 sustainable development goals (SDGs) defined by the UN.

To commemorate this special day, we invite you to explore a curation of insightful journals, articles, and Special Issues in the field of engineering. By sharing these findings, we hope to inspire the next generation of engineers, elevate engineering capacities, and contribute to the Sustainable Development Goals (SDGs).

“Vastness of Tribology Research Fields and Their Contribution to Sustainable Development”
by Enrico Ciulli
Lubricants 2024, 12(2), 33; https://doi.org/10.3390/lubricants12020033

“Steam Explosion-Based Method for the Extraction of Cellulose and Lignin from Rice Straw Waste”
by Víctor M. Serrano-Martínez, Henoc Pérez-Aguilar, María Pilar Carbonell-Blasco, Francisca Arán-Ais and Elena Orgilés-Calpena
Appl. Sci. 2024, 14(5), 2059; https://doi.org/10.3390/app14052059

“Green-Powered Electric Public Mobility: Integrating Urban and Interurban Routes—A Case Study Analysis”
by Alessandro Franco, Giovanni Lutzemberger, Marco Giorgio Bevilacqua, Francesco Giuseppe Quilici and Matilde Vezzani
Electricity 2024, 5(2), 254–270; https://doi.org/10.3390/electricity5020013

“Evaluating Sustainable Practices for Managing Residue Derived from Wheat Straw”
by Harikishore Shanmugam, Vijaya Raghavan, Rajinikanth Rajagopal, Bernard Goyette, Linxiang Lyu, Siyuan Zhou and Chunjiang An
Bioengineering 2024, 11(6), 554; https://doi.org/10.3390/bioengineering11060554

“A Telemetric Framework for Assessing Vehicle Emissions Based on Driving Behavior Using Unsupervised Learning”
by Auwal Sagir Muhammad, Cheng Wang and Longbiao Chen
Vehicles 2024, 6(4), 2170–2194; https://doi.org/10.3390/vehicles6040106

Special Issues:

“Advances in Energy Harvesting Technologies for Wearable Devices”
by Minki Kang and Woon-Hong Yeo
Micromachines 2024, 15(7), 884; https://doi.org/10.3390/mi15070884

“Integration of Smart Cities and Building Information Modeling (BIM) for a Sustainability Oriented Business Model to Address Sustainable Development Goals”
by Zhen Liu, Yixin Liu and Mohamed Osmani
Buildings 2024, 14(5), 1458; https://doi.org/10.3390/buildings14051458

“Synergistic Applications of Graphene-Based Materials and Deep Eutectic Solvents in Sustainable Sensing: A Comprehensive Review”
by Rossella Svigelj, Rosanna Toniolo, Cristina Bertoni and Alessandro Fraleoni-Morgera
Sensors 2024, 24(8), 2403; https://doi.org/10.3390/s24082403

“Sustainable Power Generation Expansion in Island Systems with Extensive RES and Energy Storage”
by Emmanuel Karapidakis, Christos Kalogerakis and Evangelos Pompodakis
Inventions 2023, 8(5), 127; https://doi.org/10.3390/inventions8050127

“Modeling the Global Annual Carbon Footprint for the Transportation Sector and a Path to Sustainability”
by Vikram Mittal and Rajesh Shah
Modelling 2023, 4(2), 264–282; https://doi.org/10.3390/modelling4020015

Special Issues:

MDPI is pleased to share a significant milestone in its mission to advance scholarly research and promote the dissemination of knowledge—300+ MDPI journals are now indexed in Web of Science (WoS). This milestone highlights the global recognition, interdisciplinary impact and enhanced visibility of our journals. It also reflects our adherence to rigorous editorial standards, scientific integrity, and our mission to foster open scientific exchange in all forms, across all disciplines. 

To explore the full list of our journals indexed in WoS, please visit https://www.mdpi.com/about/journals/wos. Beyond expanding the coverage of our publications in the leading academic databases, we are dedicated to ensuring that our journals are included in as many scope-specific databases as possible. This increases the visibility of our authors’ work and extends the reach of their significant data. 

This milestone would not have been possible without the efforts and expertise of our academic editors, reviewers and authors. Their commitment and collaboration have been instrumental in creating an inclusive, accessible, and impactful publishing platform. We also extend our gratitude to the global research community for their trust as we continue to break new ground in academic publishing. This milestone is not just a celebration of MDPI’s progress but also recognition of the collective strides made by researchers worldwide. 

As we celebrate this remarkable accomplishment, MDPI remains steadfast in its commitment to open access publishing and ensuring that high-quality research reaches and inspires a global audience.

Conference: The 72nd JSAP Spring Meeting 2025
Date: 14–17 March 2025
Location: Noda City, Chiba Prefecture, Japan

MDPI will be attending the 72nd JSAP Spring Meeting 2025, which will be held from 14 to 17 March 2025 in Noda City, Chiba Prefecture, Japan.

Hosted by the Japan Society of Applied Physics (JSAP), one of Asia’s most prominent academic organizations in applied physics, the conference serves as a platform for interdisciplinary collaboration. With a focus on themes such as quantum technology, nanomaterials, optoelectronics, renewable energy systems, and biophysics, the event features keynote speeches, technical sessions, poster presentations, and an exhibition showcasing innovative technologies. The JSAP Spring Meeting is renowned for highlighting Japan’s leadership in applied physics research and its integration with global industrial trends. The 2025 program includes special sessions on sustainable technologies and AI-driven material discovery, reflecting the urgent need for science-based solutions to global challenges. This prestigious event brings together global researchers, engineers, and industry experts to share cutting-edge advancements in applied physics and related fields.

The following MDPI journals will be represented at the conference:

• Applied Sciences;
• Atoms;
• Entropy;
• Eng;
• Photonics;
• Sensors;
• Chips;
• Electronics;
• Micromachines;
• Condensed Matter;
• Magnetism;
• Physics.

If you are planning to attend the conference, we encourage you to visit our booth and speak to our representatives. We are eager to meet you in person and assist you with any queries that you may have. For more information about the conference, please visit the official website: https://meeting.jsap.or.jp/english.

We are pleased to announce that the 2nd International Conference on AI Sensors and Transducers (AIS 2025) will be held in Kuala Lumpur, Malaysia, from 29 July to 3 August 2025. This conference is organized by MDPI’s journals Sensors, AI Sensor, Micromachines, Chemosensors, and Robotics. Building on the success of our previous conference in Singapore, this event promises to be an exciting platform for exploring cutting-edge advances and fostering collaboration in the rapidly evolving field of AI, sensors, and transducers. We expect that the AIS 2025 will host over 600 participants from around the world.

Conference Chairs:

• Prof. Dr. Toshihiro Itoh, Department of Precision Engineering, University of Tokyo, Japan;
• Prof. Dr. Sang-Woo Kim, Department of Materials Science and Engineering, Yonsei University, Korea;
• Prof. Dr. Chengkuo Lee, Director of Center for Intelligent Sensors and MEMS; Electrical and Computer Engineering, National University of Singapore, Singapore.

Topics of Interest:

• S1. Lab-on-a-Chip (LoC) and MicroTAS;
• S2. Biosensors and Biomedical Devices;
• S3. In-Body IoT Sensing Technology, Electroceuticals and Neural Interfaces;
• S4. Nanophotonics and Metasurface;
• S5. Acoustic, RF, THz Metamaterials and AI-Enabled Metamaterials;
• S6. Neuromorphic Computing, In-Memory Computing and Applications;
• S7. Photonics Integrated Circuits (PICs) and Novel Materials;
• S8. Enabling Technology for Photonic Neural Networks (PNNs) and Applications;
• S9. In-Sensor Computing and Enabling Technology for Edge Computing;
• S10. MEMS/NEMS Sensors;
• S11. Semiconductor Sensors, Photodetectors and CMOS MEMS;
• S12. Piezoelectric MEMS and Resonators—FBAR, SAW and pMUT;
• S13. Piezoelectric Transducers and Energy Harvesters;
• S14. Ferroelectric/Perovskite/2D Materials Thin Film and Applications;
• S15. Gas Sensors and Chemosensors;
• S16. Triboelectric Nanogenerators and Self-Powered Sensors;
• S17. Energy Harvesting Technology and Applications;
• S18. Flexible, Stretchable and Wearable Sensors;
• S19. Wearable AI Sensors;
• S20. AI-Enhanced Tactile Sensors and e-Skin;
• S21. Haptic Technology and Applications;
• S22. Advanced Sensors for Robots and Autonomous Systems;
• S23. Intelligent Sensors and AI-Enhanced Humanoids;
• S24. Enabling Technology for Digital Twin, Metaverse and Smart Sensing Systems;
• S25. AIoT Technology and Applications;
• S26. Sensors for Applications in Agriculture, Aquaculture, Food Technology (A2FT) and Harsh Environment;
• S27. Industry Forum and Commercialization of Sensors and Transducers;
• S28. Regular Symposium.

Guide for Authors:

Please click the button to submit your abstract before 10 May 2025.

Please click the button to register for this event.

For any enquiries regarding the event, please contact ais2025@mdpi.com.

We look forward to seeing you at AIS 2025.