The multiple reflows process is widely used in 3D packaging in the field of electronic packaging. The growth behavior of interfacial intermetallic compound (IMC) is more important to the reliability of solder joints. In this paper, experimental measu...
A rework of electronic assemblies and the reuse of electronic components are the most effective ways to reduce electronic waste. Since neither components nor substrates were developed with the intention of multiple usage, the question of how the inte...
In this study, the interfacial reactions and mechanical properties of solder joints after multiple reflows were observed to evaluate the applicability of the developed materials for high-temperature soldering for automotive electronic components. The...
Solder interconnection in three-dimensional (3D) electronic packaging is required to undergo multiple reflow cycles of the soldering process. This paper elucidates the effects of multiple reflow cycles on the solder joints of Sn-3.0Ag-0.5Cu (SAC305)...
The growth and formation of primary intermetallics formed in Sn-3.5Ag soldered on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish after multiple reflows were systematically investigated....
The formation of high-melting-point Cu6Sn5 interconnections is crucial to overcome the collapse of Sn-based micro-bumps and to produce reliable intermetallic interconnections in three-dimensional (3D) packages. However, because of multiple reflows in...
In order to present the multiple reflow process during electronic packaging, the influence of the different short-time reheating temperatures on the microstructure and shear strength of the Cu/Au80Sn20/Cu solder joints was studied and discussed. The...
Under the dual impetus of environmental regulations and reliability requirements, the Pb–free/Pb hybrid assembly process in aerospace-grade ball grid array (BGA) components has become an unavoidable industrial imperative. However, constrained p...
The no-reflow phenomenon following primary percutaneous coronary intervention (PPCI) in acute ST-elevation myocardial infarction (STEMI) patients is a predictor of unfavorable prognosis. Patients with no-reflow have many complications during admissio...
Thermoplastic polymer micro- and nanostructures suffer pattern decay when heated to a temperature close to or above the polymer’s glass transition temperature. In this work, we report enhanced thermal stability of polycarbonate nanostructures a...
Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/...
Background/Objectives: Acute myocardial infarction is accompanied by thromboinflammation, immune-cell redistribution and changes in nutritional reserve. We compared six routinely calculable indices under a common modelling strategy in patients with S...
As a vital component of electronic products, the quality of the printed circuit board (PCB) assembly directly affects the applications and service life. During the reflow soldering process, the PCB assembly may suffer excessive warpage. Therefore, in...
Taking advantage of good hermeticity, tiny parasitic capacitance, batch mode fabrication, and compatibility with multiple bonding techniques, the glass-silicon composite substrate manufactured by the glass reflow process has great potential to achiev...
Background: The COVID-19 pandemic is significantly affecting the functioning of the entire healthcare system. The disease itself may be associated with thromboembolic complications. The purpose of this study is to compare patients with acute coronary...
Mesoporous Al/MCM-41 was synthesized by extracting silicon carbide sludge and granite sludge as the sources of silicon and aluminum. Different concentrations of aminosilane (2.5, 5, 7.5 vol.%) were used to reflux the grafted NH2-Al/MCM-41 with amine...
The use of saphenous vein grafts (SVGs) in the surgical management of obstructive coronary artery disease remains high despite a growing understanding of their limitations in longevity. In contemporary practice, approximately 95% of patients receive...
This review summarizes the base materials, joining methods, filler materials, and principal technical challenges in endoscope joining fabrication, and proposes practical strategies to improve joint reliability under clinical constraints. We conducted...