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Evaluation of Mechanical Properties and Microstructure of Lightweight Alloys

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Metals and Alloys".

Deadline for manuscript submissions: 20 June 2025 | Viewed by 181

Special Issue Editor


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Guest Editor
School of Materials Science and Engineering, Central South University, Changsha 410083, China
Interests: high performance aluminum alloy

Special Issue Information

Dear Colleagues,

Lightweight alloys, which include aluminum, magnesium, and titanium alloys, are celebrated for their low density, high strength, excellent corrosion resistance, and outstanding high-temperature performance. These attributes make them the preferred material across a variety of sectors, such as aerospace, automotive manufacturing, rail transportation, and electronics.

Evaluating the mechanical properties and microstructure of lightweight alloys is essential to guarantee their dependability across a range of applications. Precise testing and analysis facilitate the assessment of key performance indicators, such as yield strength, tensile strength, hardness, toughness, and fatigue resistance. Additionally, microstructural analysis reveals the internal grain structure, phase distribution, and defect conditions of the alloys, providing a deeper insight into their performance and a scientific basis for future material improvements.

This Special Issue aims to establish a platform for the dissemination of cutting-edge research and insights into the advancements within the lightweight alloy domain. These papers will delve into the intricate connections between the processing, composition, and the resulting mechanical behavior and microstructural characteristics.

For this Special Issue, original research articles and reviews are welcome. Research areas may include, but are not limited to, the following:

  • Advanced manufacturing processes such as additive manufacturing and precision casting.
  • The influence of alloying composition and heat treatments on the final microstructure and mechanical properties.
  • The development of novel testing methods for the characterization of lightweight alloys.
  • The integration of computational modeling with experimental data to predict material behavior and optimize alloy design.

We look forward to receiving your contributions.

Dr. Xiaoyan Peng
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • aluminum alloy
  • magnesium alloy
  • titanium alloy
  • alloy composition
  • manufacturing processes
  • heat treatment
  • mechanical properties
  • microstructure
  • fatigue resistance

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Published Papers

This special issue is now open for submission.
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