Concrete structures inevitably experience cracking, which is a common form of damage. If cracks are left undetected and allowed to worsen, catastrophic failures, with costly implications for human life and the economy, can occur. Traditional image pr...
Non-destructive measurements of high aspect ratio microscale features, especially those with internal geometries such as micro-holes, remain a challenging metrology problem that is increasing in difficulty due to the increasing requirement for more c...
New automated laser radar measurement systems at the Saab Inc. West Lafayette, USA, facility will make airframe assembly of the aft body for the new eT7-A aircraft a quicker, more cost-efficient process. Digital twin concepts realized through simulat...
Non-collaborative (i.e., reflective, transparent, metallic, etc.) surfaces are common in industrial production processes, where 3D reconstruction methods are applied for quantitative quality control inspections. Although the use or combination of pho...
Voltage standards are widely used to transfer volts from Josephson voltage standards (JVSs) at national metrology institutes (NMIs) into calibration labs to maintain the volts and to transfer them to test equipment at production lines. Therefore, com...
Sensor networks, which are increasingly being used in a broad range of applications, constitute a measurement paradigm involving ensembles of sensors measuring possibly different quantities at a discrete sample of spatial locations and temporal point...
Metal additive manufacturing (AM) techniques such Direct Energy Deposition (DED), Powder Bed Fusion (PBF), and Wire Arc Additive Manufacturing (WAAM) enable the production of complex metal components built at rapid rates. Because of the complexity of...
The Tsallis q-Gaussian distribution is a powerful generalization of the standard Gaussian distribution and is commonly used in various fields, including non-extensive statistical mechanics, financial markets and image processing. It belongs to the q-...
The main challenges in 3D metrology involve measuring TSVs etched with very high aspect ratios, where the via depth to diameter ratio approaches 10:1–20:1. In this paper, we introduce an innovative approach to enhance our in-house spectroscopic...
The dimensional accuracy of a laser scanner has been extensively evaluated using various measurement methods and diverse reference standards. This study specifically focuses on two key considerations. Firstly, it assesses the dimensional accuracy of...
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