Power Semiconductor Devices and Integration Technology
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D1: Semiconductor Devices".
Deadline for manuscript submissions: 30 June 2026 | Viewed by 30
Special Issue Editor
Special Issue Information
Dear Colleagues,
Power semiconductor devices serve a pivotal role in various applications, ranging from renewable energy system to industrial automation, consumer electronics, data center, rail transportation, aerospace, smart grids, and more. High voltage, low power consumption, high frequency, and high reliability becomes undoubtedly important amidst the global energy transitions and smart manufacturing trends. On the one hand, traditional silicon-based power devices and integration technologies still play a crucial role because of their low cost, mature technologies and high market share. On the other hand, wide bandgap semiconductors (e.g., silicon carbide SiC, gallium nitride GaN, gallium oxide GaO, etc.) offer advantages of high breakdown field strength and low loss, significantly enhancing efficiency and power density. This Special Issue tends to provide a platform to gather novel findings and developments with a target of power semiconductor devices and integration technology with high-power density, low loss, and high reliability.
Dr. Jie Wei
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- high voltage devices
- low voltage devices
- power IC device technology
- power IC design
- wide bandgap semiconductor (GaN, SiC, GaO, and so on)
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.
Further information on MDPI's Special Issue policies can be found here.
