Advances in 3D Printing Technologies: Design, Manufacturing, and Applications
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".
Deadline for manuscript submissions: 20 March 2026 | Viewed by 57
Special Issue Editors
Interests: 3D printing; digital design; biomedical engineering
Interests: 3D printing; biomaterials; lattice structures
Special Issue Information
Dear Colleagues,
3D printing, also known as additive manufacturing, is a creative and magic manufacturing method to form complex components. 3D printing is a new manufacturing technology developed based on the concept of "discrete-stacking" additive manufacturing. Compared with the subtractive manufacturing, 3D printing has many advantages, including infinite structural design space, infinite material design space, and powerful complex structural manufacturing capabilities. Common materials for 3D printing include metal, resin, ceramic, and composite. Common processes for 3D printing include Powder Bed Fusion (PBF), Direct Energy Deposition (DED), Stereolithography (SLA), Digital Light Processing (DLP), Fused Deposition Modelling (FDM), etc.
The Special Issue called “Advances in 3D Printing Technologies: Design, Manufacturing, and Applications” offers a platform for researchers to share the cutting-edge research. The Special Issue covers all aspects of 3D printing technology, especially serving for mechanical engineering and biomedical engineering, including design and simulation for 3D printing, materials and processes for 3D printing, quality and detection for 3D printing, etc.
Dr. Chenchen Tian
Dr. Yi Lu
Prof. Dr. Quanquan Han
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- 3D printing
- additive manufacturing
- design and optimization
- modeling and simulation
- material and process
- quality and detection
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.
Further information on MDPI's Special Issue policies can be found here.
