- Article
Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed
- Ramunas Tupciauskas,
- Zigmunds Orlovskis,
- Karlis Trevors Blums,
- Janis Liepins,
- Andris Berzins,
- Gunars Pavlovics and
- Martins Andzs
The present study evaluates the mold fungal resistance of newly developed loose-fill thermal insulation materials made of wheat straw, corn stalk and water reed. Three distinct techniques for the processing of raw materials were used: mechanical crus...

