Advancements in the functionalities and operating frequencies of integrated circuits (IC) have led to the necessity of measuring their electromagnetic Interference (EMI). Three-dimensional integrated circuit (3D-IC) represents the current advancement...
For the purpose of the sustainable development in the global semiconductor industry, emerging three-dimensional integrated circuit (3DIC) integration technologies have demonstrated their importance as potential candidates for extending the lifespan o...
In this paper, the poly-Si nanowire (NW) field-effect transistor (FET) sensor arrays were fabricated by adopting low-temperature annealing (600 °C/30 s) and feasible spacer image transfer (SIT) processes for future monolithic three-dimensional in...
The use of vertically stacked architectures in three-dimensional integrated circuits (3DICs) offers a transformative path for advancing Moore’s Law by significantly boosting computational density. A key obstacle arises from the integration of h...
The problem of thermal modeling of modern three-dimensional (3D) integrated circuit (IC) systems in packages (SiPs) is discussed. An effective quasi-3D (Q3D) approach of thermal design is proposed taking into account the specific character of 3D IC s...
We introduce a single-grain gate-all-around (GAA) Si nanowire (NW) FET using the location-controlled-grain technique and several innovative low-thermal budget processes, including green nanosecond laser crystallization, far-infrared laser annealing,...
Densely integrated microarchitectures spanning three-dimensional integrated circuits (3D-ICs), chiplet-based designs, and system-in-package (SiP) assemblies make heat a first-order security concern rather than a mere reliability issue. This review co...
three-dimensional integrated circuit (3D-IC) structure with a significant scale mismatch causes difficulty in analytic model construction. This paper proposes a simulation technique to introduce an equivalent material composed of microbumps and their...
Field-Programmable Gate Array System-on-Chip (FPGA-SoC) platforms are increasingly adopted in modern industrial Cyber-Physical Systems (CPSs), enabling real-time control, monitoring, and automation of critical industrial processes. The increasing int...