Emerging Technologies and Applications for Semiconductor Industry

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E:Engineering and Technology".

Deadline for manuscript submissions: 30 June 2026 | Viewed by 2

Special Issue Editors


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Guest Editor
School of Information Engineering, Guangdong University of Technology, Guangzhou 510006, China
Interests: artificial intelligence and related applications in intelligent manufacturing; industrial inspection; safety surveillance; biomedicine; and new energy

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Guest Editor
School of Mechanical and Electrical Engineering, Guangdong University of Technology, Guangzhou 510006, China
Interests: micro-electronic manufacturing technology and equipment; micro-nano manufacturing and equipment

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Guest Editor
College of Materials Science and Engineering, Hunan University, Changsha 410082, China
Interests: advanced materials for flexible electronic technologies
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Special Issue Information

Dear Colleagues,

Semiconductors are the backbone of modern electronics, driving advancements in fields such as computing, telecommunications, and energy storage. This Special Issue will focus on the technologies and applications for the semiconductor industry, especially on materials, design, processing, components, devices, equipment, systems, etc., to push the development of the semiconductor industry. Topics of interest include, but are not limited to, new material developments, materials characterization techniques, processing technologies, semiconductor component and device design, data analysis, semiconductor testing and metrology, and advanced semiconductor equipment and systems. This Special Issue will serve as a comprehensive resource for researchers, engineers, and industry professionals interested in semiconductor advancements.

We invite you to submit original research articles or reviews that explore semiconductor industrial technologies and applications in the following areas, but not limited to, the following:

  1. Semiconductor Materials for Emerging Technologies:

- Novel semiconductor materials such as wide bandgap semiconductors for power electronics and optoelectronics.

- Two-dimensional materials and their integration in nanoelectronics.

- Organic semiconductors for flexible and printed electronics.

  1. Advanced Semiconductor Processing and Fabrication Techniques:

- Material synthesis and deposition methods for high-performance semiconductors.

- Patterning techniques such as nanoimprint lithography and their impact on material properties.

- Advanced etching and doping technologies for fine-tuning material characteristics.

  1. Materials for Semiconductor Devices:

- High-k dielectrics, gate materials, and their impact on transistor performance.

- Three-dimensional integration and packaging materials for next-generation semiconductor devices.

- Materials for memory devices, including resistive switching materials, ferroelectrics, and phase-change materials.

  1. Characterization and Modeling of Semiconductor Materials:

- Advanced techniques for material characterization.

- Computational models for predicting material properties and device performance.

- In situ characterization for real-time material behavior monitoring during fabrication.

  1. Sustainability and Recycling of Semiconductor Materials:

- Materials for environmentally friendly semiconductor manufacturing processes.

- Strategies for recycling and reusing semiconductor materials in the context of sustainability.

  1. Semiconductor Components and Equipment:

-Advanced semiconductor manufacturing equipment, including deposition, etching, lithography, and packaging systems.

-Materials and design of critical components for semiconductor equipment, such as chambers, electrodes, targets, and gas distribution systems.

-Innovations in thermal management, plasma sources, and power delivery systems for high-performance semiconductor fabrication.

-Reliability, lifetime improvement, and failure analysis of key equipment components under extreme operating conditions.

  1. Semiconductor Testing and Metrology:

-Advanced inspection and metrology techniques for nanoscale semiconductor devices.

-In-line and real-time monitoring methods for process control and defect detection.

-Development of non-destructive testing approaches for semiconductor materials, components, and integrated devices.

-Machine learning and AI-driven methods for data analysis in semiconductor testing and characterization.

Prof. Dr. Nian Cai
Prof. Dr. Han Wang
Prof. Dr. Zuyong Wang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • emerging semiconductor materials
  • advanced processing and fabrication techniques
  • materials for semiconductor devices
  • semiconductor material characterization
  • sustainability and recycling
  • semiconductor components and equipment
  • semiconductor testing and metrology

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Published Papers

This special issue is now open for submission.
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