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Micromachines publishes Special Issues to create collections of papers on specific topics, with the aim of building a community of authors and readers to discuss the latest research and develop new ideas and research directions. Special Issues are led by Guest Editors, who are experts on the topic and all Special Issue submissions follow MDPI's standard editorial process. The journal’s Editor-in-Chief and/or designated Editorial Board Member will oversee Guest Editor appointments and Special Issue proposals, checking their content for relevance and ensuring the suitability of the material for the journal. The papers published in a Special Issue will be collected and displayed on a dedicated page of the journal’s website. Further information on MDPI's Special Issue policies and Guest Editor responsibilities can be found here. For any inquiries related to a Special Issue, please contact the Editorial Office.

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CMOS-MEMS Fabrication Technologies and Devices, 2nd Edition

edited by

Liangxing Hu

submission deadline 30 Aug 2026 | 2 articles | Viewed by 3583 | Submission Open

Keywords: CMOS-MEMS fabrication technologies; CMOS; MEMS; CMOS-MEMS integration; 3D integration

(This special issue belongs to the Section A：Physics)

Reliability Metrology, Testing and Failure Analysis of Semiconductor Devices

edited by

Liangxing Hu

submission deadline 30 Aug 2026 | Viewed by 545 | Submission Open

Keywords: reliability metrology; test; failure analysis; semiconductor devices; sensors; actuators; MEMS; CMOS devices

(This special issue belongs to the Section D1: Semiconductor Devices)

Smart Robots for Industrial Inspection: Integrating Micro-Technologies and Intelligent Systems

edited by

Bo Li

Min Li

and Xiaoling Li

submission deadline 30 Aug 2026 | Viewed by 142 | Submission Open

Keywords: soft robot; micro robots; industrial robot; control strategy; measurement and inspection; intelligent operation and maintenance; advanced sensors and micro-sensors integration

(This special issue belongs to the Section E：Engineering and Technology)

Advanced Magnetoelastic Immunosensors and Their Applications

edited by

Zhongyun Yuan

submission deadline 30 Aug 2026 | Viewed by 139 | Submission Open

Keywords: magnetoelastic sensors; magnetostrictive materials; magnetoelastic coupling; immunosensors; smart sensing

Micro/Nanostructures in Sensors and Actuators, 2nd Edition

edited by

Cong Wang

and

Shulan Jiang

submission deadline 31 Aug 2026 | 11 articles | Viewed by 19899 | Submission Open

Keywords: micro/nano fabrication; micro/nano structure; sensors and actuators; MEMS; BioMEMS

(This special issue belongs to the Section A：Physics)

Micro-Energy Harvesting Technologies and Self-Powered Sensing Systems

edited by

Zhaozheng Wang

, Tianzhao Bu and

Jianhua Zeng

submission deadline 31 Aug 2026 | 11 articles | Viewed by 12875 | Submission Open

Keywords: micro-energy harvesting; self-powered sensing; functional materials; micro fabrication; wearable devices

(This special issue belongs to the Section E：Engineering and Technology)

Nanogenerators: Design, Fabrication and Applications

edited by Junqing Zhao and

Xiaojing Mu

submission deadline 31 Aug 2026 | 1 articles | Viewed by 4886 | Submission Open

Keywords: nanogenerator; micro- and nano-manufacturing; nanotechnology; energy harvesting; nanoelectronics

(This special issue belongs to the Section A：Physics)

Research Progress of Ultra-Precision Micro-Nano Machining, Second Edition

edited by

Huaizhong Li

and Xiubing Jing

submission deadline 31 Aug 2026 | 2 articles | Viewed by 1152 | Submission Open

Keywords: ultra-precision machining; micro-nano machining; micro-nano chip formation; process modeling and simulation; process automation and optimization

(This special issue belongs to the Section D：Materials and Processing)

Novel RF Nano- and Microsystems

edited by Zhongqian Niu

submission deadline 31 Aug 2026 | 1 articles | Viewed by 430 | Submission Open

Keywords: RF Nano- and Microsystems; millimeter-wave and terahertz filters; millimeter-wave and terahertz mixers; millimeter-wave and terahertz multipliers; millimeter-wave and terahertz front end

(This special issue belongs to the Section A：Physics)

MEMS Gas Sensors and Electronic Nose

edited by Wenfeng Shen and Jun Yu

submission deadline 31 Aug 2026 | Viewed by 106 | Submission Open

Keywords: MEMS semiconductor gas sensors; MEMS optical gas sensors; electronic nose and its applications

(This special issue belongs to the Section B：Biology and Biomedicine)

Microwave/Millimeter-Wave Devices and Metasurfaces

edited by

Ruizhi Liu

Chang Ding

and

Guo Liu

submission deadline 31 Aug 2026 | Viewed by 78 | Submission Open

Keywords: metasurface; reconfigurable intelligent surface; reflecting modulation

(This special issue belongs to the Section E：Engineering and Technology)

MEMS Actuators and Their Applications, Second Edition

edited by

Nicholas Sammut

submission deadline 31 Aug 2026 | Viewed by 76 | Submission Open

Keywords: MEMS actuators; microactuators; microactuator technologies

(This special issue belongs to the Section A：Physics)

Laser Micro/Nano Fabrication, Third Edition

edited by

Thomas C. Hutchens

submission deadline 31 Aug 2026 | Viewed by 65 | Submission Open

Keywords: laser micro/nanofabrication/machining; direct laser writing; subtractive/additive processing; surface texturing; optical surface modification; ultrafast/femtosecond lasers

(This special issue belongs to the Section D：Materials and Processing)

Neural Microelectrodes for Brain–Computer Interfaces

edited by

Jinping Luo

, Yilin Song and

Xinxia Cai

submission deadline 31 Aug 2026 | Viewed by 45 | Submission Open

Keywords: neural microelectrodes; brain– computer interface; materials and micro/nanofabrication; neural signal processing; translational applications

(This special issue belongs to the Section B：Biology and Biomedicine)

Semiconductor Materials and Processing Technology

edited by

Sung Gyu Pyo

submission deadline 31 Aug 2026 | Viewed by 24 | Submission Open

Keywords: semiconductor processing; deposition; etching; interconnect technology; thin film processing; process integration; wafer manufacturing; photolithography; patterning; packaging

(This special issue belongs to the Section D1: Semiconductor Devices)

Neuromorphic Memory and Computing-in-Memory Architectures: From Devices to Systems

edited by

Jinyong Wang

and Jing Liu

submission deadline 10 Sep 2026 | Viewed by 337 | Submission Open

Keywords: neuromorphic devices; memory devices; computing-in-memory; memristor; synaptic electronics; analog neural computing; crossbar arrays; von Neumann bottleneck; edge intelligence; optoelectronic memory; photonic– electronic hybrid computing; hardware AI accelerators; intelligent sensing

(This special issue belongs to the Section A：Physics)

Precision Actuation at Micro-Nano Scales: From Piezoelectric Motors to Magnetic Robots

edited by Cunman Liang and

Pan Li

submission deadline 15 Sep 2026 | Viewed by 7 | Submission Open

Keywords: piezoelectric motor; magnetic robots; micro-manipulation

(This special issue belongs to the Section A：Physics)

Laser Micro/Nano Fabrication and Surface Modification Technology

edited by

Qinghua Wang

submission deadline 25 Sep 2026 | Viewed by 24 | Submission Open

Keywords: laser micro/nano fabrication; laser surface modification; functional surface; surface microstructure; surface chemistry; surface roughness; surface characterization; wettability; laser– material interaction mechanism; laser materials processing

(This special issue belongs to the Section D：Materials and Processing)

Flexible and Wearable Devices for Health Monitoring and Energy Harvesting

edited by

Rafael Gonzalez-Landaeta

and

Amanda Carrillo Castillo

submission deadline 30 Sep 2026 | 1 articles | Viewed by 1746 | Submission Open

Keywords: wearables; devices for healthcare; energy harvesting; sensors; flexible electronics; supercapacitors; harvesters; self-powered electronics

(This special issue belongs to the Section A：Physics)

Advanced Packaging for Microsystem Applications, 4th Edition

edited by

Wenchao Tian

and

Yongkun Wang

submission deadline 30 Sep 2026 | 1 articles | Viewed by 513 | Submission Open

Keywords: advanced packaging technology; MEMSs; reliability; NEMSs; packaging materials; modeling and simulation; design and manufacturing process; microsystems

(This special issue belongs to the Section A：Physics)

MEMS/NEMS Devices and Applications, 4th Edition

edited by

Ching-Liang Dai

and Zhi-Xuan Dai

submission deadline 30 Sep 2026 | Viewed by 107 | Submission Open

Keywords: physical sensors; force sensors; magnetic sensors; optical sensors; microphones; flow sensors; thermal sensors; chemical sensors; biosensors; gas sensors; actuators; resonators/filters; switches/relays; energy harvesters; lens/mirrors

(This special issue belongs to the Section E：Engineering and Technology)

Fabrication, Reliability, Simulation, and Protection of Advanced Semiconductor Devices and Integrated Circuits: Enabled by Emerging Semiconductor Materials

edited by Xiyuan Feng and Yunlei Zhong

submission deadline 30 Sep 2026 | Viewed by 105 | Submission Open

Keywords: emerging semiconductor materials; advanced semiconductor devices; integrated circuits (ICs); fabrication processes; reliability engineering; multi-physics simulation; device protection strategies; wide-bandgap semiconductors (WBG); two-dimensional materials

(This special issue belongs to the Section D1: Semiconductor Devices)

Advances in Micro/Nano-Fabricated GaN-Based Semiconductor Devices: Materials, Processing, and Applications

edited by Lei Li

submission deadline 30 Sep 2026 | Viewed by 94 | Submission Open

Keywords: optoelectronic devices; electronic devices; material characterizations; device physics; device reliability

(This special issue belongs to the Section D1: Semiconductor Devices)

Translational Microfluidics: From Lab Prototype to Scalable Manufacturing

edited by

and

submission deadline 30 Sep 2026 | Viewed by 73 | Submission Open

Keywords: microfluidic design; prototyping and fabrication technologies; systems integration; scalable manufacturing

(This special issue belongs to the Section E：Engineering and Technology)

Two-Dimensional Materials for Electronic and Optoelectronic Devices, 2nd Edition

edited by

Kuibo Yin

submission deadline 30 Sep 2026 | Viewed by 22 | Submission Open

Keywords: 2D material fabrication and characterization; electronic devices based on 2D materials; optoelectronic devices based on 2D materials

(This special issue belongs to the Section D：Materials and Processing)

Integrated RF MEMS and Applications

edited by

Azeemuddin Syed

submission deadline 25 Oct 2026 | Viewed by 63 | Submission Open

Keywords: RF MEMS; tunable RF devices; integrated RF systems; 5G/6G and microwave/millimeter-wave systems

(This special issue belongs to the Section E：Engineering and Technology)

Advanced Surface Engineering Processes in Micro/Nano-Manufacturing

edited by Weijia Guo and Qian Yu

submission deadline 31 Oct 2026 | Viewed by 111 | Submission Open

Keywords: thin-film deposition; surface patterning; lithography-based techniques; surface modification; additive micro/nano-scale surface engineering

(This special issue belongs to the Section D：Materials and Processing)

Recent Advances in Micro/Nanofabrication, 3rd Edition

edited by

Yao Liu

and

Jinjie Zhou

submission deadline 20 Nov 2026 | 1 articles | Viewed by 501 | Submission Open

Keywords: micromachining; micro-3D printing; laser machining; textured surface; microdevice

(This special issue belongs to the Section D：Materials and Processing)

Nanomaterials for Micro/Nano Devices, 3rd Edition

edited by

Amir Hussain Idrisi

submission deadline 30 Nov 2026 | Viewed by 62 | Submission Open

Keywords: nanomaterials; nanocomposites; nanoelectronics; micro/nano devices; synthesis and characterization; integration and performance; energy harvesting; sensing and actuation; biomedicine; additive manufacturing; micro/nano manufacturing; micro/nano fabrication

(This special issue belongs to the Section D：Materials and Processing)

Advanced Etching Technologies for Three-Dimensional Integrated Chips

edited by Bo Liu and Danny Reuter

submission deadline 30 Nov 2026 | Viewed by 26 | Submission Open

Keywords: etching technologies; 3D integrated chips; 3D integration; heterogeneous integration; micro/nano fabrication

(This special issue belongs to the Section D1: Semiconductor Devices)

Advanced Functional Shape Memory Alloys and Their Applications

edited by

Girolamo Costanza

and

Maria Elisa Tata

submission deadline 31 Dec 2026 | Viewed by 97 | Submission Open

Keywords: shape memory alloys; superelasticity; martensitic transformation; thin films; microfabrication; smart actuators; elastocaloric effect; MEMS/NEMS; additive manufacturing

(This special issue belongs to the Section D：Materials and Processing)

Integrated Bioelectronic Interfaces for Neuroengineering

edited by

Guangfu Wu

submission deadline 31 Dec 2026 | Viewed by 20 | Submission Open

Keywords: wearable/implantable neural interfaces; biosensor and bioelectronics; brain signals: EEG; EcoG; electrophysiology; spikes; LFP; neurochemicals; neurotransmitters; metabolites; temperature; intracranial pressure; neuromodulation: optogenetics; chemogenetics; magnetic/optical/electrical/acoustic stimulation; artificial intelligence: machine learning; deep learning; large language models

(This special issue belongs to the Section B：Biology and Biomedicine)

Electrochemical Microdevices and Microsystems: Design, Fabrication, and Applications

edited by

Rui Gao

submission deadline 31 Dec 2026 | Viewed by 14 | Submission Open

Keywords: electrochemical microdevices; microfabricated electrodes; MEMS; micromachining; microfluidics; lab-on-a-chip; electrochemical sensors; biosensors; flexible and wearable microsystems; micro-batteries; micro-supercapacitors; micro-fuel cells; micro-electrolyzers; printed electronics; additive manufacturing; wafer-level integration; packaging and reliability; operando characterization; transport in confined geometries

(This special issue belongs to the Section C：Chemistry)

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