Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints strength,...
We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The ov...
Electromigration (EM) is a critical reliability concern in electronic solder joints due to increasing current densities in modern electronic packaging. EM-induced failures often manifest as void formation and microstructural degradation, particularly...
Electromigration (EM) presents a major reliability challenge in advanced electronic packaging as device scaling and rising power demands lead to higher current densities in solder joints. While eutectic Sn-58Bi solder is widely adopted as a low-tempe...
Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circ...
This study presents a comprehensive investigation of the micro-wetting behavior of SAC305 and SnBi58 solders on chip components. Micro-wetting balance tests, which employ small solder globules, enable direct evaluation of solder wettability on miniat...
Sn-58Bi eutectic solder is the most recommended low temperature Pb-free solder but is also limited from the interfacial embrittlement of Bi segregation. Since the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides a similar melting point as Sn-58Bi eutec...
In this study, we investigated the microstructure, mechanical properties, and thermal performance of Sn-xBi-1Ag (x = 35, 37, 45, and 47 wt.%) solders, with a particular focus on the effect of adding trace Si atoms. The impact of different Ag concentr...
The Bi-Sn, Bi-Sn-Ag, and Bi-Sn-Sb solder alloy systems represent lead-free, environmentally friendly alternatives for reliable electronic assembly. These alloys comply with increasingly strict environmental and health regulations, while offering low...
With the widespread application of lead-free solder, solder represented by the SAC series has been widely used. However, with the miniaturization and multifunctionalization of electronic devices, the distance between solder joints is becoming increas...
Sn-58Bi solder has been widely used for microelectronics packaging due to its low melting point temperature, good wetting performance, good mechanical properties, and low cost. Compared with Sn-Bi solder alloy and Sn-Pb solder alloy, the strength and...
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system...
Sn-10Bi low-bismuth-content solder alloy provides a potential alternative to the currently used Sn-Ag-Cu series due to its lower cost, excellent ductility, and strengthening resulting from the Bi solid solution and precipitation. This study primarily...
Excessive growth of intermetallic compounds (IMCs) during service affects the reliability of solder joints, so how to suppress the growth of IMC thickness at the interface in solder joints becomes a widespread concern. In this work, the interfacial r...
This study systematically investigates the influence of Bi content on the electromigration (EM) lifetime of low-temperature Cu/Sn-xBi-1Ag (600 μm)/Cu interconnects, where x = 57, 47 and 40 wt.%. The intrinsically higher product of diffusivity and...
The Sn–Bi solder paste is commonly used in electronic assembly and packaging, but its brittleness causes poor reliability in shock environments. In this study, the mechanical reliability of Sn–Bi solder paste and Sn–Bi composite sol...
Properties such as lower melting temperature, good tensile strength, good reliability, and well creep resistance, together with low production cost, make the system Bi-Sn an ideal candidate for fine soldering in applications such as reballing or refl...
Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compa...
The application of Sn-Bi series solder is limited due to the brittleness of Bi phase. Sn-20Bi solder with less Bi element content has great research prospects, but it needs modification to make it a substitute for traditional Sn-Pb solder. In this ar...
This study aimed to investigate the effects of the addition of Bi and Zn on the mechanical properties of Sn-Ag-Cu lead-free alloy frequently used as a soldering material in the semiconductor packaging process. To reduce the Ag content of the commerci...
Although there are studies devoted to lower Indium (In) addition, Sn-Bi alloys containing 10 wt.% In or more have been barely investigated so far. Higher In contents may offer the potential for improved joint production, better control over the growt...
With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl part...
The development of Ag-free Sn solders has attracted significant attention due to the requirement of high-density electronic packaging. In this study, we investigate the Ni element on the microstructures and mechanical properties of Ag-free Sn-Cu-Bi-I...
To analyze the reinforcement effect of adding polymer to solder paste, epoxies were mixed with two currently available Sn-3.0Ag-0.5Cu (wt.% SAC305) and Sn-59Bi (wt.%) solder pastes and specimens prepared by bonding chip resistors to a printed circuit...
A Sn58Bi composite solder reinforced by Ni nanoparticles was prepared using a mechanical mixing technique, and the thermomigration microstructure and properties of the solder joints were studied. The findings indicate that incorporating an appropriat...
In this experiment, a Sn35Bi0.3Ag–xIn (x = 0, 0.5, 1.0, 1.5) alloy solder was prepared by electromagnetic induction heating furnace. The effects of In on the thermodynamic properties, wettability, interface microstructure, and soldering perform...
With the continuous reduction of chip size, fluxless soldering has brought attention to high-density, three-dimensional packaging. Although fluxless soldering technology with formic acid (FA) atmosphere has been presented, few studies have examined t...
This study proposes a Sn58Bi/SAC305 layered composite solder designed for low-temperature applications. By alternating high-melting SAC305 and low-melting Sn58Bi layers, the composite achieves a liquidus temperature of ~180 °C, comparable to trad...
With the development of electronic packaging technology toward miniaturization, integration, and high reliability, the diameter and pitch of solder joints continue to shrink. Adjacent solder joints are highly susceptible to electrochemical migration...
Sn–Sb system solders and ENIG/ENEPIG surface finish layers are commonly used in electronic products. To illustrate the thermal reliability evaluation of such solder joints, we studied the interfacial microstructure and shear properties of Sn-4....
Electromigration is one of the most important research issues affecting the reliability of solder joints. Current-induced Joule heating affects the electromigration behavior of solder joints. Solder joints with different cross-sectional areas were de...
In this study, intense pulsed light (IPL) soldering was employed on Sn-58Bi solder pastes with two distinct particle sizes (T3: 25–45 μm and T9: 1–8 μm) to investigate the correlation between the solder microstructure and mechanical...
Compression creep tests were performed on the ternary 91.84Sn-3.33Ag-4.83Bi (wt.%, abbreviated Sn-Ag-Bi) Pb-free alloy. The test temperatures were: −25 °C, 25 °C, 75 °C, 125 °C, and 160 °C (± 0.5 °C). Four loads were used at the two lowest temperatur...
Graphene nanosheets (GNSs) have an extensive application in materials modification. In this study, the effects of graphene nanosheets on the wettability of Sn-20Bi lead-free solder on copper (Cu) substrate and the growth behavior of intermetallic com...
Low-temperature lead (Pb)-free solders are demanding in the electronic packaging industry, because it would open the door for various economic choices of polymeric materials as substrates and also revives the lower cost processes. Here, we proposed a...
Characterized by its low melting temperature of 138 °C, the eutectic Sn-58Bi solder expands the melting temperature range of interconnect joints in electronic packaging, making it widely used in multi-level packaging processes. However, its relia...
Sn–Bi-based, low-temperature solder alloys are being developed to offer the electronics manufacturing industry a path to lower temperature processes. A critical challenge is the significant microstructural and lattice parameter changes that the...
The tensile behavior of Sn–Bi–Cu and Sn–Bi–Ni alloys has been widely investigated. Reportedly, the addition of small amounts of a third element can refine the microstructures of the eutectic Sn-58mass% Bi solder and improve it...
Due to the continuous miniaturization and high current-carrying demands in the field of integrated circuits, as well as the desire to save space and improve computational capabilities, there is a constant drive to reduce the size of integrated circui...
The purpose of this work is to explore the impact of 0.5, 1.5, 2.5 and 3.5 wt.% Bi additions on the microstructure and mechanical performance of Sn-1Ag-0.5Cu solder alloy. Scanning electron microscope (SEM) and X-ray diffraction (XRD) were utilized t...
As electronic packaging technology advances towards miniaturization and integration, the issue of electromigration (EM) in lead-free solder joints has become a significant factor affecting solder joint reliability. In this study, a Sn-3.0Ag-0.5Cu (SA...
This manuscript reports the isothermal annealing effect on the mechanical and microstructure characteristics of Sn-0.7Cu-1.5Bi solder joints. A detailed microstructure observation was carried out, including measuring the activation energy of the inte...
Bi-doped Sn–Ag–Cu (SAC) microelectronic solder is gaining attention for its utility as a material for solder joints that connect substrates to printed circuit boards (PCB) in future advanced packages, as Bi-doped SAC is reported to have a...
Ag microalloyed Sn58Bi has been investigated in this study as a Pb-free solder candidate to be used in modern electronics industry in order to cope with the increasing demands for low temperature soldering. Microstructural and mechanical properties o...
During operation, electronic components are exposed to high temperatures that may last for long periods, depending on the operating duration. Solder joints are one of the components most affected by thermal aging while in service. In this research, t...
This study investigated the interfacial reactions between n-type Bi2(Te,Se)3 thermoelectric material, characterized by a highly-oriented (110) plane, and pure Sn and Sn-3.0Ag-0.5Cu (wt.%) solders, respectively. At 250 °C, the liquid-state Sn/Bi2(...
With the rapid development of the advanced electronic packaging field, the requirements for the connection between solder and Cu substrate are becoming increasingly stringent. Currently, the commonly used Ni-P diffusion barrier layer in the industry...
This work provides an analysis of X-ray micro computed tomography data of Sn-xBi solders with x = 20, 30, 35, 47, 58 wt.% Bi. The eutectic thickness, fraction of eutectic and primary phase are analyzed. Furthermore, the 3D data is evaluated by means...
The application of Sn-0.7Cu-based composite solder in electronic packaging is limited due to its high melting point, poor wettability and low mechanical properties. Herein, we propose a strategy of adding Bi and Cr to improve the solderability of Sn-...
The 42 wt.% Sn–58 wt.% Bi (Sn-58Bi) Ball Grid Array (BGA) solder balls were mounted to electroless nickel-electroless palladium-immersion gold (ENEPIG) pads by employing the reflow process profile. The effects of reflow cycles and aging time on...
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