Thin Film Deposition and Characterization in Micro- and Nano-Technology
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: 31 December 2025 | Viewed by 1156
Special Issue Editor
Interests: synchrotron radiation and neutron beam applications; thin films; magnetism
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Thin film deposition is one of the most important processes in micromachining device fabrication, either before or after lithography. These processes include CVD, PVD, spin coating, electroplating, and other coating methods. The structure and quality of the thin film determines the success of these properties in micromachining device application. For example, the nanoscale defect density significantly affects electron transport and optical phenomena in nanoscale devices. In the film deposition, different thin film growth modes can result in more dislocations and grain boundaries, resulting in mechanical failure in the micromachining device. For optical applications, the efficiency of photonic crystal light transport or microwave transport also depends on the pattern perfection of thin film growth. Furthermore, in an electrochemical cell, ion transport depends on the porosity of the morphology and the roughness of the heterojunction. Material characterization needs to be informed by depth profile information. In addition, lateral nanoscale thin film growth is differs entirely from micro-scale thin film. Thin film materials in micromachining devices use nano-probes or nano-focus beams to probe with high-resolution lateral spatial resolution, involving non-conventional material characterization methods such as high-resolution SEM/TEM, nano-focus X-ray, and Raman scatting.
Prof. Dr. Chih-Hao Lee
Guest Editor
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Keywords
- thin film deposition
- thin film characterization
- nanoprobe
- nanotechnology
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