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Micromachines, Volume 16, Issue 8 (August 2025) – 2 articles

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25 pages, 2727 KiB  
Review
AI-Powered Next-Generation Technology for Semiconductor Optical Metrology: A Review
by Weiwang Xu, Houdao Zhang, Lingjing Ji and Zhongyu Li
Micromachines 2025, 16(8), 838; https://doi.org/10.3390/mi16080838 (registering DOI) - 22 Jul 2025
Abstract
As semiconductor manufacturing advances into the angstrom-scale era characterized by three-dimensional integration, conventional metrology technologies face fundamental limitations regarding accuracy, speed, and non-destructiveness. Although optical spectroscopy has emerged as a prominent research focus, its application in complex manufacturing scenarios continues to confront significant [...] Read more.
As semiconductor manufacturing advances into the angstrom-scale era characterized by three-dimensional integration, conventional metrology technologies face fundamental limitations regarding accuracy, speed, and non-destructiveness. Although optical spectroscopy has emerged as a prominent research focus, its application in complex manufacturing scenarios continues to confront significant technical barriers. This review establishes three concrete objectives: To categorize AI–optical spectroscopy integration paradigms spanning forward surrogate modeling, inverse prediction, physics-informed neural networks (PINNs), and multi-level architectures; to benchmark their efficacy against critical industrial metrology challenges including tool-to-tool (T2T) matching and high-aspect-ratio (HAR) structure characterization; and to identify unresolved bottlenecks for guiding next-generation intelligent semiconductor metrology. By categorically elaborating on the innovative applications of AI algorithms—such as forward surrogate models, inverse modeling techniques, physics-informed neural networks (PINNs), and multi-level network architectures—in optical spectroscopy, this work methodically assesses the implementation efficacy and limitations of each technical pathway. Through actual application case studies involving J-profiler software 5.0 and associated algorithms, this review validates the significant efficacy of AI technologies in addressing critical industrial challenges, including tool-to-tool (T2T) matching. The research demonstrates that the fusion of AI and optical spectroscopy delivers technological breakthroughs for semiconductor metrology; however, persistent challenges remain concerning data veracity, insufficient datasets, and cross-scale compatibility. Future research should prioritize enhancing model generalization capability, optimizing data acquisition and utilization strategies, and balancing algorithm real-time performance with accuracy, thereby catalyzing the transformation of semiconductor manufacturing towards an intelligence-driven advanced metrology paradigm. Full article
(This article belongs to the Special Issue Recent Advances in Lithography)
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18 pages, 20327 KiB  
Article
The Effect of Scratch-Induced Microscale Surface Roughness on Signal Transmission in Radio Frequency Coaxial Connectors
by Yuqi Zhou, Tianmeng Zhang, Gang Xie and Jinchun Gao
Micromachines 2025, 16(8), 837; https://doi.org/10.3390/mi16080837 (registering DOI) - 22 Jul 2025
Abstract
Electrical connectors play a vital role in ensuring reliable signal transmission in high-frequency microsystems. This study explores the impact of microscale scratch-induced surface roughness on the alternating current (AC) contact impedance of RF coaxial connectors. Unlike traditional approaches that assume idealized surface conditions, [...] Read more.
Electrical connectors play a vital role in ensuring reliable signal transmission in high-frequency microsystems. This study explores the impact of microscale scratch-induced surface roughness on the alternating current (AC) contact impedance of RF coaxial connectors. Unlike traditional approaches that assume idealized surface conditions, controlled micro-defects were introduced at the central contact interface to establish a quantitative relationship between surface morphology and signal degradation. An equivalent circuit model was constructed to account for local impedance variations and the cumulative effects of cascaded connector interfaces. The model was validated using S-parameter measurements obtained from vector network analyzer (VNA) testing, showing strong agreement with simulation results. Experimental results reveal that the low-roughness (0.4 μm) contact surfaces lead to degraded signal integrity due to insufficient micro-contact formation. In contrast, scratch-induced moderate roughness (0.8–4.8 μm) improves transmission performance, although signal quality declines as roughness increases within this range. These effects are further amplified in multi-connector configurations due to accumulated impedance mismatches. This work provides new insight into the coupling between microscale surface features and frequency-domain transmission characteristics, offering practical guidance for surface engineering, contact design, and the development of miniaturized, high-reliability radio frequency interconnects for next-generation communication systems. Full article
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