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Micromachines publishes Special Issues to create collections of papers on specific topics, with the aim of building a community of authors and readers to discuss the latest research and develop new ideas and research directions. Special Issues are led by Guest Editors, who are experts on the topic and all Special Issue submissions follow MDPI's standard editorial process. The journal’s Editor-in-Chief and/or designated Editorial Board Member will oversee Guest Editor appointments and Special Issue proposals, checking their content for relevance and ensuring the suitability of the material for the journal. The papers published in a Special Issue will be collected and displayed on a dedicated page of the journal’s website. Further information on MDPI's Special Issue policies and Guest Editor responsibilities can be found here. For any inquiries related to a Special Issue, please contact the Editorial Office.

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Integrated Bioelectronic Interfaces for Neuroengineering

edited by

Guangfu Wu

submission deadline 31 Dec 2026 | Viewed by 179 | Submission Open

Keywords: wearable/implantable neural interfaces; biosensor and bioelectronics; brain signals: EEG; EcoG; electrophysiology; spikes; LFP; neurochemicals; neurotransmitters; metabolites; temperature; intracranial pressure; neuromodulation: optogenetics; chemogenetics; magnetic/optical/electrical/acoustic stimulation; artificial intelligence: machine learning; deep learning; large language models

(This special issue belongs to the Section B：Biology and Biomedicine)

High-Performance Semiconductor Memory: Capacitor-Less DRAM and Emerging Architectures

edited by

Sung-Woong Chung

submission deadline 31 Dec 2026 | Viewed by 165 | Submission Open

Keywords: high-performance memory; capacitor-less DRAM (1T/2T); embedded memory; thyristor-based devices; novel channel materials; 3D stackable architectures; TCAD simulation

(This special issue belongs to the Section E：Engineering and Technology)

On-Chip Gas Sensing and Applications

edited by Kaiyuan Zheng and Haihong Bao

submission deadline 31 Dec 2026 | Viewed by 146 | Submission Open

Keywords: on-chip optical sensors; integrated photonics; gas sensing; silicon photonics; mid-infrared spectroscopy; plasmonics; nanophotonics; photonic integrated circuits; lab-on-chip; miniaturized sensors

(This special issue belongs to the Section C：Chemistry)

Recent Advances in Nano and Microfluidics in Australia and New Zealand

edited by

David J. Collins

submission deadline 31 Dec 2026 | Viewed by 142 | Submission Open

Keywords: microfluidics; nanofluidics; 3D printing; biomicrofluidics; lab-on-a-chip; organ-on-a-chip; nanotechnology; wearables

(This special issue belongs to the Section B：Biology and Biomedicine)

Wearable Sensors, Low-Power Flexible Circuits and AI for Biomedical Applications

edited by Jegan Rajendran

submission deadline 31 Dec 2026 | Viewed by 134 | Submission Open

Keywords: wearable sensors; flexible circuit design; bioinstrumentation; feature extraction; electrochemical sensing; nanomaterials; biomedical signal processing; AI and machine learning; vital parameters measurement; point of care devices; energy harvesting

(This special issue belongs to the Section B：Biology and Biomedicine)

Magnetic MEMS: Devices, Materials, and Applications

edited by

Xuecheng Sun

submission deadline 31 Dec 2026 | Viewed by 128 | Submission Open

Keywords: magnetic MEMS; magnetic sensors; micro-actuators; magnetic materials; AI-enabled magnetic systems

(This special issue belongs to the Section A：Physics)

Manufacturing and Application of Advanced Thin-Film-Based Device, Second Edition

edited by

Guo-Hua Feng

submission deadline 31 Dec 2026 | Viewed by 112 | Submission Open

Keywords: film manufacturing; film characterization; functionalized film; thin-film device; advance device application; micromachining process

(This special issue belongs to the Section E：Engineering and Technology)

Two-Dimensional Semiconductors for Electronics and Optoelectronics

edited by Dongxue Chen

submission deadline 31 Dec 2026 | Viewed by 110 | Submission Open

Keywords: two-dimensional; semiconductors; electronics; optoelectronics; electroluminescence; transistor; nonlinear optical; photodetectors; optical modulators

(This special issue belongs to the Section D1: Semiconductor Devices)

Advancements in Metal Additive Manufacturing

edited by Young Won Kim

submission deadline 31 Dec 2026 | Viewed by 106 | Submission Open

Keywords: metal additive manufacturing; laser powder bed fusion; directed energy deposition; additive manufacturing alloys; micro/nano-scale microstructure evolution; melt pool dynamics; in situ process monitoring; micro-defect detection and characterization; surface topography and roughness; process optimization; digital twin; machine learning; qualification and certification

(This special issue belongs to the Section D3: 3D Printing and Additive Manufacturing)

Metasurfaces and Functional Microdevices for Terahertz and Photonic Applications

edited by

Bo Lv

submission deadline 31 Dec 2026 | Viewed by 97 | Submission Open

Keywords: metasurfaces; nanophotonics; metamaterials; plasmonic nanostructures; terahertz imaging; electromagnetic absorbers; photonic sensing; nano-optical devices; integrated photonic systems

(This special issue belongs to the Section E：Engineering and Technology)

Bioelectronics: Technology, Challenges and Applications

edited by

Zheren Cai

submission deadline 31 Dec 2026 | Viewed by 96 | Submission Open

Keywords: bioelectronics design and fabrication; electrophysiological/neural and cardiac interfaces; wearable and implantable sensors; biocompatible and functional materials; intelligent control; data analysis; and clinical translation

(This special issue belongs to the Section B：Biology and Biomedicine)

Micro/Nano Technologies for Ocean Sensing and Instrumentation

edited by

Libo Gao

submission deadline 31 Dec 2026 | Viewed by 43 | Submission Open

Keywords: underwater sensors; underwater instrumentation; marine sensing; ocean observation; low-noise acquisition

(This special issue belongs to the Section E：Engineering and Technology)

Microanalytical Technologies: In Honor of Prof. Susan Lunte, Recipient of the 2026 AES Lifetime Achievement Award

edited by Gongchen Sun, Henry C. W. Chu and

Xiangchun Xuan

submission deadline 31 Dec 2026 | Viewed by 30 | Submission Open

Keywords: electrokinetics; bioanalysis; capillary electrophoresis; energy; sustainability; device

(This special issue belongs to the Section C1: Micro/Nanoscale Electrokinetics)

Emerging Trends in Soft Robotics and Bioinspired Technologies

edited by

Dan Sameoto

submission deadline 15 Jan 2027 | 1 articles | Viewed by 1038 | Submission Open

Keywords: soft robotics; additive manufacturing; bio-hybrid robotics; embodied intelligence; artificial muscles; untethered operation; bioinspired; composites; democratization of research; sustainability

(This special issue belongs to the Section E：Engineering and Technology)

Acoustic Transducers and Their Applications, 3rd Edition

edited by Songsong Zhang,

Qiaozhen Zhang

and

Liang Lou

submission deadline 25 Jan 2027 | 6 articles | Viewed by 6739 | Submission Open

Keywords: acoustic transducers and their design; simulation; testing; and characterization; piezoelectric MEMS device; thin-film piezoelectric materials and material properties; MEMS integration process; acoustic modules; algorithms; circuits; and systems; acoustic lenses and meta-surfaces; acoustic transducer arrays and their applications; implementation and usage of acoustic devices for various applications

(This special issue belongs to the Section A：Physics)

Advances in Additive Manufacturing Technologies for Architected Materials

edited by

Winston Wai Shing Ma

and Xu Song

submission deadline 25 Jan 2027 | 1 articles | Viewed by 562 | Submission Open

Keywords: additive manufacturing; 3D printing; laser additive manufacturing; architected materials; structural optimization; multi-physical properties; multifunctional applications

(This special issue belongs to the Section D3: 3D Printing and Additive Manufacturing)

Soft Actuation and Soft Robotics: Synergies and Applications

edited by

Min Wang

and

Jinyao Tang

submission deadline 25 Jan 2027 | Viewed by 211 | Submission Open

Keywords: soft robotics; soft actuators and sensors; physical intelligence; bioinspiration synergy; novel structures; new fabrication technologies; soft robotics applications

(This special issue belongs to the Section A：Physics)

Photonic and Optoelectronic Devices and Systems, 5th Edition

edited by

Muhammad Ali Butt

submission deadline 25 Jan 2027 | Viewed by 31 | Submission Open

Keywords: optical waveguide devices; photonic sensors; photodiodes; solar cells; lasers; optical switches; logic gates; light-emitting diodes; plasmonics; metamaterials; photonic crystals; non-linear photonics; photonics for AI and neuromorphic computing; quantum photonics

(This special issue belongs to the Section A：Physics)

Microfluidic Systems for Biomedical Analysis, Detection and Diagnosis—Second Edition

edited by

David J. Collins

submission deadline 31 Jan 2027 | 1 articles | Viewed by 1460 | Submission Open

Keywords: microfluidics; microsystems; lab-on-a-chip; electrophoresis; tissue engineering; acoustofluidics; hydrodynamics; optical tweezers; micromanipulation; lab-on-a-disk; organ-on-a-chip; drug discovery; diagnosis; cell analysis; bioassay

(This special issue belongs to the Section B：Biology and Biomedicine)

Low-Dimensional Materials and Applications in Electronics

edited by

Haozhe Wang

and

Shengman Li

submission deadline 31 Jan 2027 | 1 articles | Viewed by 1110 | Submission Open

Keywords: 2D materials; 1D materials; zero-dimensional systems; electronic; optoelectronic; MXene; characterization techniques; field-effect transistors; memory devices; biosensors; high-frequency and terahertz electronics; semiconductor technology

(This special issue belongs to the Section D：Materials and Processing)

Advances in 3D Printing for Micro- and Nanoscale Biomedical Applications

edited by

Dennis Douroumis

and

Huifeng Du

submission deadline 31 Jan 2027 | Viewed by 388 | Submission Open

Keywords: 3D printing; microscale medical devices; drug delivery systems; lab on a chip; biocompatible materials; diagnostics; artificial intelligence; sensors and electronics

(This special issue belongs to the Section D3: 3D Printing and Additive Manufacturing)

Next-Generation Biomedical Devices

edited by Kyowon Kang and

Hee-Jae Jeon

submission deadline 20 Feb 2027 | 4 articles | Viewed by 3538 | Submission Open

Keywords: wearable devices; implantable devices; neuromorphic devices; organ-on-chip; biosensors; wireless communication; energy harvesting; low-power biomedical devices; bioelectronic integrated circuits; physiological sensing; physiological stimulation

(This special issue belongs to the Section B：Biology and Biomedicine)

Materials and Devices for Advanced Thermal Energy Harvesting and Management

edited by

Amin Nozariasbmarz

submission deadline 20 Feb 2027 | 1 articles | Viewed by 605 | Submission Open

Keywords: thermoelectric materials and devices; waste heat recovery; thermal management; body power harvesting; thermoelectric generators; thermoelectric coolers; thermal energy harvesting; phase change materials; thermomagnetic materials; pyroelectric materials

(This special issue belongs to the Section D：Materials and Processing)

Advancements in Metal Additive Manufacturing of Multicomponent Alloys

edited by

Sandeep Jain

and

Pradyumn Kumar Arya

submission deadline 20 Feb 2027 | 1 articles | Viewed by 482 | Submission Open

Keywords: metal additive manufacturing; process– structure– property relationship; machine learning in materials science; high-entropy alloys; computational materials engineering; advanced manufacturing technologies

(This special issue belongs to the Section D3: 3D Printing and Additive Manufacturing)

The Next-Generation of Magnetometer Microsystems and Applications, 3rd Edition

edited by

Zongmin Ma

submission deadline 28 Feb 2027 | 2 articles | Viewed by 644 | Submission Open

Keywords: quantum sensor; magnetic sensors; magnetometer; chip scale; NV center; SQUID; SERF; magnetometer microsystem; magnetometer application

(This special issue belongs to the Section A：Physics)

Fluid Flow in Microchannel

edited by Bijoy Bera

submission deadline 28 Feb 2027 | Viewed by 79 | Submission Open

Keywords: microfluidic flow; micro-scale extrusion; multi-phase; targeted drug delivery; water management in electrolyzers; micro-food; flow instabilities

(This special issue belongs to the Section E：Engineering and Technology)

Advanced Microwave Devices and RF Chips: Design, Microfabrication, and Applications

edited by

Cong Wang

submission deadline 25 Mar 2027 | Viewed by 88 | Submission Open

Keywords: theory; modeling; fabrication; measurement and applications of microwave devices and RF chips; microwave devices and RF chips for communication; radar; and related systems; microwave devices in antennas; filters; RF sensors; power amplifiers; integrated passive devices; terahertz technologies and devices; microwave and millimeter-wave integrated circuits

(This special issue belongs to the Section E：Engineering and Technology)

Current Research Progress in Microwave Metamaterials and Metadevices

edited by

Linda Shao

and

Xiaoguang Zhao

submission deadline 31 Mar 2027 | 2 articles | Viewed by 2240 | Submission Open

Keywords: theory and modeling of metamaterials/metasurfaces; electromagnetic metamaterials/metasurfaces; reconfigurable metamaterials/metasurfaces; novel effects in microwave metadevices

(This special issue belongs to the Section D：Materials and Processing)

Future Trends in Ultra-Precision Machining, Second Edition

edited by

Changlin Liu

Yanbin Zhang

and

Xiaoliang Liang

submission deadline 31 Mar 2027 | 1 articles | Viewed by 382 | Submission Open

Keywords: ultra-precision machining; material removal mechanism; optical material; surface topography

(This special issue belongs to the Section D：Materials and Processing)

Advanced Nano-Semiconductor Devices: Design, Modeling and Next-Generation AI Applications, 2nd Edition

edited by

Bin Wang

submission deadline 31 Mar 2027 | Viewed by 49 | Submission Open

Keywords: nano-semiconductor devices; NMOS devices; CMOS devices; field-effect transistors; modeling and simulation; reliability design; novel concepts for device structure design; quantum effects and quantum devices; IoT and AI applications

(This special issue belongs to the Section D1: Semiconductor Devices)

Field-Assisted Hybrid Manufacturing for High-Performance Components

edited by

Jian Cheng

, Linjie Zhao, Xianghui Huang and

Jinyang Xu

submission deadline 20 Apr 2027 | 2 articles | Viewed by 902 | Submission Open

Keywords: field-assisted manufacturing; multi-physical fields; performance evaluation; microstructure evolution; hybrid manufacturing; surface engineering; process modeling and simulation; digital twins; micro/nano advanced applications

(This special issue belongs to the Section D：Materials and Processing)

Advanced Flexible Electronic Devices for Biomedical Application

edited by

Yueying Yang

and

Junyeob Yeo

submission deadline 30 Apr 2027 | 1 articles | Viewed by 5060 | Submission Open

Keywords: flexible or stretchable electronics; wearable sensors; implantable devices; smart prosthetics; bioelectronics; flexible electronic materials; advanced fabrication techniques; bio-integrated systems

(This special issue belongs to the Section B：Biology and Biomedicine)

Bioelectronics and Its Limitless Possibilities, 2nd Edition

edited by

Tianyu Yang

submission deadline 30 Apr 2027 | Viewed by 55 | Submission Open

Keywords: bio-integrated electronics; biomaterials; transient electronics; electrochemistry; implantable and wearable devices; sensors and diagnostics; human– machine interfaces; machine learning; AI healthcare; neural interfaces; biomimetic electronics; lab-on-chip technologies; hydrogel electronics; digital therapeutics; translational bioelectronics

(This special issue belongs to the Section B：Biology and Biomedicine)

Advances in Abrasive Micro-Machining

edited by

Chen Li

submission deadline 30 Apr 2027 | Viewed by 4 | Submission Open

Keywords: grinding; polishing; abrasive machining; ultra-precision machining; nanoscratch; nanoindentation; hard and brittle materials; composite materials

(This special issue belongs to the Section D：Materials and Processing)

Flexible Hydrogel Electronics

edited by Shoujing Zheng,

Qingya Li

and Hao You

submission deadline 31 May 2027 | Viewed by 55 | Submission Open

Keywords: flexible hydrogel electronics; conductive hydrogels; hydrogel large deformation model; ionic hydrogels; wearable sensors; bioelectronics; hydrogel actuators; soft robotics; micro/nano fabrication; stretchable devices

(This special issue belongs to the Section E：Engineering and Technology)

Flexible Electronics and Intelligent Manufacturing

edited by Hegeng Li

submission deadline 31 May 2027 | Viewed by 15 | Submission Open

Keywords: flexible electronics; functional electronics; 3D printing technologies; flexible transistors; polymer materials

(This special issue belongs to the Section A：Physics)

Organic Semiconductors: Materials, Microdevices, and Integrated Systems

edited by

Dharmendra Pratap Singh

, Paweł Ziółkowski,

Pushpendra Kumar

and Ajit Kumar Katiyar

submission deadline 31 Jul 2027 | Viewed by 365 | Submission Open

Keywords: microdevices using organic semiconductors; integrated flexible electronic devices; photodetectors; electronic processes; organic field-effect transistors; organic light-emitting diodes; delayed fluorescent processes in organic materials; organic transport layer materials; organic photovoltaics; heat and electronic transport modelling in semiconducting devices; energy conversion; thermodynamic process in organic semiconductors; photothermal and mechano-optical effects in nanoclusters; modelling of microdevices

(This special issue belongs to the Section D1: Semiconductor Devices)

Displaying special issue 251-300 on page 6 of 6.

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