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Micromachines
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MEMS Inertial Device, 3rd Edition
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MEMS Inertial Device, 3rd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: 20 June 2026 | Viewed by 9400

Special Issue Editor

Prof. Dr. Huiliang Cao

E-Mail Website
Guest Editor
School of Information and Electronics, Beijing Institute of Technology, Beijing 100081, China
Interests: MEMS; gyroscope; extreme environment sensing technology
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

MEMS inertial devices are the most widely used component of MEMS sensors, including MEMS gyroscopes and MEMS accelerometers. They possess the advantages of a small size, light weight, low cost, mass production capacity, and good impact resistance. MEMS inertial devices have important application value and broad application prospects in the national economy and national defense and military fields. The development of the current information-intelligent era has brought new development opportunities for MEMS inertial devices; thus, MEMS inertial devices have entered a new development stage of higher accuracy and higher reliability. Accordingly, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on (1) microstructure optimization design of MEMS inertial devices, (2) MEMS inertial device measurements and control systems, (3) MEMS inertial device manufacturing technology, and (4) the integrated application of MEMS inertial devices.

We look forward to receiving your submissions.

Prof. Dr. Huiliang Cao
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • MEMS inertial device
  • MEMS inertial device controlling method
  • inertial device signal processing
  • MEMS inertial device modeling and simulation
  • MEMS gyroscope
  • MEMS accelerometer

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Related Special Issue

Published Papers (5 papers)

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Research

19 pages, 8929 KB  
Article
Design and Fabrication of a Dual-Axis MEMS Electrostatic Micromirror Based on a Planar Comb Drive
by Mumu Li, Wenlong Jiao, Kun Huang, Botao Wang, Zhihua Dai, Yang Gao, Huiliang Cao and Huikai Xie
Micromachines 2026, 17(3), 278; https://doi.org/10.3390/mi17030278 - 24 Feb 2026
Viewed by 1392
Abstract
This paper designs and fabricates an electrostatic-driven dual-axis MEMS micromirror capable of out-of-plane torsional motion about both the X and Y axes. Both torsional axes employ planar comb structures for their drive mechanisms, effectively reducing the fabrication complexity. By leveraging the structural asymmetry [...] Read more.
This paper designs and fabricates an electrostatic-driven dual-axis MEMS micromirror capable of out-of-plane torsional motion about both the X and Y axes. Both torsional axes employ planar comb structures for their drive mechanisms, effectively reducing the fabrication complexity. By leveraging the structural asymmetry introduced during processing in conjunction with resonant operating modes, the inherent disadvantage of planar comb structures for torsional motion is overcome. This study explores the operating principle, structural design, performance simulation, fabrication process, and testing of the micromirror. It proposes an indirect simulation method suitable for planar comb drive structures, providing theoretical support for device fabrication. During fabrication, optimising the removal of isolation material through oxygen–silicon growth enhances the reliability of subsequent processes. Test results demonstrate that the fabricated MEMS micromirror achieves a 26°×22° field of view at a 35 V drive voltage, outputting Lissajous-type scanning patterns. This design aims to propose an indirect simulation method and optimise the process accordingly. Experimental test results show that the simulation method is relatively accurate, with minimal deviation from actual tests. Process optimization improves wafer cleanliness and reduces the time cost of the corresponding process. Full article
(This article belongs to the Special Issue MEMS Inertial Device, 3rd Edition)
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15 pages, 5681 KB  
Article
Real-Time Data Acquisition System for Array MIMU Based on FPGA+ARM
by Xiaoyang Qin, Huan Wang, Zhihua Dai, Yonghua Wang, Junqing Zhang, Tao Guo and Huiliang Cao
Micromachines 2026, 17(2), 239; https://doi.org/10.3390/mi17020239 - 12 Feb 2026
Viewed by 397
Abstract
To address the issue of low accuracy and stability in the gyroscope components of the micro-inertial-measurement-unit (MIMU) core units, which limits their application in high-precision scenarios, this paper designs a real-time data acquisition system for array MIMU based on FPGA and ARM. This [...] Read more.
To address the issue of low accuracy and stability in the gyroscope components of the micro-inertial-measurement-unit (MIMU) core units, which limits their application in high-precision scenarios, this paper designs a real-time data acquisition system for array MIMU based on FPGA and ARM. This system establishes a complete data chain encompassing raw data acquisition, real-time processing, multi-source information fusion, data storage, and communication with a host computer. It has been successfully applied to a 100-m pipeline position coordinate measurement scenario. The paper begins by discussing the overall system design, including both hardware circuit and software code development. Attitude update algorithms and measurement accuracy evaluation metrics are also introduced. System functionality is validated through static tests and practical pipeline measurements. Experimental results demonstrate that the system improves the accuracy of a single micro-electro-mechanical system (MEMS) gyroscope by a factor of 7.4 to 7.7. It also enables precise calculation of the pipeline position coordinates over the 100 m distance, achieving a horizontal positioning error of less than 0.0774 m and an elevation positioning error of less than 0.0351 m. These results fully confirm the significant effectiveness of the array design in mitigating gyroscope random errors, providing a reliable technical solution for pipeline measurement. Full article
(This article belongs to the Special Issue MEMS Inertial Device, 3rd Edition)
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22 pages, 10582 KB  
Article
A Novelty Temperature Compensation Model for Dual-Mass Vibration MEMS Gyroscope Based on Machine Learning and TTAO-VMD Algorithm
by Wenbo Tan, Yan Wang and Xinwang Wang
Micromachines 2026, 17(1), 120; https://doi.org/10.3390/mi17010120 - 16 Jan 2026
Viewed by 1168
Abstract
The output of MEMS gyroscopes is highly vulnerable to ambient temperature variations, which induce temperature drift errors and degrade navigation precision. Consequently, temperature compensation for MEMS gyroscope outputs is of critical importance. To address this issue, this study proposes a novel temperature compensation [...] Read more.
The output of MEMS gyroscopes is highly vulnerable to ambient temperature variations, which induce temperature drift errors and degrade navigation precision. Consequently, temperature compensation for MEMS gyroscope outputs is of critical importance. To address this issue, this study proposes a novel temperature compensation model for the dual-mass vibration MEMS gyroscope (DMVMG), which integrates the TTAO-VMD, 1D-CNN-Bi-GRU-Attention, and SHAKF algorithms. The implementation process of the proposed model is as follows: firstly, the structural configuration and fundamental operating principle of the DMVMG are elaborated. Secondly, the temperature error compensation model is constructed based on the fusion of the TTAO-VMD, 1D-CNN-Bi-GRU-Attention, and SHAKF algorithms. Thirdly, the raw output signal of the DMVMG is preprocessed using the TTAO-VMD algorithm, which decomposes the signal into four distinct components, namely high-frequency noise, white noise, mixed noise, and temperature-induced noise. Subsequently, the high-frequency and white noise components are eliminated, while the mixed noise component is filtered via the SHAKF algorithm. On this basis, the 1D-CNN-Bi-GRU-Attention algorithm is adopted to establish the temperature error compensation model, with the temperature, temperature change rate, time, and temperature-induced noise as input variables. Finally, the optimized signal components are reconstructed to yield the temperature-compensated output of the DMVMG. The experimental results based on the Allan variance method demonstrate that the angle random walk (N) is reduced from 18.56 °/h to 0.17 °/h, and the bias instability (B) is decreased from 32.76 °/h to 0.82 °/h, verifying the effectiveness of the proposed method. Full article
(This article belongs to the Special Issue MEMS Inertial Device, 3rd Edition)
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16 pages, 1568 KB  
Article
Experimental Study on Temperature Compensation for Dual-Axis MEMS Accelerometers Using Adaptive Mode Decomposition and Hybrid Convolutional–Recurrent Temporal Network Modeling
by Yanchao Ren, Guodong Duan and Jingjing Jiao
Micromachines 2025, 16(11), 1284; https://doi.org/10.3390/mi16111284 - 14 Nov 2025
Cited by 1 | Viewed by 2945
Abstract
This paper presents a novel temperature compensation approach for dual-axis Micro–Electro–Mechanical System (MEMS) accelerometers, integrating Adaptive Mode Decomposition (AMD) with Grey Wolf Optimization (GWO) and Hybrid Convolutional–Recurrent Temporal Network (HCR-TN). The proposed method aims to address temperature-induced bias drift, which significantly affects accelerometer [...] Read more.
This paper presents a novel temperature compensation approach for dual-axis Micro–Electro–Mechanical System (MEMS) accelerometers, integrating Adaptive Mode Decomposition (AMD) with Grey Wolf Optimization (GWO) and Hybrid Convolutional–Recurrent Temporal Network (HCR-TN). The proposed method aims to address temperature-induced bias drift, which significantly affects accelerometer performance. Experiments were conducted across a temperature range from −40 °C to +60 °C to evaluate the effectiveness of the compensation algorithm. The results show considerable improvements in bias stability, with the compensation method successfully reducing temperature-induced drift across both axes. Additionally, the algorithm was tested under realistic conditions, including noise and mechanical disturbances, demonstrating its robustness in practical applications. These findings highlight the potential of the proposed method for enhancing the reliability and accuracy of MEMS accelerometers in real-world sensing environments. Full article
(This article belongs to the Special Issue MEMS Inertial Device, 3rd Edition)
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19 pages, 4778 KB  
Article
Design of a Bandgap Reference Circuit for MEMS Integrated Accelerometers
by Wenbo Zhang, Shanshan Wang, Yihang Wang, Qiang Fu, Pengjun Wang and Xiangyu Li
Micromachines 2025, 16(11), 1225; https://doi.org/10.3390/mi16111225 - 28 Oct 2025
Viewed by 2941
Abstract
To meet the requirements of integrated accelerometers for a high-precision reference voltage under wide supply voltage range, high current drive capability, and low power consumption, this paper presents a bandgap reference operational amplifier (op-amp) circuit implemented in CMOS/BiCMOS technology. The proposed design employs [...] Read more.
To meet the requirements of integrated accelerometers for a high-precision reference voltage under wide supply voltage range, high current drive capability, and low power consumption, this paper presents a bandgap reference operational amplifier (op-amp) circuit implemented in CMOS/BiCMOS technology. The proposed design employs a folded-cascode input stage, a push–pull Class-AB output stage, an adaptive output switching mechanism, and a composite frequency compensation scheme. In addition, overcurrent protection and low-frequency noise suppression techniques are incorporated to balance low static power consumption with high load-driving capability. Simulation results show that, under the typical process corner (TT), with VDD = 3 V and T = 25 °C, the op-amp achieves an output swing of 0.2 V~2.8 V, a low-frequency gain of 102~118 dB, a PSRR of 90 dB at 60 Hz, overcurrent protection of ±25 mA, and a phase margin exceeding 48.8° with a 10 μF capacitive load. Across the entire supply voltage range, the static current remains below 150 μA, while maintaining a line regulation better than 150 μV/V and a load regulation better than 150 μV/mA. These results verify the feasibility of achieving both high drive capability and high stability under stringent power constraints, making the proposed design well-suited as a bandgap reference buffer stage for integrated accelerometers, with strong engineering practicality and potential for broad application. Full article
(This article belongs to the Special Issue MEMS Inertial Device, 3rd Edition)
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