Advances in Power Microelectronics and Chips

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: 30 June 2026 | Viewed by 12

Special Issue Editor


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Guest Editor
Chongqing Engineering Laboratory of High Performance Integrated Circuits, School of Microelectronics and Communication Engineering, Chongqing University, Chongqing 400044, China
Interests: semiconductor power devices; power integrated circuits; power chips

Special Issue Information

Dear Colleagues,

Power microelectronics and chips are fundamental to information and energy. Advanced power chips, such as power semiconductor devices and power integrated circuits, are indispensable for modern electronic and electrical systems, facilitating the efficient and flexible utilization of electric energy. The development of power chips cannot proceed without the support of new technologies. In recent years, power chips have seen remarkable progress, with advancements in materials, structures, and applications. This Special Issue aims to publish advances in the theory, design, experiment, modeling, reliability and application of power microelectronics and chips. Original research articles and reviews are welcome. Research areas may include (but are not limited to) the following: silicon-based power devices and power integrated circuits; wide bandgap semiconductor (GaN, SiC, Ga2O3, ZnO, diamond, etc.) power devices and their integration technologies; on-chip power supply; the application, thermal management, monitoring and protection of power chips; and emerging materials with applications in power chips.

I look forward to receiving your contributions.

Dr. Zhi Lin
Guest Editor

Manuscript Submission Information

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Keywords

  • advanced silicon-based power devices
  • advanced wide bandgap semiconductor power devices
  • power integrated circuits
  • power integration technology
  • on-chip power supply
  • emerging materials in power chips

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Published Papers

This special issue is now open for submission.
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