- Article
In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy
- Kazuhiro Nogita,
- Xin Fu Tan,
- Jiye Zhou,
- Stuart D. McDonald,
- Keith Sweatman,
- Flora Somidin,
- Guang Zeng,
- Hiroshi Maeno,
- Kazuhiro Yasuda and
- Christopher M. Gourlay
For reliable electronics, it is important to have an understanding of solder joint failure mechanisms. However, because of difficulties in real-time atomistic scale analysis during deformation, we still do not fully understand these mechanisms. Here,...

